Proposed are an electrically conductive contact pin, a method for manufacturing the same, an inspection apparatus, a method for manufacturing a molded product, and a molded product manufactured thereby. More specifically, proposed are: a method for manufacturing an electrically conductive contact pin, the method including the steps of providing an anodic aluminum oxide mold made of an anodic aluminum oxide film and having openings formed by etching at least partial regions of the anodic aluminum oxide mold to correspond to a shape of electrically conductive contact pins, forming a metal filler in each of the openings, and removing the anodic aluminum oxide mold; an electrically conductive contact pin including at least one micro-convex portion and a plurality of fine trenches; an inspection apparatus; a method for manufacturing a molded product; and a molded product manufactured thereby.

A substrate testing apparatus configured to perform a hot electron analysis (HEA) test for analyzing a stand-by failure in a substrate includes a heating chuck having a first surface configured to support the substrate and a second surface opposite to the first surface. The heating chuck is configured to heat the substrate and has an aperture passing through the first surface and the second surface. A substrate moving device moves the substrate on the heating chuck in a lateral direction. A camera is under the heating chuck and photographs the substrate, which is exposed by the heating chuck aperture.

The present invention relates to a test method for an unpopulated printed circuit board, comprising the steps of: exposing the unpopulated printed circuit board to temperatures of a reflow soldering process in a first step; and testing the electrical connections of the unpopulated printed circuit board. The present invention further relates to a test device and a method for producing populated printed circuit boards.

A stiffener includes a first upper cover and a second upper cover, a first lateral side cover and a second lateral side cover, and a first longitudinal side cover and a second longitudinal side cover. The first and second upper covers extend in parallel with each other. The first and second lateral side covers are connected to separate, respective covers of the first and second upper covers, and facing each other. The first and second longitudinal side covers are each connected to the both first and second upper covers, the first and second longitudinal side covers facing each other. The first and second upper covers each include a separate plurality of upper elastic portions. Each upper elastic portion of each separate plurality of upper elastic portions has a vertical elasticity.

Various embodiments of the invention provide a system and a method for testing one or more devices under test (DUTs) and for checking one or more test setups. Each of the one or more test setups includes a test board having several sockets for receipt of a DUT. A custom hardware interface is used to electrically connect the test board, such as a burn-in board with a test system configuration having multiple modules that can be configured using a computer device and related software to provide customized testing of the DUTs. The system is scalable to accommodate any DUT having any number of channels and to provide customized testing. Results of the testing are sent to the computing device.

An apparatus for testing electronic components includes a base, a screw rod structure, a first sliding portion, a second sliding portion, a vacuum-based or similar adsorption structure, and a probe. The screw rod structure is fixedly connected to one side of the base. The first sliding portion is slidably positioned on the screw rod structure. The second sliding portion is slidably positioned on the first sliding portion. The adsorption structure is arranged on the second sliding portion. The adsorption structure gathers and holds an electronic component. The probe and the electronic component are arranged to correspond. The probe is electrically connected to a test device. The test device tests the electronic component through the probe.

A system for contactless testing of radio frequency apertures is provided. The system comprises a fixture having a fixture mount operable to be received in a fixture receiver of a robotic system, and a vector network analyzer (“VNA”) supported by the fixture. A radiating antenna is supported by the fixture, and is operable to be connected to the VNA via a cable. Upon movement of the fixture via the robotic system, the VNA, the radiating antenna, and the cable maintain a static positional relationship relative to one another.

An evaluation method is for evaluating a charging connector in coolability by connecting an evaluation jig to the charging connector, the charging connector including a pair of male terminals and a bottom wall, the evaluation jig including a pair of female terminals, the pair of female terminals being connected to the pair of male terminals in evaluating the charging connector in coolability. The method comprises: connecting the pair of female terminals to the pair of male terminals; and adjusting a connection state of the terminals so that contact resistance between the terminals falls within a prescribed range. In the step of adjusting, a resistance between a point of 4.5 mm of the male terminal from a surface of the bottom wall and a point of 43 mm of the female terminal from the surface of the bottom wall is measured as the contact resistance.

An apparatus for testing an Integrated Circuit (IC) to be installed on a product substrate of a Multi-Chip Module (MCM) is disclosed. The apparatus includes a test substrate including (i) a first surface configured to receive the tested IC and at least an additional IC, (ii) a second surface that is opposite the first surface and is configured to receive electrical contacts, and (iii) first electrical traces for conveying electrical signals between the tested IC, the additional IC and the electrical contacts. The apparatus further includes a second electrical trace, which is formed in the test substrate instead of the additional IC and is configured to electrically connect between two of the first electrical traces.

A testing apparatus includes a testing stage and an element pickup module. The test loader includes a testing area and a plurality of terminals arranged within the testing area. The element pickup module includes a mobile arm movable towards the testing stage, an air passage set disposed within the mobile arm and respectively connected to the vacuum pump equipment and the mobile arm, and a pressure-buffering portion. The pressure-buffering portion includes an elastic pad and a plurality of penetrating openings. The elastic pad is disposed on the bottom portion of the mobile arm, and provided with a flat surface for contacting a semiconductor element. The penetrating openings are distributed on the flat surface to connect to the air passage set so that the semiconductor element is fixedly sucked on the flat surface by the vacuum pump equipment through the penetrating openings.