A probe arrangement for a testing system includes a base carrier that defines a longitudinal direction, which can be oriented parallel to a testing direction, and a transverse direction, which can be oriented perpendicularly to the testing direction. The base carrier carries a plurality of probe holders which are arranged next to one another in a row in the transverse direction. Each probe holder has a first probe region, which is equipped with at least one first probe, and a second probe region, which is equipped with at least one second probe. Each probe region defines an effective testing width such that, during relative movement of the test subject with respect to the probe arrangement along the testing direction through the probe region, a testing track having the effective testing width can be tested in a gap-free manner. The first probe region and the second probe region are arranged so as to be offset in relation to one another parallel to the longitudinal direction and parallel to the transverse direction such that a first testing track covered by the first probe region transitions on one side in a gap-free manner into a second testing track covered by the second probe region of the same probe holder, and transitions on the opposite side in a gap-free manner into a second testing track covered by a second probe region of a directly adjacent probe holder.

A method includes: an arrangement step of arranging a phased array probe including a plurality of oscillators each of which is capable of emitting ultrasonic waves on an end surface of the rotor disc, in a parallel state in which the plurality of oscillators are arranged along a circumferential direction of the rotor disc; a first transmission step of emitting ultrasonic waves from the plurality of oscillators in the parallel state, while a timing of emitting the ultrasonic waves from each of the oscillators is controlled in a first emission pattern, and receiving reflection waves of the ultrasonic waves; and a second transmission step of emitting ultrasonic waves from the plurality of oscillators in the parallel state, while the timing of emitting the ultrasonic waves from each of the oscillators is controlled in a second emission pattern different from the first emission pattern, and receiving reflection waves of the ultrasonic waves.

An ultrasonic test device and test method for service stress of a moving mechanical component, where the device comprises an ultrasonic probe, a coupling fluid, a pressure-maintaining cover and universal wheels. The cover is vertically arranged above an inspected position of an inspected component, an interior of the pressure-maintaining cover is filled with coupling fluid, a bottom of the cover is provided with a structure permeable to the coupling fluid to form a coupling fluid film between the inspected position and the bottom of the cover, and a top of the cover is equipped with the ultrasonic probe. A detection part at a lower part of the ultrasonic probe extends into the coupling fluid of the cover and is vertical to the bottom of the cover without contact. The distance between the ultrasonic probe and the inspected component is kept unchanged through the universal wheels.

Systems and methods for measuring physical material properties of a plurality of samples with high throughput can be carried out with high reliability. The system can include a three-axis robotic structure for moving the target to a desired position in a three-dimensional space, a piezoelectric millimeter cantilever sensor mounted on the three-axis robotic structure, the piezoelectric millimeter cantilever sensor configured to have at least one electrical parameter as a function of its physical environment, and a controller configured to instruct the three-axis robotic structure to position the millimeter cantilever sensor at a first position over a first well including a first fluid sample, instruct the three-axis robotic structure to lower the piezoelectric millimeter cantilever sensor into the first fluid sample, instruct the three-axis robotic structure to retract the piezoelectric millimeter cantilever and move it over a second position over, and lower into a second well including a second fluid sample.

Systems and methods for measuring physical material properties of a plurality of samples with high throughput can be carried out with high reliability. The system can include a three-axis robotic structure for moving the target to a desired position in a three-dimensional space, a piezoelectric millimeter cantilever sensor mounted on the three-axis robotic structure, the piezoelectric millimeter cantilever sensor configured to have at least one electrical parameter as a function of its physical environment, and a controller configured to instruct the three-axis robotic structure to position the millimeter cantilever sensor at a first position over a first well including a first fluid sample, instruct the three-axis robotic structure to lower the piezoelectric millimeter cantilever sensor into the first fluid sample, instruct the three-axis robotic structure to retract the piezoelectric millimeter cantilever and move it over a second position over, and lower into a second well including a second fluid sample.

An inspection system comprising a first and second computer controlled robotic arm that each have five degrees of freedom (x, y, z, α, β) and respectively control position and tilt of first and second probes for inspection of a workpiece, wherein the computer control ensures that the two robotic arms simultaneously scan the probes over the workpiece, without interfering with each other.

A system and method of ultrasonically inspecting coiled wire includes a wire drawer, a first power feeder, an ultrasonic inspection device, and a re-coiler. The wire drawer receives wire that is unspooled from a first coil of wire that has not been internally inspected for defects. The wire is then fed through the first power feeder, which straightens the wire. The straightened wire is then fed through the ultrasonic inspection device to detect internal defects of the wire. The inspected wire is then re-coiled into a second coil of wire that has been ultrasonically inspected for internal defects. Accordingly, raw and uninspected wire coils can be continuously conditioned and inspected and then re-coiled, and may be certified for use in specific manufacturing processes, without having to inspect individual cut and separated sections of wire.

The present invention refers to a method for assessing the inclusive level in steel tubes using high frequency transducer (2) in the automatic ultrasound inspection, characterized in that it comprises the steps of: transporting a tube (1) through a bed (10) to an acoustic coupling unit (3); coupling the acoustic coupling unit (3) with the tube (1) through a radial movement (16) of transducer approximation (2) regarding the tube external surface (1); detecting inclusions information in at least one sweep region (11) along the length of the tube (1); sending the inclusions information to a sonic emitting and receiving unit (9); determining an inclusions index for the tube (1) or specific region; continuing the tube transportation (1) in an inspection line; and giving continuity to the inspection cycle with the next tube (1) in the production flow.

The present invention refers to a method for assessing the inclusive level in steel tubes using high frequency transducer (2) in the automatic ultrasound inspection, characterized in that it comprises the steps of: transporting a tube (1) through a bed (10) to an acoustic coupling unit (3); coupling the acoustic coupling unit (3) with the tube (1) through a radial movement (16) of transducer approximation (2) regarding the tube external surface (1); detecting inclusions information in at least one sweep region (11) along the length of the tube (1); sending the inclusions information to a sonic emitting and receiving unit (9); determining an inclusions index for the tube (1) or specific region; continuing the tube transportation (1) in an inspection line; and giving continuity to the inspection cycle with the next tube (1) in the production flow.

Method of determining an overlay error between device layers of a multilayer semiconductor device using an atomic force microscopy system, wherein the semiconductor device comprises a stack of device layers comprising a first patterned layer and a second patterned layer, and wherein the atomic force microscopy system comprises a probe tip, wherein the method comprises: moving the probe tip and the semiconductor device relative to each other for scanning of the surface; and monitoring motion of the probe tip with tip position detector during said scanning for obtaining an output signal; during said scanning, applying a first acoustic input signal to at least one of the probe or the semiconductor device; analyzing the output signal for mapping at least subsurface nanostructures below the surface of the semiconductor device; and determining the overlay error between the first patterned layer and the second patterned layer based on the analysis.