According to an embodiment of the inventive concept, a pressure sensor package may be disposed in an inner space of an electronic device. The pressure sensor package may include a substrate in which a hole is defined, a pressure sensor disposed on one surface of the substrate to cover the hole and including a membrane, and an insulator disposed on the pressure sensor to cover at least a portion of the membrane. The pressure sensor may be disposed to detect a first pressure of the inner space of the electronic device, which is caused by air flowing through the hole, and a second pressure caused by an external force applied to the electronic device through the insulator.

A sensor assembly includes a substrate having a first outer surface and a second outer surface opposite the first outer surface, a first die attached to the first outer surface and having a first diaphragm, a second die attached to the second outer surface and having a second diaphragm, and a full-bridge pressure sensor including a plurality of piezoresistive elements. A first subset of at least two of the plurality of piezoresistive elements is disposed on the first diaphragm and a second subset of at least two of the plurality of piezoresistive elements is disposed on the second diaphragm.

A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.

A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.

A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.

A pressure sensor includes a substrate which has a diaphragm that is flexurally deformed by receiving a pressure, a side wall section which is placed on one surface side of the substrate and surrounds the diaphragm in a plan view, and a sealing layer which is placed so as to face the diaphragm through a space and seals the space, wherein the sealing layer includes a first silicon layer which has a through-hole facing the space, a silicon oxide layer which is located on the opposite side to the space with respect to the first silicon layer and seals the through-hole, and a second silicon layer which is located on the opposite side to the space with respect to the silicon oxide layer.

A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.

A sensor package includes a pressure sensor, a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor, a lead frame through which a result of computation performed by the computation unit is output to an outside, a main housing that is formed of resin and that holds the lead frame, and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed. The pressure sensor is disposed in the main housing using the sensor housing.

Methods of determining fluid density within a tank, such as an aircraft tank are include installing one or more clusters of sensors each cluster comprising a plurality of sensors including at least one pressure sensor. A minimum of two pressure measurements are required for density estimation. The fluid density between different clusters may be determined from pressure measurements obtained by each cluster and the distance between the clusters. Furthermore, the distribution of density throughout the tank may be determined by employing clusters including two or more pressure sensors.

A sensor has a sensor body with a first face and a second face opposite to one another, and a circuit arrangement supported by the sensor body that includes a first electrical circuit pattern on the first face, a second electrical circuit pattern on the second face, connection means, which electrically connect the first circuit pattern to the second circuit pattern and has at least one through hole that extends axially between the two faces of the sensor body. A plurality of terminals are electrically connected to the first circuit pattern and/or the second circuit pattern. The at least one through hole is preferably closed at the second face of the sensor body via a closing member (30) having pre-formed body with a closing portion having a diameter, greater than a diameter, of the opening of the through hole at the second face of the sensor body.