A micro-electro-mechanical pressure sensor device, formed by a cap region and by a sensor region of semiconductor material. An air gap extends between the sensor region and the cap region; a buried cavity extends underneath the air gap, in the sensor region, and delimits a membrane at the bottom. A through trench extends within the sensor region and laterally delimits a sensitive portion housing the membrane, a supporting portion, and a spring portion, the spring portion connecting the sensitive portion to the supporting portion. A channel extends within the spring portion and connects the buried cavity to a face of the second region. The first air gap is fluidically connected to the outside of the device, and the buried cavity is isolated from the outside via a sealing region arranged between the sensor region and the cap region.

In order to reduce an excessive pressure applied to a pressure sensor due to thermal expansion of fluid or the like, fluid equipment includes: a body unit formed with an internal flow path through which liquid flows; a pressure sensor provided on the body unit for sensing the pressure in the internal flow path; and a fluctuation absorbing part provided on the body unit for absorbing pressure fluctuation of the fluid.

According to one embodiment, a sensor is disclosed. The sensor includes a substrate, a first fixed electrode arranged on the substrate, a movable electrode arranged above the first fixed electrode and being movable non-parallely, a second fixed electrode arranged above the movable electrode. The sensor further includes a detector to detect a difference between a first capacitance between the first fixed electrode and the movable electrode and a second capacitance between the movable electrode and the second fixed electrode.

A versatilely usable pressure sensor is described, which has a ceramic pressure measuring cell (5) clamped in the pressure sensor with interpositioning of a seal (1) outwardly sealing an interior of the pressure sensor and loadable via an opening (3) of the pressure sensor with a pressure (p) to be measured, and whose seal (1) comprises a film (21) of a thermoplastic material, especially polytetrafluoroethylene (PTFE), clamped (in an axial direction and extending perpendicularly to planes of the sealing surfaces (25, 27)) between a form-retaining, planar sealing surface (25) of the pressure measuring cell (5) and a form-retaining sealing surface (27, 27) of a counterbody (19, 19) outwardly surrounding the opening (3), characterized in that the film (21) includes a first film segment (23), which is clamped between the sealing surface (25) of the pressure measuring cell (5) and the sealing surface (27, 27) of the counterbody (19), and the film (21) includes a second film segment (29), which extends over a lateral surface (31) of the counterbody (19, 19) different from the sealing surface (27, 27), and which is connected with the counterbody (19, 19) on the lateral surface (31) via a connecting layer (33) of a material serving as bonding agent for the material of the film (21), especially perfluoroalkoxy-polymer (PFA), arranged on the lateral surface (31).

A pressure sensor includes a base, a sensor facing the base in a height direction with a space between the sensor and the base to sense pressure applied to a sensing surface on a side opposite to the base in the height direction, a surrounding portion raised in the height direction from the base and surrounding the sensor with a groove extending around the sensor, between the surrounding portion and the sensor, a coupling portion coupling the sensor with the surrounding portion, and a beam in the groove to apply a resistance to the surrounding portion moving toward the sensor.

A device comprises a substrate, a spring structure, and a first sensor. The first sensor is resiliently coupled with the substrate via the spring structure. The spring structure is configured to provide damping of the first sensor with respect to the substrate. The device also comprises a second sensor configured to sense a deflection of the spring structure.

Suspending a microelectromechanical system (MEMS) pressure sensing element inside a cavity using spring-like corrugations or serpentine crenellations, reduces thermally-mismatched mechanical stress on the sensing element. Overlaying the spring-like structures and the sensing element with a gel further reduces thermally-mismatched stress and vibrational dynamic stress.

A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.

A pressure sensor includes a sensor chip that detects a pressure and generates an electric signal; a package that has an opening and an internal space in which the sensor chip is accommodated; and flying leads that protrude from the package into the internal space. The sensor chip is connected to the flying leads. Then, the sensor chip is disposed away from an inner wall of the package.

Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.