A pressure measuring device comprises a carrier, a base which is connected to the carrier, and a pressure sensor which is mounted on the base, wherein a bottom base area of the pressure sensor is greater than a top base area of the base, the pressure sensor being protected against thermomechanical stresses by an end of the base, which is facing away from the pressure sensor, the end being adhesively bonded into a recess in the support by an adhesive bond.

A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.

A pressure sensing apparatus for a vehicle may include: a sensor element configured to measure a change in air pressure by a vehicle collision; a housing unit into which the sensor element is seated, and including a terminal unit electrically coupled to the sensor element, the housing unit being fixed to a vehicle body; a cover unit removably installed on the housing unit; and an elastic pressing unit including a first end coupled to the cover unit, and a second end protruding toward the sensor element and pressing the sensor element, the elastic pressing unit being made of elastically deformable material. An area of a pressing surface of the elastic pressing unit that faces the sensor element may be equal to or less than an area of a surface of the sensor element that faces the pressing surface.

A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.

A method for manufacturing a MEMS unit for a micromechanical pressure sensor. The method includes the steps: providing a MEMS wafer including a silicon substrate and a first cavity formed therein, under a sensor membrane; applying a layered protective element on the MEMS water; and exposing a sensor core from the back side, a second cavity being formed between the sensor core and the surface of the silicon substrate, and the second cavity being formed with the aid of an etching process which is carried out with the aid of etching parameters changed in a defined manner; and removing the layered protective element.

A differential pressure transducer assembly having an internal bellows coupling configured to improve reliability and ease assembly. The differential pressure transducer assembly includes a header, a sensing element mounted on the header, a first pressure port having a first pressure media channel in communication with a first side of the sensing element, a second pressure port having a second pressure media channel in communication with a second side of the sensing element, and a bellows coupling disposed between the header and the second pressure port. The bellows coupling may be configured to flex during assembly to compensate for tolerance mismatches. The bellows coupling may further reduce or prevent external stress from being applied to one or more of the header and the sensing element.

A micromechanical pressure sensor, having a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and a pressure sensor frame; and a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.

It is an object to provide a highly reliable physical-quantity measurement device which can relax thermal stress at a time of bonding and suppress creep or drift of a sensor output.

To attain the above-described object, a physical-quantity measurement device according to the present invention includes a semiconductor element, and a base board connected to the semiconductor element with a plurality of layers being interposed. In the plurality of layers, a stress relaxing layer including at least metal as a main ingredient and a glass layer including glass as a main ingredient are formed each in a layered form including one or more layers. At least one of the stress relaxing layer and the glass layer includes low-melting-point glass, and a softening point of the low-melting-point glass is equal to or lower than the highest heat temperature that the semiconductor element can resist.

The present invention relates to a sensor, particularly a flexible pressure sensor and a fabrication method thereof. The invention provides a flexible pressure sensor which comprises a sensor body and electrodes. The sensor body comprises a first insulation layer of PET film, a first conductivity layer, an isolation layer, a second conductive layer and a second insulation layer of PET film from top to bottom, respectively. The electrodes are made from the first conductive layer and the second conductive layer connected with external circuit through any electrical wire. The isolation layer is a semi-conductive foamed polymer with adjustable conductivity/resistance. Both of the first insulation layer of PET film and the second insulation layer of PET film have the thickness of 4.5-120 m with the surface resistance value of 10.sup.13-14. In the process method of the invention, the isolation layer is a foamed polymer with adjustable conductivity. When pressed, the isolation layer deforms, which reduces the resistance between the two electrodes and increases the conductivity. High sensitivity of the isolation layer meets the requirement that a tiny deformation is enough to have a large change in resistance. Hence, the pressure can be detected by computer data processing upon the relationship between any external pressure and related resistance value.