Patent classifications
G01N21/95
FILM THICKNESS MEASUREMENT METHOD, FILM THICKNESS MEASUREMENT DEVICE, AND FILM FORMATION SYSTEM
There is provided a film thickness measurement method which measures a film thickness of a specific film to be measured in a multilayer film in situ in a film formation system that forms the multilayer film on a substrate, the method comprising: regarding a plurality of films located under the film to be measured as one underlayer film, measuring a film thickness of the underlayer film, and deriving an optical constant of the underlayer film by spectroscopic interferometry; and after the film to be measured is formed, deriving a film thickness of the film to be measured by spectroscopic interferometry using the film thickness and the optical constant of the underlayer film.
DETECTION APPARATUS
A detection apparatus according to one aspect of this disclosure includes: two or more housings connectable to each other; a first photodetector connectable to a corresponding one of the two or more housings; and a second photodetector connectable to a corresponding one of the two or more housings. Each of the housings includes a first connecting portion to which the first photodetector is connectable, a second connecting portion to which the second photodetector is connectable, and a third opening facing the first connecting portion. At least one of the housings includes a dichroic mirror placed between a first opening and the third opening. The dichroic mirror allows light having a first wavelength in incident light from the third opening to pass through the dichroic mirror toward the first opening, while the dichroic mirror reflects light having a second wavelength in the incident light toward the second opening.
DETECTION APPARATUS
A detection apparatus according to one aspect of this disclosure includes: two or more housings connectable to each other; a first photodetector connectable to a corresponding one of the two or more housings; and a second photodetector connectable to a corresponding one of the two or more housings. Each of the housings includes a first connecting portion to which the first photodetector is connectable, a second connecting portion to which the second photodetector is connectable, and a third opening facing the first connecting portion. At least one of the housings includes a dichroic mirror placed between a first opening and the third opening. The dichroic mirror allows light having a first wavelength in incident light from the third opening to pass through the dichroic mirror toward the first opening, while the dichroic mirror reflects light having a second wavelength in the incident light toward the second opening.
APPARATUS AND METHODS FOR COMBINED BRIGHTFIELD, DARKFIELD, AND PHOTOTHERMAL INSPECTION
Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has a modulated optical reflectance (MOR) module for directing a pump and probe beam to the sample and detecting a MOR output beam from the probe spot in response to the pump beam and the probe beam. The system includes a processor for analyzing the BF output beam from a plurality of BF spots to detect defects on a surface or near the surface of the sample and analyzing the MOR output beam from a plurality of probe spots to detect defects that are below the surface of the sample.
LIQUID SURFACE INSPECTION DEVICE, AUTOMATED ANALYSIS DEVICE, AND PROCESSING DEVICE
Provided are a liquid surface inspection device, an automated analysis device, and a liquid surface inspection method with which instances of contamination can be minimized and the accuracy of the manner in which the surface conditions, such as bubbles or the like, of a liquid substance are detected can be enhanced. The device has: a light illumination unit for illuminating a container holding a liquid substance, as well as the surface of the liquid substance, with light; an image capture unit for acquiring a video image having at least color information and brightness information of light from the container and the liquid substance which are illuminated by the light illumination unit; and a detection unit for using the color information and brightness information in the video image captured by the image capture unit to detect the condition of the liquid surface.
LIQUID SURFACE INSPECTION DEVICE, AUTOMATED ANALYSIS DEVICE, AND PROCESSING DEVICE
Provided are a liquid surface inspection device, an automated analysis device, and a liquid surface inspection method with which instances of contamination can be minimized and the accuracy of the manner in which the surface conditions, such as bubbles or the like, of a liquid substance are detected can be enhanced. The device has: a light illumination unit for illuminating a container holding a liquid substance, as well as the surface of the liquid substance, with light; an image capture unit for acquiring a video image having at least color information and brightness information of light from the container and the liquid substance which are illuminated by the light illumination unit; and a detection unit for using the color information and brightness information in the video image captured by the image capture unit to detect the condition of the liquid surface.
DOOR INSPECTION SYSTEM FOR VEHICLE AND INSPECTION METHOD FOR THE SAME
An inspection system for a vehicle includes a vision inspection device including a plurality of vision camera and a plurality of laser device which move along exterior and sides of a door, which will be inspected, and inspect segmented sections respectively, a hanger device clamping the hemmed door on a hanger frame, and a jig device which clamps the hanger frame of the hanger device, and moves the door toward the vision inspection device for the vision inspection device to inspect the door fixed to the hanger device.
ACTIVE REAL-TIME CHARACTERIZATION SYSTEM
A system for providing active real-time characterization of an article under test is disclosed. An infrared light source, a first visible light source and a second visible light source each outputs and directs a beam of coherent light at a particular area on the article under test. A visible light camera and a visible light second harmonic generation camera, an infrared camera and an infrared second harmonic generation camera, a sum frequency camera and a third order camera are each configured to receive a respective predetermined return beam of light from the particular area on the article under test. A processor receives signals from the cameras and calculates in real time respective spectroscopic signals and compares each calculated signal with each other calculated signal and with a predetermined baseline signal to ensure that the article under test conforms to an expected value.
ACTIVE REAL-TIME CHARACTERIZATION SYSTEM
A system for providing active real-time characterization of an article under test is disclosed. An infrared light source, a first visible light source and a second visible light source each outputs and directs a beam of coherent light at a particular area on the article under test. A visible light camera and a visible light second harmonic generation camera, an infrared camera and an infrared second harmonic generation camera, a sum frequency camera and a third order camera are each configured to receive a respective predetermined return beam of light from the particular area on the article under test. A processor receives signals from the cameras and calculates in real time respective spectroscopic signals and compares each calculated signal with each other calculated signal and with a predetermined baseline signal to ensure that the article under test conforms to an expected value.
Method and apparatus to determine a patterning process parameter
A metrology target includes: a first structure arranged to be created by a first patterning process; and a second structure arranged to be created by a second patterning process, wherein the first structure and/or second structure is not used to create a functional aspect of a device pattern, and wherein the first and second structures together form one or more instances of a unit cell, the unit cell having geometric symmetry at a nominal physical configuration and wherein the unit cell has a feature that causes, at a different physical configuration than the nominal physical configuration due to a relative shift in pattern placement in the first patterning process, the second patterning process and/or another patterning process, an asymmetry in the unit cell.