A method for operating a group of pressure sensors is provided. First and second pressure sensors respectively have first and second pressure measurement ranges, and are arranged to measure the pressure in a common measurement volume, and have measurement ranges that overlap in a range. The method comprises: aa) reading out first and second measurement signals respectively from the first and second pressure sensors substantially simultaneously while the pressure in the common measurement volume is in the overlapping range; bb) stipulating the first measurement signal which has been read out as the adjustment point for the second pressure sensor; cc) determining at least one calibration parameter, in particular a gas-dependent calibration parameter, for the second pressure sensor as a function of the first measurement signal, as a function of the adjustment point for the second pressure sensor, as stipulated in bb), and as a function of the second measurement signal.

The invention relates to various means for implementing a method for compensating measured values in capacitive pressure measuring cells using a measuring capacity and at least one reference capacity, comprising the following steps: determination of a pressure-induced capacitance change of the reference capacitance as a function of a pressure-induced capacitance change of the measuring capacitance, determination of a thermal shock-induced capacitance change of the reference capacitance as a function of a thermal shock-induced capacitance change of the measuring capacitance, measurement of the measuring capacitance and of the at least one reference capacitance, determination of the thermal shock-induced capacitance change of the measuring capacitance from a combination of the above dependencies, compensation of the measured measuring capacitance by the thermal shock induced capacitance change of the measuring capacitance, and determination and output of the pressure-induced capacitance change or a quantity derived therefrom.

A pressure sensor assembly includes a pressure sensor having a support structure and a sapphire isolation member coupled to the support structure and forming a region between a first surface of the sapphire isolation member and the support structure. A second surface of the sapphire isolation member has a sapphire etch surface formed thereon and is positioned to interface with fluid from or coupled to a process. A process seal is positioned against the second surface of the sapphire isolation member to prevent fluid from passing by the pressure sensor assembly. Electrical leads couple to a polysilicon strain gauge pattern positioned in the region on the first surface of the sapphire isolation member, and the polysilicon strain gauge pattern is configured to generate electrical signals indicative of the pressure of the fluid when the sapphire isolation member deflects responsive to the pressure.

Shaped body, in particular for a pressure sensor, having a membrane and having a supporting section supporting the membrane, the membrane being produced at least in sections from a ceramic material by means of additive manufacturing, in particular 3D screen printing, and having at least in sections a thickness of less than 0.5 mm.

A pressure sensor assembly includes a pressure sensor having a support structure and a sapphire isolation member coupled to the support structure and forming a region between a first surface of the sapphire isolation member and the support structure. A second surface of the sapphire isolation member is positioned to interface with fluid from or coupled to a process. Electrical leads couple to a polysilicon strain gauge pattern positioned in the region on the first surface of the sapphire isolation member, and the polysilicon strain gauge pattern is configured to generate electrical signals indicative of the pressure of the fluid when the sapphire isolation member deflects responsive to the pressure.

The present disclosure relates to a method for manufacturing a pressure sensor having a main body and a pressure-sensitive ceramic measurement membrane, wherein an outer edge of the measurement membrane is connected in a pressure-tight manner by an encircling joint to a surface of the main body facing the outer edge of the measurement membrane, wherein the joint includes a ternary active hard solder in eutectic composition: providing the main body, the measurement membrane and the active hard solder; positioning the active hard solder between the outer edge of the measurement membrane and the surface of the main body; heating the main body, the measurement membrane and the active hard solder to a joining temperature which essentially corresponds to a temperature of the eutectic point of the active hard solder.

A pressure measuring device includes a ceramic pressure sensor including a ceramic measuring membrane and a sensor mounting configured to secure the pressure sensor such that a membrane region of the measuring membrane surrounded by a membrane edge is contactable with a medium having a pressure to be measured. The sensor mounting includes a titanium or titanium alloy mounting element including an opening through which the membrane region is contactable with the medium. The membrane edge is connected directly with the mounting element by a diffusion weld produced by a diffusion welding method.

Various embodiments include a capacitive pressure transducer for measuring the pressure of a medium adjacent to the transducer comprising: a measurement diaphragm including a first surface in contact with the medium and a second surface facing away from the medium; a measurement electrode integrated with the measurement diaphragm; a base body arranged opposite the second surface, the base body comprising a counter electrode forming a measurement capacitance with the measurement electrode; and an electrically insulating chamber bounded by the base body and the measurement diaphragm. The counter electrode is in contact with the electrically insulating chamber. At least one of the measurement electrode or the counter electrode comprises a meandering pattern layer in direct contact with the electrically insulating chamber.

A pressure-sensitive chip, a pressure sensor, and a pressure monitoring system. In an embodiment, a pressure-sensitive chip and a signal processing module are packaged to form a pressure sensor. The pressure sensor and a display instrument are connected to form a pressure monitoring system. A pressure-sensitive chip is a ceramic body made of eight green ceramic sheets by stacking and sintering, and includes two capacitors. In another embodiment, a pressure signal of a measurement area is obtained by a method including the following steps: sensing a pressure in a measurement area by the pressure-sensitive chip; generating a capacitance signal by the pressure-sensitive chip; converting the capacitance signal to a voltage signal by the signal processing module; and converting the voltage signal into the pressure signal by the display instrument.

A pressure measuring device comprises a capacitive pressure measuring cell, a process connector including a retaining element, a housing mounted on the process connector, and a sealing element arranged between an inwardly projecting region of the retaining element and the pressure measuring cell. The retaining element is configured with a cap with a base area portion and an outer area portion bent over with respect thereto and fitted over an end face of the process connector. The retaining element is in a material-bonded and/or form-fit manner connected to the process connector exclusively in the bent-over outer area portion so that the base area portion assumes a resilient property.