An apparatus for and a method of measuring permanent-magnet eddy-current loss is provided. A magnetic flux density measured in a Gaussmeter 60 is fed back to a control device 70, and thus operation of a power supply 80 is automatically controlled. Accordingly, an experiment can be efficiently conducted. A non-magnetic and non-conductive measurement jig 30 blocks heat generated in a permanent magnet sample from being dissipated to an iron core 10. Accordingly, eddy-current loss occurring in the permanent magnet sample 40 can be measured more precisely.

A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.

A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.

An inspection system for a plurality of separable inspection objects, including a feed device for the plurality of inspection objects, a conveying device for the plurality of inspection objects, an inspection unit and an ejecting device. The feed device is configured and disposed such that the plurality of inspection objects can be fed by the feed device to a feed position of the conveying device. The conveying device includes a plurality of receptacles, each receptacle is configured and disposed such that exactly one inspection object of the plurality of inspection objects can be conveyed along a conveying path in said receptacle and that two respective inspection objects from the plurality of inspection objects have a spacing along the conveying path that is defined by the plurality of receptacles. The inspection unit is disposed at an inspection position on the conveying path.

An electromagnet for a thermography system comprising a first elongated magnetic core spaced apart from a second elongated magnetic core; at least a first shorting bar connecting substantially at a first end of the first elongated magnetic core and a first end of the second elongated magnetic core; and at least a first excitation coil configured to conduct electrical current.

An apparatus for measuring material properties of an object of ferromagnetic material, the apparatus including a probe, the probe including an electromagnet core defining two spaced-apart poles for inducing a magnetic field in the object, and a drive coil wound around the electromagnet core, and means to supply an alternating electric current to the drive coil to generate an alternating magnetic field in the electromagnet core and consequently in the object, wherein the probe also includes two sensing coils arranged in the vicinity of each of the poles, for sensing the magnetic flux density that links the core and the object, such sensing coils are significantly more sensitive to changes in material properties than are sensing coils overwound onto the drive coil.

Sensory elements for placement within a probe that includes at least one receiving coil disposed within a pulsed eddy current probe, and at least one sensing element disposed within a pulse eddy current probe.

Electromagnetic and eddy current techniques for fast automated real-time and near real-time inspection and monitoring systems for high production rate joining processes. An eddy current system, array and method for the fast examination of welds to detect anomalies such as missed seam (MS) and lack of penetration (LOP) the system, array and methods capable of detecting and sizing surface and slightly subsurface flaws at various orientations in connection with at least the first and second weld pass.

An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system, and a controller. The controller is configured to store data associating each of a plurality of conditioner disk products with a respective threshold value, receive an input selecting a conditioner disk product from the plurality of conditioner disk products, determine a particular threshold value associated with the selected conditioner disk product, receive a signal from the monitoring system, generate a measure of a pad cut rate from the signal, and generate an alert if the pad cut rate falls beyond the particular threshold value.

The present application discloses a detection structure for chip edge cracks and a detection method thereof. In one embodiment, the detection structure comprises a test ring located between a chip scribe line and a sealing ring, wherein the chip internally comprises two test pads for detecting continuity of the test ring, the sealing ring comprises a P-type doped ring located in a substrate and a shallow trench isolation area for isolating the sealing ring the test ring, the shallow trench isolation area is formed with N-type doped regions electrically connected to the two test pads respectively; the test ring comprises a multi-layer interconnection structure located on the substrate and the interconnection structure is electrically connected to the two test pads through the N-type doped regions. The present application can detect edge cracks caused by wafer manufacturing, die sawing, and chip packaging processes to reduce reliability risk.