Systems and methods for monitoring copper corrosion in an integrated circuit (IC) device are disclosed. A corrosion-sensitive structure formed in the IC device may include a p-type active region adjacent an n-type active region to define a p-n junction space charge region. A copper region formed over the silicon may be connected to both the p-region and n-region by respective contacts, to thereby define a short circuit. Light incident on the p-n junction space charge region, e.g., during a CMP process, creates a current flow through the metal region via the short circuit, which drives chemical reactions that cause corrosion in the copper region. Due to the short circuit configuration, the copper region is highly sensitive to corrosion. The corrosion-sensitive structure may be arranged with less corrosion-sensitive copper structures in the IC device, with the corrosion-sensitive structure used as a proxy to monitor for copper corrosion in the IC device.

A defect inspection apparatus includes a first objective lens having an optical axis is perpendicular to a wafer mounting surface of the stage, a second objective lens having an optical axis forms a predetermined acute angle with respect to the wafer mounting surface of the stage, and a dichroic mirror which reflects light having a first wavelength and transmits or reflects light having a second wavelength. Emitted light of a first optical path 111 from a first light source which is reflected from or transmitted through the dichroic mirror and first emitted light and second emitted light polarized and separated from a second light source which are transmitted through or reflected from the dichroic mirror are incident on the first objective lens, and emitted light of a second optical path from the first light source is incident on the second objective lens.

A method for identifying a log of origin of a first board, comprising an identification step, during which a second board (12) is identified which was obtained from the same log (2) as the first board (11) was obtained from, a studying step, during which identifying features of the second board (12) are identified, and a recognition step during which the log (2) of origin of the first board (11) is recognised, among a plurality of known logs (2) about which saved information is available, and this is done by identifying the log of origin of the second board (12), using the identifying features of the second board (12) itself.

Systems and methods for monitoring copper corrosion in an integrated circuit (IC) device are disclosed. A corrosion-sensitive structure formed in the IC device may include a p-type active region adjacent an n-type active region to define a p-n junction space charge region. A copper region formed over the silicon may be connected to both the p-region and n-region by respective contacts, to thereby define a short circuit. Light incident on the p-n junction space charge region, e.g., during a CMP process, creates a current flow through the metal region via the short circuit, which drives chemical reactions that cause corrosion in the copper region. Due to the short circuit configuration, the copper region is highly sensitive to corrosion. The corrosion-sensitive structure may be arranged with less corrosion-sensitive copper structures in the IC device, with the corrosion-sensitive structure used as a proxy to monitor for copper corrosion in the IC device.

A method and device for examining rod-shaped products of the cigarette industry, having a cylindrical lateral surface and two end faces formed by two filter elements arranged at opposite ends, the product having smokable material between the two end faces, by: a) irradiating the lateral surface using examination light whereby the examination light penetrates through the lateral surface at least partially into the product and at least partially exits again through one end face, the beams of which are incident on the lateral surface at an angle of at least 30° in relation to the longitudinal extension of the product; b) acquiring the examination light exiting the end face of the product using an electro-optical receiver, the main viewing direction of which is directed onto the end face; and c) evaluating the brightness or light intensity of the examination light exiting the end face and acquired by the electro-optical receiver.

Systems and methods of performing a stress measurement of a chemically strengthened glass using a light-scattering polarimetry system include adjusting the intensity of a light beam from a light source in an illumination system using a rotatable half-wave plate and a first polarizer operably disposed between the light source and a rotating light diffuser that has a rotation time t.sub.R. The first polarizer is aligned with a second polarizer in a downstream optical compensator to have matching polarization directions by rotating the rotatable half-wave plate to a position where the exposure time t.sub.E falls within an exposure range t.sub.R≤t.sub.E. The method also includes performing an exposure using the exposure time t.sub.E to obtain the stress measurement. One or both of the half-wave plate and first polarizer can be tilted to avoid deleterious back-reflected light from entering the light source.

An optical metrology device is capable of detection of any combination of photoluminescence light, specular reflection of broadband light, and scattered light from a line across the width of a sample. The metrology device includes a first light source that produces a first illumination line on the sample. A scanning system may be used to scan an illumination spot across the sample to form the illumination line. A detector collects the photoluminescence light emitted along the illumination line. Additionally, a broadband illumination source may be used to produce a second illumination line on the sample, where the detector collects the broadband illumination reflected along the second illumination line. A signal collecting optic may collect the photoluminescence light and broadband light and focus it into a line, which is received by an optical conduit. The output end of the optical conduit has a shape that matches the entrance of the detector.

An illustrative example embodiment of a device for detecting rain or a substance on a windshield includes at least one radiation source, an internal reflection sensor situated to detect at least some of a first portion of the radiation that reflects from the windshield. The internal reflection sensor provides a first output that has a characteristic that differs based on whether at least one raindrop is on the windshield. A scattered reflection sensor is situated to detect at least some of a second portion of the radiation reflecting from rain near the windshield or a substance on the windshield. The scattered reflection sensor provides a second output indicative of an amount of radiation incident on the scattered reflection sensor. A processor is configured to determine a condition of the windshield based on the first output and the second output.

Provided is a method, system, and apparatus for inspecting a substrate. The method comprises illuminating the substrate with a singular laser beam, the singular laser beam forming an illuminated spot on the substrate and a bright fringe at a surface of the substrate, the bright fringe extending over at least a portion of the illuminated spot, and detecting, by an optical detection system, scattered light from nano-defects present on the substrate within the illuminated spot.

Additive manufacturing, such as laser sintering or melting of additive layers, can produce parts rapidly at small volume and in a factory setting. To ensure the additive manufactured parts are of high quality, a real-time non-destructive evaluation (NDE) technique is required to detect defects while they are being manufactured. The present invention describes an in-situ (real-time) inspection unit that can be added to an existing additive manufacturing (AM) tool, such as an FDM (fused deposition modeling) machine, or a direct metal laser sintering (DMLS) machine, providing real-time information about the part quality, and detecting flaws as they occur. The information provided by this unit is used to a) qualify the part as it is being made, and b) to provide feedback to the AM tool for correction, or to stop the process if the part will not meet the quality, thus saving time, energy and reduce material loss.