A device for verifying the connection of components by a gripper, wherein connecting two or more components produces a connection sound. The device comprises a plurality of audio sensors, a fastener for securing the plurality of audio sensors at different positions on the gripper, and a controller. The controller comprises an input for receiving the audio signals from the plurality of audio sensors, a neural network for isolating the connection sound from the audio signals received from the plurality of audio sensors using independent component analysis based on training audio data obtained from audio signals received during a plurality of training connections made in a controlled environment; and an output for indicating a desired connection status based on the isolated connection sound.

The present disclosure relates to a technical virtual sensing idea of indirectly measuring structural vibration information on an unmeasured point while minimizing the number of sensors attached for actual measurement, and more particularly, to a technique of estimating measurement data of an unmeasured point using a finite element model, synchronized and updated based on experimental data of an actual measurement subject structure, and a virtual sensing algorithm.

A measurement method performed by a semiconductor manufacturing apparatus including a chamber is provided. In the measurement method, first measurement data including a signal of a resonance frequency of the chamber is acquired as reference data, in response to transmitting an electrical signal into the chamber while a jig capable of performing wireless communication is not placed in the chamber. Subsequently, second measurement data including the signal of the resonance frequency of the chamber and including a signal of a resonance frequency of a sensor installed in the jig is acquired, in response to transmitting an electrical signal into the chamber while the jig is placed in the chamber. By subtracting the reference data from the second measurement data, third measurement data is calculated.

Systems and methods for acoustic signal based analysis, include obtaining acoustic response signal data of at least a portion of a battery cell, the acoustic response signal data comprising waveforms generated by transmitting one or more acoustic excitation signals into at least the portion of the battery cell and recording response vibration signals to the one or more acoustic excitation signals. One or more metrics are determined from at least the acoustic response signal data, the one or more metrics being determined based on correlation of the one or more metrics to one or more characteristics of battery cells and a reference model is generated from the one or more metrics. A test battery can be evaluated using the reference model. Actionable insights or recommendations can be generated based on the evaluation. The reference model can also be updated based on the evaluation.

A method and system for detecting imperfections on a surface of a touchscreen of an electrical device, comprising: swiping a test object, such as a fingertip, a fingernail or a pin, along at least a portion of the touchscreen; producing, by the touchscreen, an electric signal indicative of the test object's contact with the touchscreen; receiving an acoustic signal by an acoustic sensor, during the swipe of the test object along the touchscreen; analyzing, by a processor, at least one of the electric signal and received acoustic signal; and determining existence of imperfections on the touchscreen's surface based on the analysis.

Systems and methods for analyzing physical characteristics of a battery include arrangements of two or more transducers coupled to the battery. A control module controls one or more of the two or more transducers to transmit acoustic signals through at least a portion of the battery, and one or more of the two or more transducers to receive response acoustic signals. Distribution of physical properties of the battery is determined based at least on the transmitted acoustic signals and the response acoustic signals.

Heights of wafers in a front opening unified pod are identified by using an end effector and a front sensor arranged thereon, such that the end effector can be positioned at the appropriate height when retrieving one of the wafers, so as to avoid colliding with a wafer stored inside the front opening unified pod. Wafer backside properties can also be detected by the end effector, so as to report defects and contaminants on the wafer.

Method of determining an overlay error between device layers of a multilayer semiconductor device using an atomic force microscopy system, wherein the semiconductor device comprises a stack of device layers comprising a first patterned layer and a second patterned layer, and wherein the atomic force microscopy system comprises a probe tip, wherein the method comprises: moving the probe tip and the semiconductor device relative to each other for scanning of the surface; and monitoring motion of the probe tip with tip position detector during said scanning for obtaining an output signal; during said scanning, applying a first acoustic input signal to at least one of the probe or the semiconductor device; analyzing the output signal for mapping at least subsurface nanostructures below the surface of the semiconductor device; and determining the overlay error between the first patterned layer and the second patterned layer based on the analysis.

Embodiments disclosed herein include diagnostic substrates and methods of using such substrates. In an embodiment, a diagnostic substrate comprises a substrate, and a device layer over the substrate. In an embodiment, the diagnostic substrate further comprises a resonator in the device layer. In an embodiment, the resonator comprises a cavity, a cover layer over the cavity, and electrodes within the cavity for driving and sensing resonance of the cover layer. In an embodiment, the diagnostic substrate further comprises a reflector surrounding a perimeter of the resonator.

An apparatus and method for detecting failed electronics using acoustics. The method comprising directing an acoustic wave toward a circuit component to be tested such that the acoustic wave is reflected off the circuit component, receiving the reflected acoustic wave, amplifying the reflected acoustic wave, and comparing the reflected acoustic wave with known acoustic waves to determine if the circuit component is operating properly. The apparatus comprising a data acquisition system for acquiring data, an X-Y-Z positioner to position two transducers and to hold the circuit component, and software to post-process and analyze the data. The data acquisition system further includes an oscilloscope, a pulser-receiver, two air-coupled transducers, and an amplifier.