The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.

A burn-in board includes: a board; a socket mounted on the board; a connector attached to the board; a wiring system that is disposed in the board and that connects the socket and the connector; and a compensation circuit that connects to the wiring system and that compensates a frequency characteristic of a signal transmitted through the wiring system.

The invention relates to an adapter device (10, 110, 210) for positioning at least one conductor (68), such as a conductor pair, for example, of a cable (70) to be measured, which adapter device comprises a receiving device (12) and a holding clamp (14) which can be attached to the receiving device (12). Attaching the holding clamp (14) to the receiving device (12) fixes the holding clamp (14) in position and alignment relative to the receiving device (12). The holding clamp (14) is designed to receive and clamp the at least one conductor (68) of the cable (70) to be measured in sections in order to fix said cable in the position and alignment thereof relative to the holding clamp (14), such that an end section of the at least one conductor (68) extends beyond the holding clamp (14).

A fixture for testing electrical equipment. The fixture may have a tool header shaped to releasably engage the test equipment and a plunger that moves generally linearly between a first position and a second position, the first position engaging the test equipment and the second position releasing the test equipment. In some embodiments the tool is header rotatable relative to the plunger. In some embodiments, the tool header is movable relative to the plunger over at least a range of motion of the plunger.

A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.

A method of forming and testing a plurality of monolithic electronic devices is provided. As part of the method a monolithic device array comprising Group III-nitrides is formed on a sacrificial substrate. A test substrate comprising electrical contacts is aligned with electrical contacts of the monolithic device array and bonded to the monolithic device array via bonding dielectric layers. Power is supplied from the test substrate to test the monolithic devices of the monolithic device array. Portions of the sacrificial substrate are then selectively removed to separate each of the monolithic electronic devices, wherein a sacrificial dielectric layer is removed to separate each monolithic electronic device from the test substrate.

An integrated circuit testing assembly, comprising a slab having a slab axis, and a first electrode and second electrode affixed relative to the slab. The first electrode has a first major axis parallel to the slab axis, is coupled to receive a first voltage for coupling to a first set of pins on an integrated circuit, and includes a first surface area facing the slab axis, wherein the first surface area does not include a surface discontinuity. The second electrode has a second major axis parallel to the slab axis, is coupled to receive a second voltage for coupling to second first set of pins on an integrated circuit, and includes a second surface area facing the slab axis, wherein the second surface area does not include a surface discontinuity.

A first base plate includes a plurality of first positioning hole portions, an accommodation portion that accommodates an optical module, a first opening portion, a first pressing portion, and a first engagement portion. A second base plate has a second positioning hole portion that is disposed at a position corresponding to the first positioning hole portion, a second opening portion that is disposed at a predetermined positional relationship with respect to the second positioning hole portion, a second holding portion, a conduction portion, a second pressing portion, a substrate portion, a cover portion, a second hinge portion, and a second engagement portion.

A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

An adapter may be configured to connect a battery and an electrical device to each other. The adapter may include a control board; a battery-side terminal mounted on a first surface of the control board and configured to be electrically connectable to the battery; and a device-side terminal mounted on a second surface of the control board and configured to be electrically connectable to the electrical device, the second surface being opposite from the first surface.