The disclosure includes a contact device for electrical test, the contact device for electrical test including a second body portion, a first body portion stacked above the second body portion, a middle portion stacked above the first body portion, and having a first protrusion that is sharp and has a first apex portion, the first protrusion being formed on an upper side of the middle portion, and the first body portion, the middle portion, and the contact portion are sequentially and upwardly stacked, the middle portion and the contact portion include materials different from each other, and a first protrusion is provided inside the second protrusion.

The present disclosure comprises a joining and/or inspection unit for joining and/or inspecting a component having a base and a plurality of joining and/or inspection elements, wherein the joining and/or inspection elements are arranged at the base such that they each establish a connection and/or carry out an inspection at a joining and/or inspection point of the component. The joining and/or inspection elements can be arranged at the base via an adjustment arrangement that allows an adjustment of the spacing of the joining and/or inspection elements from one another, with the adjustment arrangement preferably comprising a first and second adjustment axle via which the spacing of the joining and/or inspection elements from one another is adjustable in a first and second direction.

A chip testing system including a tray kit, an insertion member mounting apparatus, a testing apparatus, an insertion member detaching apparatus, and a conveying apparatus are provided. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The chip fixing members are fixed to the tray and are configured to carry a plurality of chips. The insertion member mounting apparatus can fix the auxiliary insertion members to a side of the chip fixing members, and the auxiliary insertion members can limit a movement range of the chips in the chip fixing members. The insertion member detaching apparatus can detach the auxiliary insertion members. When the chips are tested, a pressing assembly connected to a temperature adjusting device and reaching a predetermined temperature correspondingly presses a surface of each of the chips.

Provided is a superconducting tape testing device, including lead contacts and a support plate. Each lead contact a conductive contact and a magnet; the magnet is provided with a through hole through which the conductive contact passes, the support plate comprises a plate and a magnetic conductive member; and the magnetic conductive member is fixed on the surface of the plate body.

An inspection jig support tool includes a coupling axis portion having an axis-side fitting portion and being coupled with an inspection head body, an annular coil spring being arranged in an outer periphery of the axis-side fitting portion, and a base portion retaining the coupling axis portion such that the coupling axis portion is capable of being displaced in a radial direction of an axis and in an axial rotation direction. The base portion has a spring retaining portion retaining the annular coil spring while tolerating deformation of the annular coil spring in a radius enlarging direction and a hole-side fitting portion being fitted on the axis-side fitting portion with a gap.

A contactor assembly for a testing system is disclosed. The assembly includes a contact having a contact tail and a housing having a top surface and a bottom surface. A slot extends through the housing from the top surface to the bottom surface and defines a first inner side wall of the housing and a first inner end wall. The contact is receivable in the slot. The contact tail includes a sloped terminus. A retainer is disposed on the first inner side wall. When the sloped terminus is engaged with the first inner end wall, at least a portion of the retainer overlaps with the contact forming at an overlapping area in a cross-sectional view, thereby preventing removal of the contact from the top side of the housing.

A substrate testing apparatus configured to perform a hot electron analysis (HEA) test for analyzing a stand-by failure in a substrate includes a heating chuck having a first surface configured to support the substrate and a second surface opposite to the first surface. The heating chuck is configured to heat the substrate and has an aperture passing through the first surface and the second surface. A substrate moving device moves the substrate on the heating chuck in a lateral direction. A camera is under the heating chuck and photographs the substrate, which is exposed by the heating chuck aperture.

An apparatus and method for determining whether a conductive ring is attached to an electrically conductive shaft. The body of the apparatus includes an electrical contact and at least one magnet in a magnet recess. The at least one magnet may include a first and second conductive region, where the first conductive region is a fixed, first radial distance from a center point of the inner cavity and the second conductive region is a second radial distance from the center point of the inner cavity. A shaft recess of the conductive shaft aligns with the magnet recess when the conductive shaft is inserted into the inner cavity and an electric circuit detects whether a metal ring is secured around the conductive shaft in response to simultaneous contact between: the metal ring and the at least one magnet and the conductive shaft and the electrical contact.

A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Some embodiments described herein include a system that collects and learns reference side-channel normal activity, process it to reveal key features, compares subsequent collected data and processed data for anomalous behavior, and reports such behavior to a management center where this information is displayed and predefine actions can be executed when anomalous behavior is observed. In some instances, a physical side channel (e.g. and indirect measure of program execution such as power consumption or electromagnetic emissions and other physical signals) can be used to assess the execution status in a processor or digital circuit using an external monitor and detect, with extreme accuracy, when an unauthorized execution has managed to disrupt the normal operation of a target system (e.g., a computer system, etc.).