A thermal management system for a sensor module is disclosed that includes a housing enclosing the sensor module and having a bottom wall with a reception port formed therein, and a thermal isolation puck installed within the reception port formed in the bottom wall of the housing for reducing the rate at which thermal energy from a heater located within an adjacent flush static plate is lost to the housing.

A semiconductor sensor device includes a lead frame flag having a vent hole, an interposer mounted on the flag and having a vent hole in fluid communication with the vent hole of the flag, and a sensor die having an active region. The sensor die is mounted on and electrically connected to the interposer in a flip-chip manner such that the vent hole of the interposer is in fluid communication with the active region of the sensor die. Bond wires electrically connect the interposer to one or more other components of the device. A molding compound covers the sensor die, the interposer, and the bond wires. The sensor die may be a pressure-sensing (P-cell) die, and the device may also include a micro-controller unit (MCU) die and an acceleration-sensing (G-cell) die, for tire pressure monitoring applications.

This application relates to a portable electronic device including a processor and an operational component assembly, the operational component assembly including a frame. The frame carries a sensor that is coupled to the frame, where the sensor is capable of (i) receiving an environmental stimulus, and (ii) subsequently, generating an environmental parameter based on the environmental stimulus. The operational components further include a speaker that includes a magnetic driver that is capable of generating a magnetic field in response to receiving the instructions, and a diaphragm that is capable of actuating in response to the magnetic field being generated by the magnetic driver. An opening is disposed at an external surface of the frame such that when an amount of moisture is present within the volume, the magnetic driver receives the instructions from the processor to generate a magnetic field that actuates the diaphragm so as to expel the moisture.

A micromechanical sensor device and a corresponding production method, in which the micromechanical sensor device is equipped with a sensor substrate having a front side and a rear side, a sensor region provided on the front side that can be brought into contact with an environmental medium, and a capping device, attached on the front side, for capping the sensor region. In the capping device and/or in the sensor substrate, one or more capillaries are formed for conducting the environmental medium onto the sensor region, a liquid-repellent layer being provided at least in some regions on the inner walls of the capillaries.

A water detecting pressure-sensing device includes a metal housing including a cavity. A pressure sensor is disposed on a die and configured to generate a signal in response to a pressure variation. A protection medium at least partially fills the cavity and covers the die. One or more electrodes are disposed on the die and are used to detect a presence of a water droplet on the protection medium.

In an example, a method for on-board maintenance of an aircraft is described. The method includes measuring, by a pressure sensor, a pressure in a tube associated with an engine of an aircraft. The method also includes determining, by a control system and based on the pressure measured by the pressure sensor, that the tube is at least partially blocked by moisture. Additionally, the method includes, responsive to determining that the tube is at least partially blocked by the moisture, providing an alert signal from the control system to a flight deck of the aircraft. The method also includes, responsive to the alert signal, operating an actuation switch at the flight deck to actuate a valve to an open state. The method further includes, responsive to actuating the valve to the open state, supplying an inert gas from an inert gas supply to the tube to expel the moisture.

A pressure sensor includes a base including an accommodation portion, a pressure sensor element disposed in the accommodation portion, and a lead portion electrically-connected to the pressure sensor element, including a terminal portion provided along a lower surface of the base, and being exposed to an outside of the base, where the terminal portion includes a recessed groove portion provided on a second surface which is an opposite surface of a first surface facing the body, and where the recessed groove portion divides at the second surface, a first region including a tip of the terminal portion and a second region next to the first region and away from the tip of the terminal portion.

A pressure sensor for a vehicle includes a housing, in which at least one sensor unit is arranged. The at least one sensor unit determines a pressure difference between a pressure at a measurement connection point and atmospheric pressure. The at least one sensor unit senses the atmospheric pressure at at least two reference pressure bores. The disclosure further relates to a braking system for a vehicle, having at least one such pressure sensor. A sensor dewatering means comprises a connection channel, which connects the at least two reference pressure bores to each other.

An improved method for forming a semiconductor package is disclosed herein. The method includes forming a multi-layer package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate comprises a recess region. A semiconductor die is attached to the die region within the recess region. A dam structure is formed within the recess region. The dam structure surrounds the semiconductor die and extends upward to a height below the first major surface of the package substrate. A liquid encapsulant material is dispensed into the recess region. The liquid encapsulant material is surrounded by the dam structure. The liquid encapsulant extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.

A micromechanical pressure sensor system, including: a substrate; a pressure sensor component connected to the substrate; and an essentially hollow frustum-shaped sleeve structure, which is connected to the substrate, which surrounds the pressure sensor component at least laterally and which has an opening at a side of the sleeve structure facing away from the substrate.