A method for inspecting a surface of a wafer, includes steps of: irradiating a surface of the wafer with a laser beam having three or more distinct wavelengths; detecting a reflected light from the surface of the wafer when the surface of the wafer is irradiated with the laser beam; and determining whether a foreign matter exists on the surface of the wafer based on reflectances of the surface of the wafer with respect to the laser beam having the three or more distinct wavelengths, wherein the step of determining whether the foreign matter exists includes a step of determining whether the foreign matter is a metal or a non-metal.

An apparatus for inspecting transparent cylindrical containers comprising a support and/or gripping device for a cylindrical container adapted to support and make it rotate about a vertical rotation axis, a video camera directed to capture images of a window of a side wall of the cylindrical container, a first collimated lighting device that illuminates said window, a second lighting device that illuminates said window and is arranged opposite the first lighting device in a symmetrical position with respect to the window, a control unit operationally connected to the support and/or gripping device, to the video camera and to said first and second lighting devices, and programmed to capture images of said window at constant angular intervals, alternately activating the first and second lighting devices for each angular range until a complete 360° rotation of the cylindrical container is made, and processing the images obtained.

A manual inspection workstation, including abase and a body pivotally connected to one another and moveable between an upright position and compacted stowed position. A hood is connected to the body opposite the base and at least partially houses a light source. The manual inspection workstation includes a surface coating with physical properties that meet and exceed various FDA and U.S. Pharmacopeia guidelines and requirements. The light source includes a plurality of lighting options including intensity, color output, hue, and saturation. The light source further includes a communications module that allows multiple light sources to be wired together In a sequence or ring. The communications module further includes wireless connectivity to a remote computing device. The light source may further include an internal microprocessor and memory for instituting certain preconfigured light profile protocols.

A detecting device for detecting liquid or colloid, comprising: a light emitting device, configured to emit first light, wherein a first angle between a first emitting direction of the first light and a surface when the detecting device is located on the surface, wherein the first angle is larger than 0° and smaller than 90°; an optical sensor, configured to detect first optical data generated based on the first light; and a processing circuit, configured to determine if the liquid or the colloid exists in a predetermined range of the detecting device based on the first optical data. An automatic cleaner applying the detecting device is also disclosed.

Apparatuses and methods are described for detecting inclusions in glass. The apparatuses and methods employ a laser that is configured to project a laser sheet at a first angle from one side of a glass sheet, and a camera configured to capture images from a second angle from another side of the glass sheet. The glass sheet is moved thorough the laser sheet while the camera captures images. One or more processing devices execute image processing algorithms to identify areas of the glass sheet containing inclusions based on the captured images. In some examples, the identified areas of the glass sheet are revisited to confirm they contain inclusions.

A method for inspecting a transparent workpiece comprises: directing light from an illumination source onto a plurality of defects formed in the transparent workpiece, wherein the plurality of defects extends in a defect direction, wherein the transparent workpiece comprises a first surface and a second surface; detecting a scattering image signal from light scattered by the plurality of defects using an imaging system, wherein an imaging axis of the imaging system extends at a non-zero imaging angle relative to the defect direction, wherein entireties of at least a subset of the plurality of defects are within a depth of field of the imaging system; and generating a three-dimensional image of at least one of the plurality of defects based on the scattering signal.

A product inspection system includes an image acquisition system having a camera generating an inspection image of a product arranged between a plurality of mirrors. The inspection image has a plurality of sub images of different sides of the product. The inspection system has a calibration member with a plurality of correction patterns on different sides; the camera receives light from the calibration member reflected by the mirrors to generate a calibration image of the calibration member. A computer of the product inspection system receives the inspection image and the calibration image and determines a relative mirror position relationship between the mirrors. The computer forms a single spliced image of the product.

A display inspection system for inspecting a light beam emitted from a panel with pixels positioned at several focal planes is provided. The display inspection system includes a focus tunable lens adjustable in a focal distance for focusing at the panel, a first sensing unit for receiving the light beam, a reduced aberration optical system arranged between the focus tunable lens and the first sensing unit for focusing at the first sensing unit, and one or more optical elements placed within a back focal length of the reduced aberration optical system. The reduced aberration optical system comprises a first serial cascade lens group of a first aplanatic lens and a first doublet lens for correcting an optical aberration. The first aplanatic lens and the first doublet lens are co-configured that the back focal length is extended in a manner that the light beam is incident to the first sensing unit.

A pattern inspection apparatus includes an illumination optical system to illuminate an inspection substrate on which a pattern is formed, an offset calculation circuit to calculate an offset amount which depends on an image accumulation time of each of a plurality of photo sensor elements arrayed two-dimensionally, a time delay integration (TDI) sensor to include the plurality of photo sensor elements, to acquire an image of the inspection substrate by receiving a transmitted light or a reflected light from the inspection substrate by the plurality of photo sensor elements, to correct, using the offset amount, a pixel value of optical image data of an acquired image, and to output the optical image data having been corrected, and a comparison circuit to compare an optical image formed by the optical image data output from the TDI sensor with a reference image.

Modulation-encoded light, using different spectral bin coded light components, can illuminate a stationary or moving (relative) target object or scene. Response signal processing can use information about the respective different time-varying modulation functions, to decode to recover information about a respective response parameter affected by the target object or scene. Electrical or optical modulation encoding can be used. LED-based spectroscopic analysis of a composition of a target (e.g., SpO2, glucose, etc.) can be performed; such can optionally include decoding of encoded optical modulation functions. Baffles or apertures or optics can be used, such as to constrain light provided by particular LEDs. Coded light illumination can be used with a focal plane array light imager receiving response light for inspecting a moving semiconductor or other target. Encoding can use orthogonal functions, such as an RGB illumination sequence, or a sequence of combinations of spectrally contiguous or non-contiguous colors.