A microelectromechanical system (MEMS) apparatus is described. The MEMS apparatus may comprise inertial sensors and energy harvesters configured to convert mechanical vibrational energy into electric energy. The harvested energy may be used to power an electronic circuit, such as the circuit used to sense acceleration from the inertial sensors. The inertial sensors and the energy harvesters may be disposed on the same substrate, and may share the same proof mass. The energy harvesters may include a piezoelectric material layers disposed on a flexible structure. When the flexible structures flexes in response to vibration, stress arises in the piezoelectric material layer, which leads to the generation of electricity. Examples of inertial sensors include accelerometers and gyroscopes.

A microelectromechanical (MEMS) accelerometer senses linear acceleration perpendicular to a MEMS device plane of the MEMS accelerometer based on a rotation of a proof mass out-of-plane about a rotational axis. A symmetry axis is perpendicular to the rotational axis. The proof mass includes a symmetric portion that is symmetric about the symmetry axis and that is contiguous with an asymmetric portion that is asymmetric about the symmetry axis.

A multi-stage MEMS accelerometer is disclosed that includes a MEMS sensor that has two suspended structures (proof masses) suspended by suspension members. The suspended structures move together in response to input acceleration when less the acceleration is less than a threshold value. When the input acceleration is greater than the threshold value, one of the suspended structures makes contact with a mechanical stop while the other suspended structure continues to move with increased stiffness due to the combined stiffness of the suspension members. The contact with the mechanical stop contributes a nonlinear mechanical stiffening effect that counteracts the nonlinear capacitive effect inherent in capacitive based MEMS accelerometers. In some embodiments, more than two suspended structures can be used to allow for optimization of sensitivity for multiple full-scale ranges, and for higher fidelity tuning of mechanical sensitivity with nonlinear capacitance. In some embodiments, compliant mechanical stops are used.

A flexure for a MEMS device includes an elongated beam and a protrusion element extending outwardly from a sidewall of the elongated beam. A MEMS inertial sensor includes a movable element spaced apart from a surface of a substrate, an anchor attached to the substrate, and a spring system. The spring system includes first and second beams, a center flexure between the first and second beams, a first end flexure interconnected between an end of the first beam and the anchor, and a second end flexure interconnected between an end of the second beam and the movable element. Each of the end flexures includes the elongated beam having first and second ends, and the sidewall defining a longitudinal dimension of the elongated beam, and the protrusion element extending from the sidewall of the elongated beam, the protrusion element being displaced away from the first and second ends of the beam.

An auxetic interposer includes: a frame enclosing an interior space; a pad arranged within the interior space; and a plurality of micro auxetic lattices extending between the frame and the pad.

Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.

An accelerometer includes a planar proof mass mounted to a fixed substrate so as to be linearly moveable in an out-of-plane sensing direction in response to an applied acceleration. The proof mass includes first and second sets of moveable capacitive electrode fingers extending from the proof mass perpendicular to the sensing direction in a first in-plane direction and laterally spaced in a second in-plane direction perpendicular to the sensing direction. The moveable capacitive electrode fingers interdigitate with corresponding sets of fixed capacitive electrode fingers mounted to the substrate. The first set of fixed fingers has a thickness less than a thickness of the first set of moveable fingers; and wherein the second set of fixed fingers has a thickness greater than a thickness of the second set of moveable fingers.

A method for temperature compensation of a MEMS sensor. The method includes: in a balancing step, a temperature gradient is produced by a thermal element and a first and a second temperature are determined at a first and a second temperature measurement point, wherein a deflection of a movable structure produced by the temperature gradient is measured and a compensation value is ascertained dependent on the first and second temperature and the deflection; in a measurement step, a physical stimulus is measured by way of a deflection of the movable structure and a third and fourth temperature is determined at the first and second temperature measurement points; in a compensation step, a measured value of the physical stimulus is ascertained dependent on the measured deflection, the third and fourth temperature and the compensation value. A method is also provided including: a regulation step, and a measurement step.

A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.

A three-axis accelerometer includes a single, integrated mass including at least one lateral (x-y) proof mass and at least one vertical (z) proof mass. The vertical proof mass is arranged as a teeter-totter mass, which is located within the lateral proof mass. The vertical proof mass is mechanically coupled to the lateral proof mass with one or more torsional springs, and the lateral proof mass is mechanically coupled to one or more anchors with one or more lateral springs. The at least one vertical proof mass may be symmetrically positioned about one or more axes of the three-axis accelerometer, so that the 3-axis accelerometer has in-plane symmetry. The three-axis accelerometer may be less susceptible for mechanical cross-talk or noise and may provide a smaller packaged solution for sensing acceleration in three directions.