An apparatus including a first linear contact, a second linear contact and a support contact. The first linear contact and the second linear contact may each be connected to corresponding electrical terminals. The support contact may be connected to a housing. The first linear contact and the second linear contact may each provide an electrical connection between corresponding sensor contacts and the corresponding electrical terminals. The first linear contact, the second linear contact and the support contact may be arranged to create a support plane for a sensor package. The first linear contact and the second linear contact may each provide support for the sensor package along a linear peak. The apparatus may enable a secure compression fit of the sensor package within the housing.

Provided is a pressure sensor apparatus including a lead frame, a pressure sensing element mounted on the lead frame to measure a relative pressure between a first part and a second part, and a housing including a reference medium inlet hole to apply a pressure of a reference medium to the first part, and including a target medium inlet hole to apply a pressure of a target medium to the second part, wherein the reference medium inlet hole is provided in a first surface of the housing, wherein the target medium inlet hole is provided in a second surface of the housing other than the first surface, and wherein the lead frame includes one or more insertion terminals configured to be inserted into and electrically connected to terminal holes of a wire connector.

A capacitive sensor includes a sensor body having a cavity. The sensor body is non-electrically conductive. The sensor also includes a first diaphragm having a metallic conductor layer. The first diaphragm is arranged on the sensor body on a first side of the cavity. The sensor further includes a second diaphragm having a metallic conductor layer. The second diaphragm is arranged on the sensor body on a second side of the cavity. An air gap is formed in the cavity between the first and second diaphragms, the air gap having a height equal to a height of the sensor body.

An omni-directional anemometer may include a housing, a cavity, and a plurality of ports in fluid communication with the atmosphere. The ports may include at least one sensor configured to measure air pressure. The robust housing may be formed by additive manufacturing, casting, machining, or molding. The anemometer may include a controller configured to determine wind speed and direction using the air pressure measurement signals from the at least one sensor. The anemometer may include a communication module configured to send and/or receive signals from the at least one sensor and the controller using wired and/or wireless communication. The communication module may send or receive signals to or from a network, a server, a vehicle, a structure, and/or a user interface. The anemometer may include a power supply connected to the at least one sensor, controller and/or communication module.

A pressure sensor includes a pressure detection element; a substrate on which the pressure detection element is mounted; and a cap in a tubular shape, the cap being attached to the attachment surface of the substrate with an adhesive, the attachment surface enclosing the periphery of the pressure detection element. An attracting concave part is in the end face of the cap, the end face facing the attachment surface, so as to have an inclined surface the distance of which from the attachment surface is increased in a direction from the outer circumferential surface of the cap toward its inner circumferential surface. Part of the adhesive is embedded in the interior of the attracting concave part.

An electronic control unit for a vehicle, including: a pressure-sensor-element (PSE); a housing having a pressure-guide by which the PSE has a pressure-medium applied to it under pressure; an evaluation-unit to generate a pressure-signal, dependent on the pressure detected by the pressure-sensor-element in the pressure-guide; and a circuit-carrier on which at least part of control-electronics of the control-unit is arranged; the pressure-signal of the evaluation-unit being put in the control-electronics, the pressure-guide making direct contact with the circuit-carrier and a sealing-element arranged in the contact-region between the pressure-guide and the circuit-carrier, the sealing-element sealing a region of the pressure-guide to which the pressure-medium is applied under pressure from the surroundings, the PSE being arranged directly on the circuit-carrier, such that the PSE is arranged in the region of the pressure-guide to which the pressure-medium is applied under pressure, and the evaluation-unit being electrically directly connected to the circuit-carrier.

A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.

Aspects of the subject technology relate to electronic devices with pressure sensors. A pressure sensor may be mounted within a device housing in a pressure sensor cavity at or near an opening in the housing. A barometric vent between a main cavity within the housing and the pressure sensor cavity allows pressure changes in the main cavity to generate airflow through the pressure sensor cavity and out through the opening in the device housing. The generated airflow may clear debris that has occluded the opening in the housing.

A water detecting pressure-sensing device includes a metal housing including a cavity. A pressure sensor is disposed on a die and configured to generate a signal in response to a pressure variation. A protection medium at least partially fills the cavity and covers the die. One or more electrodes are disposed on the die and are used to detect a presence of a water droplet on the protection medium.

A method for forming a semiconductor package is disclosed herein. The method includes forming a package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate includes a recess region below the first major surface defined with a die region and a non-die region surrounding the die region. A semiconductor die is disposed in the die region within the recess region. A dam structure is disposed within the recess region. The dam structure surrounds the semiconductor die and extends upwardly to a height below the first major surface of the package substrate. The method also includes dispensing a liquid encapsulant material into the recess region. The liquid encapsulant material is surrounded by the dam structure and extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.