A piezoelectric shear mode sensor element comprises a sensor block made of a piezoelectric material having an intrinsic polarization axis, wherein the piezoelectric material is also pyroelectric. The sensor block has in an axial direction axial ends and in lateral directions perpendicular to the axial direction lateral side faces. The sensor electrodes are adapted for capturing a shear mode sensor signal. The sensor element further comprises a discharge guard adapted to locally alter and/or rearrange charges so as to counteract pyroelectric displacement charges on the lateral side faces of the sensor block.

The invention relates to an acceleration sensor (400) comprising an excitation mass (420) having excitation electrodes (430), which excitation mass is movably mounted over a substrate (410) along a movement axis (x) and comprising detection electrodes (440) which are permanently connected to the substrate (410) and allocated to the excitation electrodes (430). A first group of pairings (450) of excitation electrode (430) and allocated detection electrodes (440) is suitable for deflecting the excitation mass (420) along the movement axis (x) in a first direction (460). A second group of pairings (450) of excitation electrodes (430) and allocated detection electrodes (440) is suitable for deflecting the excitation mass (420) along the movement axis (x) in a second direction (465), which is opposite the first direction (460). The number of pairings (450) in the first group is equal to the number of pairings (450) in the second group. The averaged distance between excitation electrodes (430) and detection electrodes (440) of the pairings (450) of the first group corresponds to the averaged distance between excitation electrodes (430) and detection electrodes (440) of the pairings (450) of the second group.

A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.

A semiconductor device includes a substrate, a beam, a movable structural body, a first stopper member, a second stopper member and a third stopper member. The first stopper member is arranged with a first gap from the movable structural body in an in-plane direction. The second stopper member is arranged with a second gap from the movable structural body in an out-of-plane direction. The third stopper member is arranged opposite to the second stopper member with the movable structural body interposed therebetween in the out-of-plane direction, and is arranged with a third gap from the movable structural body. Consequently, there can be provided a semiconductor device in which excessive displacement of the movable structural body can be suppressed to thereby suppress damage to and breakage of the beam supporting the movable structural body, and a method of manufacturing the same.

A micromechanical sensor that is produced surface-micromechanically includes at least one mass element formed in a third functional layer that is non-perforated at least in certain portions. The sensor has a gap underneath the mass element that is formed by removal of a second functional layer and at least one oxide layer. The removal of the at least one oxide layer takes place by introducing a gaseous etching medium into a defined number of etching channels arranged substantially parallel to one another. The etching channels are configured to be connected to a vertical access channel in the third functional layer.

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

A tri-axial MEMS accelerometer includes a top cap silicon wafer and a bottom cap silicon wafer coupled with a measurement mass. The measurement mass has a two level structure, each level having an inner frame coupled to an outer frame by a plurality of first elastic beams, a mass coupled to the inner frame by a plurality of second elastic beams, and a comb coupling structure between the mass and the inner frame. The comb coupling structures are arranged in an orthogonal orientation. The top level and bottom level measurement masses measure acceleration in perpendicular directions. The top level and bottom level measurement masses and the inner frame form an integral unit which moves along a third direction. Acceleration in the third direction is measured from the change in capacitance between the integral unit and the top cap silicon wafer and bottom cap silicon wafer.

A MEMS device includes: a substrate as a base including a support portion and a detection electrode as a fixed electrode; a movable body supported to the support portion with a major surface of the movable body facing the fixed electrode; and an abutment portion facing at least a portion of an outer edge of the movable body and restricting rotational displacement in an in-plane direction of the major surface. The abutment portion includes an abutment surface including an abutment position at which the movable body abuts against the abutment portion due to the rotational displacement of the movable body, and a hollow portion provided opposing the abutment surface.

A mechanical transducer for the detection of acoustic and/or seismic signals is indicated, comprising a continuous or discrete coupled mass-spring network with varying masses and/or spring constants. The mass-spring network is adapted to transform a comparatively small-dimensioned motion parameter of a first mass element into a comparatively large-dimensioned motion parameter of a further mass element. Between the first mass element and the further mass element, the mass-spring network comprises one or more intermediate mass elements, which are coupled to the first mass element and the further mass element by means of spring elements.

A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.