An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

A transducer apparatus comprises a deformation body as well as, positioned on the deformation body and connected therewith by material bonding, a radio sensor having a surface facing away from the deformation body. The radio sensor is adapted to receive free-space electromagnetic waves and to convert them into acoustic surface waves propagating along the surface facing away from the deformation body, or to convert acoustic surface waves propagating along the surface into free-space electromagnetic waves. Additionally, the deformation body is adapted as a function of a mechanical force acting thereon, and/or as a function of a temperature change, to be at least partially deformed, in such a manner that at least the surface of the radio sensor facing away from the deformation body experiences a shape change influencing a propagation of acoustic surface waves propagating along the surface. A measuring system formed by means of such a transducer apparatus comprises additionally a measuring electronics electrically coupled with the transducer apparatus and adapted to generate at least one electrical driver signal feeding and/or activating the transducer apparatus and to couple such into the transducer apparatus, and to receive and to evaluate a measurement signal delivered from the transducer apparatus.

Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

There are disclosed pressure-sensitive acoustic resonators and remote pressure sensing systems and methods. A pressure-sensitive acoustic resonator includes a conductor pattern formed on a planar surface of a dielectric substrate, the conductor pattern including an interdigital transducer (ICP), and a diaphragm, the diaphragm being a portion of a plate of single-crystal piezoelectric material, the diaphragm having a front surface exposed to an environment and a back surface facing, but not contacting, the ICP.

The invention relates to a sensor and a system for measuring pressure, variation in sound pressure, a magnetic field, acceleration, vibration, or the composition of a gas. The sensor comprises an ultrasound transmitter, a cavity, and a passive sensor element. In accordance with the invention the sensor includes antenna means for receiving radio frequency signals (f1, f2), and connecting means connecting the antenna to the ultrasound transmitter for using the radio frequency signals for providing energy for driving the ultrasound transmitter.

In accordance with an embodiment, a MEMS sensor includes a membrane that is suspended from the substrate, a resonant frequency of said membrane being influenced by an ambient pressure that acts on the membrane; and an evaluation device configured to perform a first measurement based on the resonant frequency of the membrane to obtain a measurement result, where the evaluation device is configured to at least partly compensate an influence of the ambient pressure on the measurement result.

In a method to measure changes of the pair of differential transmission lines, an in-phase signal is generated by combining first and second signals transmitted through the pair of differential transmission lines, a phase of the second signal being opposite to the first signal. In a transmission line diagnostic device, a signal combiner extracts the first and second signals received by a communication unit, combines the extracted those signals, and generates an in-phase signal, a detector detects the generated in-phase signal, and a determination unit determines an error when a magnitude of the detected in-phase signal is equal to or greater than a threshold value. In a liquid level detection device, a combining unit combines the first and second signals and generate an in-phase signal, a detection unit detects a voltage of the generated in-phase signal, and a calculation unit calculates a liquid level from the detected voltage.

An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.