An anisotropic conductive sheet has an insulation layer having a plurality of through-holes and a plurality of conductive layers each arranged on an inner wall surface of each of the plurality of through-holes. Each of the conductive layers has a base layer arranged on the inner wall surface of each of the through-holes and a metal plating layer arranged so as to contact with metal nanoparticles or a metal thin film in the base layer or the metal thin film. The base layer includes metal nanoparticles or a metal thin film and a binder, wherein at least a portion of the binder is arranged between the inner wall of each of the through-holes and the metal nanoparticles or the metal thin film. The binder is a sulfur-containing compound having a thiol group, a sulfide group or a disulfide group.

The present application discloses a battery inspection device. The battery inspection device includes a power supply device, at least one charging port disposed on a surface of the power supply device, at least one display light bar disposed on the surface of the power supply device, and at least one first battery connection line, wherein the first battery connection line is electrically connected to the charging port.

A probe for characteristic inspection of a connector includes a plunger, a coaxial cable, a flange, and a housing having an end portion on one side including an increased diameter portion. A recessed portion which receives the increased diameter portion is in an upper surface of the flange. The increased diameter portion has side walls in contact with or facing respective inner side surfaces of the flange partly, with the inner side surfaces forming the recessed portion, and a bottom wall in contact with an upper recessed surface of the flange that forms the recessed portion. The increased diameter portion has connection surfaces connecting the bottom and side walls and inclined inward from one of the side walls toward the bottom wall. Alternatively, the inner side surfaces each have a first surface inclined downward, and a vertical surface extending downward from the first surface to the upper recessed surface.

The testing apparatus for singulated semiconductor dies comprises a nesting frame and a bottom part, which form a testing device nest adapted to the size of a semiconductor die. A pushing device is provided for an alignment of the semiconductor die in the testing device nest. An engineering plastic layer on the bottom part forms a surface on which the semiconductor die slides during its alignment.

A test socket for an IC includes a socket body, a rotational contact, and an elastomer retainer. The socket body includes a top surface that faces the IC, and a bottom surface that faces a load board. The socket body defines a slot extending from the top surface to an aperture in the bottom surface. The rotational contact is positioned in the slot. The elastomer retainer captures the rotational contact in the socket body and includes a round section about which the rotational contact rotates. The elastomer retainer compresses under translatory force from the rotational contact when translating from the free state to the pre-load state upon engagement with the load board, and compresses under rotational force from the rotational contact when rotating from the pre-load state to the loaded state upon engagement with the IC.

A testing board (i.e., testing fixture) includes a printed circuit board (PCB), an external connection port, and plural coaxial radio frequency (RF) connector sets. The external connection port is located on the printed circuit board. Each of the coaxial RF connector sets includes a top coaxial RF connector and a bottom coaxial RF connector. The top coaxial RF connector and the bottom coaxial RF connector are respectively disposed on a top surface and a bottom surface of the printed circuit board in a coaxial arrangement and electrically connect to the external connection port.

A chip-on-film test board on which a chip-on-film is mounted according to an embodiment of the present disclosure includes a main board in which a test circuit configured to output a test pattern signal is formed, and a chip-on-film fixing part that fixes a position of the chip-on-film.

This anisotropic conductive sheet includes: an insulating layer having a first surface and a second surface; and a plurality of conductive paths which are disposed so as to extend in the thickness direction inside the insulating layer and which are respectively exposed to the outside of the first surface and the second surface. The circumferential surface of the conductive paths includes a region where the surface area ratio represented by equation (1) is at least 1.04. Equation (1): surface area ratio = surface area / area

A solderless test fixture, including a conductive base, a clamp, and a connector is described. The conductive base has at least one cable groove with a cable grounding portion. A clamp is mounted on the base and associated with the cable groove. A connector is associated with the cable groove and has a solderless center terminal aligned with the cable groove and an outer shield being mechanically and electrically connected to the base.

A contactor assembly for a testing system is disclosed. The assembly includes a contact having a contact tail and a housing having a top surface and a bottom surface. A slot extends through the housing from the top surface to the bottom surface and defines a first inner side wall of the housing and a first inner end wall. The contact is receivable in the slot. The contact tail includes a sloped terminus. A retainer is disposed on the first inner side wall. When the sloped terminus is engaged with the first inner end wall, at least a portion of the retainer overlaps with the contact forming at an overlapping area in a cross-sectional view, thereby preventing removal of the contact from the top side of the housing.