A system and method for automating programming of an industrial use x-ray inspection machine, utilizing an artificial intelligence (AI) engine in both a navigator level and planner level stage of an x-ray parts inspection machine, the AI engine performing at least one of identifying and classifying a sample, assessing location(s) to be inspected on the sample, and implementing a test criteria for each assessed location on the sample. The AI engine removes the typical interactions and setup procedures performed by the machine operator, thus enabling a higher degree of system automation and accuracy.

An inspection position identification method that allows accurate inspection to be performed without in-advance identification of the position of an inspection plane in an inspected target. A three-dimensional image generation method that allows generation of a three-dimensional image for inspection without in-advance identification of the position of an inspection plane in an inspected target and then allows inspection to be performed. An inspection device including the methods. An inspection device includes a storage unit, which stores a radiation transmission image of an inspected object and a three-dimensional image generated from the radiation transmission image, and a control unit. The process carried out by the control unit for identifying an inspection position in a three-dimensional image includes identifying the position of a transmission picture of the inspection position in the radiation transmission image and identifying the inspection position in the three-dimensional image from the position of the transmission picture.

Methods and systems for verifying compatibility of components (e.g. parts or devices) of an electronic system are disclosed. In certain embodiments the method includes: irradiating a first and second components presumably associated with the electronic system, with XRF exciting radiation, and detecting one or more XRF response signals indicative of a first and a second XRF signatures, emitted from the first and second components in response to the irradiation. Then the first and second XRF signatures are processed to determine whether they are associated with respectively a first and second XRF marking compositions on the first and second components, and the compatibility of the first and second components to the electronic system is determined/verified based on the correspondence between the first and a second XRF signatures/marking. Certain embodiments also disclose electronic systems including at least a first and a second electronic components/devices respectively having the first and second XRF marking compositions that enable verification of compatibility of the components. Certain embodiments disclose techniques for pairing the first and second components (e.g. devices) based a correspondence between the first and second XRF signatures/markings thereof. Certain embodiments disclose various calibration techniques for calibrating the XRF measurements of XRF markings applied to different substrate materials of the electronic components.

A method includes obtaining a layout of a circuit pattern implemented on a semiconductor wafer, and identifying one or more polygons in the layout based on a length criteria. One or more measurement gauges are placed on the identified polygons to thereby obtain measured polygons. A scanning electron microscope (SEM) image of the circuit pattern is obtained. The SEM image is aligned with the layout including the measured polygons. A critical dimension of one or more objects in the SEM image is measured. The one or more objects correspond to the one or more polygons. Based on the measured critical dimension, it is determined whether the circuit pattern is acceptable.

The invention relates to a method for testing an electronic component for defects, by examining the electronic component in a production line by means of automatic optical inspection; determining the coordinates of regions in which an examination using automatic optical inspection is not possible; transmitting the coordinates of these regions from the production line to a computer; transporting the electronic component from the production line into an X-ray device which is arranged outside the production line, for non-destructive material testing; transmitting the coordinates of the regions from the computer to this X-ray device; examining the electronic component by means of the X-ray device only in the regions in which an examination using automatic optical inspection is not possible; transmitting the results of the examination in the X-ray device to the computer; returning the electronic component to the production line if the result indicates that it is not defective.

Provided herein are methods and apparatus for characterizing high aspect ratio (HAR) structures of fabricated or partially fabricated semiconductor devices. The methods involve using small angle X-ray scattering (SAXS) to determine average parameters of an array of HAR structures. In some implementations, SAXS is used to analyze symmetry of HAR structures in a sample and may be referred to as tilted structural symmetry analysis-SAXS (TSSA-SAXS) or TSSA. Analysis of parameters such as tilt, sidewall angle, bowing, and the presence of multiple tilts in HAR structures may be performed.

An X-ray inspection apparatus includes an X-ray source, an X-ray detector, and a stage. A dose rate calculation unit of a control section calculates a dose rate at any position in an inspection space, a stage face information storage unit 32 stores stage face information, an irradiation history monitoring unit monitors a movement locus, a stage face cumulative irradiation dose calculation unit calculates cumulative irradiation dose distribution data, a stage face imaging range calculation unit calculates a stage face imaging range of the X-ray detector, and a dose distribution image display control unit extracts the cumulative irradiation dose distribution data in an imaging range and displays an image thereof.

A pattern-measuring apparatus and a semiconductor-measuring system are provided which are able to obtain an evaluation result for suitably selecting processing with respect to a semiconductor device. In particular, there is proposed a pattern-measuring apparatus including an arithmetic device which compares a circuit pattern of an electronic device with a reference pattern, in which the arithmetic device classifies the circuit pattern in processing unit of the circuit pattern on the basis of a comparison of a measurement result between the circuit pattern and the reference pattern with at least two threshold values.

An x-ray inspection system including a cabinet containing an x-ray source, a sample support for supporting a sample to be inspected, and an x-ray detector; an air mover configured to force air into the cabinet through an air inlet above the sample support, where the air mover and cabinet are configured to force air through the cabinet from the air inlet past the sample support to an air outlet in the cabinet below the sample support, and an assembly for positioning the sample support relative to the x-ray source and x-ray detector. The sample support includes an upper surface extending in a horizontal plane and the sample positioning assembly includes a vertical positioning mechanism for moving the sample support in a vertical direction, orthogonal to the horizontal plane, and a first horizontal positioning mechanism for moving the sample support and vertical positioning mechanism in a first horizontal direction.

A system and method for automating programming of an industrial use x-ray inspection machine, utilizing an artificial intelligence (AI) engine in both a navigator level and planner level stage of an x-ray parts inspection machine, the AI engine performing at least one of identifying and classifying a sample, assessing location(s) to be inspected on the sample, and implementing a test criteria for each assessed location on the sample. The AI engine removes the typical interactions and setup procedures performed by the machine operator, thus enabling a higher degree of system automation and accuracy.