G01L9/0052

Differential pressure sensor and method of using the same

Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

OIL SEPARATOR FOR REDUCING RESIDUE DEPOSITS
20170326487 · 2017-11-16 ·

A pressure sensor includes a pressure sensing-element in fluid communication with a port and an oil separator in the port. The oil separator is configured to reduce an amount of oil-vapor residue that reaches the pressure sensing element by elongating a path of fluid from an opening of the port to the pressure sensing element and by creating additional surface area within the port upon which oil-vapor residue -may be deposited. There is also a cover, which has holes, and that is configured to prevent the oil separator from felling out of the port. The oil separator may include circular discs having cut-out portions. The cut-out portions on adjacent circular discs may he rotated relative to one another about a longitudinal axis of the oil separator. The cut-out portions may have a semi-circular shape.

DEVICE FOR MEASURING AN OPERATING VARIABLE OF A TYRE

The invention relates to a device for measuring an operating variable, to be fitted onto a tyre, comprising: an electronic circuit distributed over a first face of an electronic board and comprising a sensor; a protective housing at least partially covering the electronic circuit; and at least one first antenna wire having one end galvanically connected to the electronic circuit and integrally extending so as to project laterally from the housing;

According to the invention, the housing comprises a lateral portion which projects substantially tangentially to a proximal end portion of the first wire in accordance with the generatrix of said first wire.

PRESSURE SENSOR FOR MEASURING A PRESSURE OF A FLUID MEDIUM

A pressure sensor for measuring a pressure of a fluid medium in a measuring chamber is provided. The pressure sensor includes a sensor housing, a first pressure-sensor module for measuring at least one first pressure of the medium in a first measuring chamber, and a second pressure-sensor module for measuring at least one second pressure of the medium in a second measuring chamber. The first pressure-sensor module and the second pressure-sensor module are situated inside the sensor housing. In addition, the pressure sensor has at least one first pressure connection, which is designed for the connection to the first measuring chamber. Moreover, the pressure sensor has at least one second pressure connection, which is developed for the connection to the second measuring chamber. The first pressure connection differs from the second pressure connection.

SYSTEM AND METHODS FOR A MULTI-FUNCTION PRESSURE DEVICE USING PIEZOELECTRIC SENSORS
20220057284 · 2022-02-24 ·

A pressure measuring device configured as a multi-function device operable as a differential pressure switch (DPS), a differential pressure transducer (DPT), a pressure switch (PS), a pressure transducer (PT) providing readings of high and low pressure zones, a data recording logger, and a backwashing controller. The pressure measuring device may use at least two piezoelectric sensors operable to measure pressure attributes. The associated electronic hardware, processing unit, cables and pressure tubing are retrofittable and packaged in a molded case, with no moving parts with the electronic hardware fully coated to make the device reliable and resistant to extreme environmental conditions. The device is configured for remote access, enabling remote device configuration, maintenance and servicing. The device is further operable to communicate with various external devices: a tablet, a smartphone and the like as a user interface and further provides wired interface with a programmable logic controller (PLC) via RS-485 interface.

Integrated pressure sensor with double measuring scale, pressure measuring device including the integrated pressure sensor, braking system, and method of measuring a pressure using the integrated pressure sensor

A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.

Pressure gauge chip and manufacturing process thereof

The present invention is related to a sensor. In particular, the present invention is related to a pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a pressure sensor die is provided. The pressure sensor die is uniformly compressed by the external pressure to be measured and can deform freely inside the chamber. The pressure sensor die is primarily constructed of single crystalline silicon and comprises a substrate and a cap connected together. A recess is formed on the cap. The recess forms a sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. The substrate further comprises a plurality of piezoresistive sensing elements which are located inside the sealed cavity. The present pressure sensor is more immune to temperature effects. It is especially suitable for operating in a high temperature, high pressure environment and is capable of delivering accurate and reliable pressure measurements at low cost.

Absolute and differential pressure sensors and related methods

Implementations of absolute pressure sensor devices may include a microelectromechanical system (MEMS) absolute pressure sensor coupled over a controller die. The MEMS absolute pressure sensor may be mechanically coupled to the controller die and may also be configured to electrically couple with the controller die. A perimeter of the controller die may be one of the same size and larger than a perimeter of the MEMS absolute pressure sensor. The controller die may be configured to electrically couple with a module through an electrical connector.

CMOS and pressure sensor integrated on a chip and fabrication method
09790082 · 2017-10-17 · ·

A device comprises a silicon-on-insulator (SOI) substrate having first and second silicon layers with an insulator layer interposed between them. A structural layer, having a first conductivity type, is formed on the first silicon layer. A well region, having a second conductivity type opposite from the first conductivity type, is formed in the structural layer, and resistors are diffused in the well region. A metallization structure is formed over the well region and the resistors. A first cavity extends through the metallization structure overlying the well region and a second cavity extends through the second silicon layer, with the second cavity stopping at one of the first silicon layer and the insulator layer. The well region interposed between the first and second cavities defines a diaphragm of a pressure sensor. An integrated circuit and the pressure sensor can be fabricated concurrently on the SOI substrate using a CMOS fabrication process.

PROCESS FOR MANUFACTURING A MEMS PRESSURE SENSOR, AND CORRESPONDING MEMS PRESSURE SENSOR
20170284882 · 2017-10-05 ·

A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate region made of conductive material, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate region, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.