G01Q60/40

Probe tip X-Y location identification using a charged particle beam

An automated system for controlling a conductive probe of a nanoprober system in situ to a charged particle beam (CPB) imaging system can include a nanoprober comprising an actuator and a conductive probe; signal measurement circuitry electrically coupled to the conductive probe and to receive an electrical signal from the conductive probe; and a hardware processor to execute operations. The operations can include activating a CPB within a first reference frame, the first reference frame associated with the CPB; causing, by a computerized control system, the CPB and the conductive probe to intersect; measuring an electrical response from the intersection of the CPB with the conductive probe; and determining a location of the conductive probe in a second reference frame based on the electric response from the intersection of the CPB with the conductive probe, the second reference frame associated with the conductive probe.

Probe tip X-Y location identification using a charged particle beam

An automated system for controlling a conductive probe of a nanoprober system in situ to a charged particle beam (CPB) imaging system can include a nanoprober comprising an actuator and a conductive probe; signal measurement circuitry electrically coupled to the conductive probe and to receive an electrical signal from the conductive probe; and a hardware processor to execute operations. The operations can include activating a CPB within a first reference frame, the first reference frame associated with the CPB; causing, by a computerized control system, the CPB and the conductive probe to intersect; measuring an electrical response from the intersection of the CPB with the conductive probe; and determining a location of the conductive probe in a second reference frame based on the electric response from the intersection of the CPB with the conductive probe, the second reference frame associated with the conductive probe.

Nano robotic system for high throughput single cell DNA sequencing

A nano scale robotic system for single cell DNA sequencing of a strand of DNA positioned on a slide utilizes an atomic force microscope (AFM) having an end effector in the form of a cantilever with a tip. The AFM causes its cantilever tip to scan over the base pairs of the DNA strand. A pair of spaced-apart electrodes at the tip makes contact with opposite sides of the DNA strand and the current between bases of the DNA strand is measured by a current measurement system connected to the electrodes. An artificial intelligence-based data analytic system determines the DNA sequence based on the current from the current measuring system. The AFM tip is guided over the DNA strand by comparing compressed desired intensity local scan images and compressed actual intensity local scan images and using the difference to control the location of the tip.

SCANNING SINGLE ELECTRON TRANSISTOR
20250142858 · 2025-05-01 ·

Embodiments of the present disclosure are directed to a side-gated fin field effect transistor configured as a scanning single electron transistor. In a non-limiting embodiment, a scanning single electron transistor includes a fin formed over a substrate. A source gate is formed over a first portion of the substrate that extends over a sidewall of the fin. A drain gate is formed over a second portion of the substrate that extends over the sidewall of the fin. A plunger gate is formed over a third portion of the substrate that extends over the sidewall of the fin. The plunger gate is positioned between the source gate and the drain gate. The plunger gate is etched back from a topmost surface of the fin such that a quantum dot formed in the fin is not screened by metallic materials in the plunger gate.

SCANNING SINGLE ELECTRON TRANSISTOR
20250142858 · 2025-05-01 ·

Embodiments of the present disclosure are directed to a side-gated fin field effect transistor configured as a scanning single electron transistor. In a non-limiting embodiment, a scanning single electron transistor includes a fin formed over a substrate. A source gate is formed over a first portion of the substrate that extends over a sidewall of the fin. A drain gate is formed over a second portion of the substrate that extends over the sidewall of the fin. A plunger gate is formed over a third portion of the substrate that extends over the sidewall of the fin. The plunger gate is positioned between the source gate and the drain gate. The plunger gate is etched back from a topmost surface of the fin such that a quantum dot formed in the fin is not screened by metallic materials in the plunger gate.

PROBE TIP X-Y LOCATION IDENTIFICATION USING A CHARGED PARTICLE BEAM

An automated system for controlling a conductive probe of a nanoprober system in situ to a charged particle beam (CPB) imaging system can include a nanoprober comprising an actuator and a conductive probe; signal measurement circuitry electrically coupled to the conductive probe and to receive an electrical signal from the conductive probe; and a hardware processor to execute operations. The operations can include activating a CPB within a first reference frame, the first reference frame associated with the CPB; causing, by a computerized control system, the CPB and the conductive probe to intersect; measuring an electrical response from the intersection of the CPB with the conductive probe; and determining a location of the conductive probe in a second reference frame based on the electric response from the intersection of the CPB with the conductive probe, the second reference frame associated with the conductive probe.

PROBE TIP X-Y LOCATION IDENTIFICATION USING A CHARGED PARTICLE BEAM

An automated system for controlling a conductive probe of a nanoprober system in situ to a charged particle beam (CPB) imaging system can include a nanoprober comprising an actuator and a conductive probe; signal measurement circuitry electrically coupled to the conductive probe and to receive an electrical signal from the conductive probe; and a hardware processor to execute operations. The operations can include activating a CPB within a first reference frame, the first reference frame associated with the CPB; causing, by a computerized control system, the CPB and the conductive probe to intersect; measuring an electrical response from the intersection of the CPB with the conductive probe; and determining a location of the conductive probe in a second reference frame based on the electric response from the intersection of the CPB with the conductive probe, the second reference frame associated with the conductive probe.

Detection systems in semiconductor metrology tools

A semiconductor metrology tool for analyzing a sample is disclosed. The semiconductor metrology tool includes a particle generation system, a local electrode, a particle capture device, a position detector, and a processor. The particle generation system is configured to remove a particle from a sample. The local electrode is configured to produce an attractive electric field and to direct the removed particle towards an aperture of the local electrode. The particle capture device is configured to produce a repulsive electric field around a region between the sample and the local electrode and to repel the removed particle towards the aperture. The position detector is configured to determine two-dimensional position coordinates of the removed particle and a flight time of the removed particle. The processor is configured to identify the removed particle based on the flight time.

Detection systems in semiconductor metrology tools

A semiconductor metrology tool for analyzing a sample is disclosed. The semiconductor metrology tool includes a particle generation system, a local electrode, a particle capture device, a position detector, and a processor. The particle generation system is configured to remove a particle from a sample. The local electrode is configured to produce an attractive electric field and to direct the removed particle towards an aperture of the local electrode. The particle capture device is configured to produce a repulsive electric field around a region between the sample and the local electrode and to repel the removed particle towards the aperture. The position detector is configured to determine two-dimensional position coordinates of the removed particle and a flight time of the removed particle. The processor is configured to identify the removed particle based on the flight time.

Manufacturing process with atomic level inspection

Costs may be avoided and yields improved by applying scanning probe microscopy to substrates in the midst of an integrated circuit fabrication process sequence. Scanning probe microscopy may be used to provide conductance data. Conductance data may relate to device characteristics that are normally not available until the conclusion of device manufacturing. The substrates may be selectively treated to ameliorate a condition revealed by the data. Some substrates may be selectively discarded based on the data to avoid the expense of further processing. A process maintenance operation may be selectively carried out based on the data.