According to an example aspect of the present invention, there is provided a MEMS pressure sensor, comprising: a sensor portion comprising a deformable membrane and a first volume, and a valve portion comprising a first output to a first side of the pressure sensor and a second output to a second side of the pressure sensor. The valve portion is operable to close the second output and open the first output to equalize pressure in the first volume with pressure at the first side of the pressure sensor for calibrating the sensor; and close the first output and open the second output to equalize pressure in the first volume with pressure at the second side of the pressure sensor for pressure measurement.

A method, device and system for a gage pressure transducer including the making thereof are provided. In one embodiment, a method includes receiving, at a first diaphragm, a first pressure, wherein the first diaphragm is composed of metal; transferring, from the first diaphragm, to a first sensor, the first pressure using a first oil region, wherein the first oil region is disposed between the first diaphragm and the first sensor; receiving, at the first sensor, the first pressure; measuring, by the first sensor, the first pressure to generate a first pressure signal; and outputting, from the first sensor, to a first header pin, the first pressure signal, wherein the first header pin is electrically coupled to the first sensor using a first conductive glass frit.

Systems and methods are disclosed herein for selectively configuring an impedance of a transducer. A configurable transducer system is provided that can include a first region configured for receiving an applied stress and one or more sensing branches in communication with the first region. Each sensing branch can include an active piezoresistive area; three or more conduction paths configured in electrical communication with the active piezoresistive area; one or more trimmable links configured in parallel communication with at least two of the three or more conduction paths; and two or more connection terminals in electrical communication with the three or more conduction paths. The trimmable links are configured to be selectively opened to set a value of nominal impedance associated with the active piezoresistive area based on a desired impedance of the configurable transducer.

A pressure sensor includes an SOI substrate which has a first silicon layer, a second silicon layer placed on one side of the first silicon layer, and a silicon oxide layer placed between the first and second silicon layers, and a concave section which opens to the surface on the first silicon layer side of the SOI substrate, wherein in a plan view of the SOI substrate, a portion overlapping the concave section of the SOI substrate becomes a diaphragm which is flexurally deformed by receiving a pressure, and the second silicon layer is exposed on the bottom surface of the concave section.

An electronic device with a force sensing device is disclosed. The electronic device comprises a user input surface defining an exterior surface of the electronic device, a first capacitive sensing element, and a second capacitive sensing element capacitively coupled to the first capacitive sensing element. The electronic device also comprises a first spacing layer between the first and second capacitive sensing elements, and a second spacing layer between the first and second capacitive sensing elements. The first and second spacing layers have different compositions. The electronic device also comprises sensing circuitry coupled to the first and second capacitive sensing elements configured to determine an amount of applied force on the user input surface. The first spacing layer is configured to collapse if the applied force is below a force threshold, and the second spacing layer is configured to collapse if the applied force is above the force threshold.

The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.

Exemplary embodiments of the present invention provide a differential pressure transducer that comprises first and second diaphragms of different configurations, i.e., different diameters and/or thicknesses. The pressure transducer provides more versatility over prior art designs as the diaphragms can be of different configurations yet still maintain substantially similar back pressures. Therefore, the errors commonly associated with back pressures are eliminated because the back pressures from the diaphragms ultimately cancel out in the sensor's differential pressure measurement.

Provided are a MEMS pressure sensor and a method for forming the MEMS pressure sensor. The method includes: preparing a first substrate, where the first substrate includes a first surface and a second surface opposite to the first surface; preparing a second substrate, where the second substrate includes a third surface and a fourth surface opposite to the third surface, the second substrate includes a pressure sensing region; bonding the first surface of the first substrate and the third surface of the second substrate with each other; forming a cavity between the first substrate and the pressure sensing region of the second substrate; removing the second base to form a fifth surface opposite to the third surface of the second substrate; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer.

A pressure sensor comprising a housing, a diaphragm wafer, and an isolator configured to absorb lateral stress. The diaphragm wafer includes a fully exposed diaphragm, a fluid contact surface, a sensing element, and a support portion, where the support portion and the contact surface define a cavity. The isolator extends laterally from the support portion to the housing. The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.

A flexible sensor for monitoring operating parameters, including pressure and temperature, of a flexible structure, such as a tire, provides electrodes and an active area that are formed of flexible materials. In particular, the active area may be formed from an elastomeric piezoresistive material, such as an ionic liquid-polymer. The flexible properties of the sensor allow it to be readily incorporated into the body of a tire during manufacture. This allows the operating parameters of the tire to be monitored, such as in real-time, while the tire is in operation. Furthermore, the sensor is formed of materials that allow the sensor to be formed using additive manufacturing techniques, such as 3D (three-dimensional) printing. As such, the sensor may be 3D printed together with another structure, such as a tire tread, so that the sensor is integrated therein.