A method for electrical testing of a back contact solar cell applies a first side of a temporary passivation sheet to a frontside of a back contact solar cell, the first side of the temporary passivation sheet comprising at least a transparent dielectric layer. The temporary passivation sheet having a second side opposite the first side and comprising at least a transparent conductive coating. A voltage is applied between the transparent conductive coating and base metallization of the back contact solar cell. The frontside of the back contact solar cell is illuminated through the transparent conductive coating and the transparent dielectric layer. Electrical testing is performed on the back contact solar cell. The temporary passivation sheet is removed from the frontside of the back contact solar cell.

The present disclosure generally pertains to testing of secondary batteries. More specifically, the disclosure relates to a movable walk-in chamber for testing secondary cells. According to a first aspect, the present disclosure relates to a movable walk-in chamber for testing secondary cells comprising an enclosure, racking, a plurality of cycler interfaces and cabling. The enclosure form at least one thermally isolated temperature chamber. Furthermore, the enclosure comprises a walking aisle arranged between an entrance and an exit. The racking is arranged at inner walls of the enclosure along the walking aisle. Secondary cells can be inserted in the racking for testing and removed after testing. The plurality of cycler interfaces are arranged at outer walls of the enclosure. Each cycler interface comprises a power interface and one or more cell interfaces. The cabling is arranged to connect the power interfaces to at least one central power connector, whereby cyclers connected to the cycler interfaces can be powered from the movable walk-in chamber. The cabling is also arranged to connect the cell interfaces to poles of secondary cells inserted in the racking, whereby cyclers connected to the cycler interfaces are able to perform testing on cells arranged in the racking.

The present disclosure provides a testing fixture. The testing fixture includes a carrier, a plurality of sets of electrical lines and a plurality of electrical lines. The carrier includes a base and a frame extending along an upper surface of the base. The base and the frame define a first recess, a second recess extending longitudinally from the first recess, and a third recess extending transversely from the first recess. The plurality of sets of electrical contacts are disposed on the base and arranged in a rotationally symmetrical manner, and the electrical lines are electrically connected to the plurality of sets of electrical contacts.

The invention relates to a device for positioning a semiconductor die in a wafer prober, the device comprising a carrier plate and a clamp on a front surface of the carrier plate, the dimensions of the carrier plate matching a standard geometry required by the wafer prober for receiving a semiconductor wafer to be probed by the wafer prober, the clamp being reversibly movable against a force of an elastic element between an open position and a closed position, the clamp being adapted for fixing the die on the carrier plate in the closed position and for releasing the die in the open position.

A test device for testing electric properties of an object. The test device includes an object support unit configured to support an object; a cover unit configured to include a cover body coupled to the object support unit and a pusher supported by the cover body so as to move toward and away from the object; and a pressure adjuster configured to include a multi-stage adjusting cam which is rotatably provided in the cover body while contacting the pusher and has a multi-stage contact pressing portion with contact radii varied depending on rotated angles so that the pusher can be in a moving-back position and be positioned at a plurality of pressing distances from the cover body, and an operation unit which operates the multi-stage adjusting cam.

A probe card includes a substrate module having an installation hole and a first stair-shaped structure provided on two stairs thereof with a first connection surface and a first transmission surface having a first contact pad, a probe module having a probe and a second stair-shaped structure provided on two stairs thereof with a second connection surface and a second transmission surface having a second contact pad electrically connected with the probe, and a pressing member. The probe module is disposed in the installation hole so that the first and second connection surfaces are connected and the first and second transmission surfaces are opposite. The pressing member is detachably pressed on the probe module to press the second connection surface against the first connection surface and make the first and second contact pads electrically connected.

A manufacturing method of contact probes for a testing head comprises the steps of:—providing a substrate made of a conductive material; and—defining at least one contact probe by laser cutting the substrate. The method further includes at least one post-processing fine definition step of at least one end portion of the contact probe, that follows the step of defining the contact probe by laser cutting, the end portion being a portion including a contact tip or a contact head of the contact probe. The fine definition step does not involve a laser processing and includes geometrically defining the end portion of the contact probe with at least a substantially micrometric precision.

A test fixture includes a signal test board, a circuit routing, and a branch routing. The signal test board includes a first surface and a second surface. The first surface has a first pin and a test point. The second surface has a second pin. The circuit routing is located in the signal test board and configured to connect the first pin and a corresponding second pin. A portion of the circuit routing includes an upper routing connected with one first pin, a lower routing connected with one second pin, and a via-hole routing connected with two ends of the upper routing and the lower routing. One end, connected with the via-hole routing, of the upper routing is located in a projection area of the corresponding test point. The branch routing is located in the signal test board and configured to connect the test point with a corresponding upper routing.

The present disclosure relates to the field of display technology, in particular to a test fixture, comprising a pressing connection mechanism (1), an eccentric mechanism (2), and a working carrier (3), the pressing connection mechanism (1) and the working carrier (3) being arranged correspondingly, and the rotation of the eccentric mechanism (2) driving the pressing connection mechanism (1) to move up and down in a Y direction so as to conduct a signal pressing connection test for a tested product on the working carrier (3). The test fixture has a simple structure and steady properties, easy to be operated and maintained conveniently.

A detecting device for detecting a usage state of a socket includes a carrier, a movable assembly and a conductivity detecting module. The carrier has a first plug hole and a second plug hole. The movable assembly is movably disposed in the carrier. The conductivity detecting module is disposed on the carrier. The movable assembly is moved for exposing the first plug hole and the second plug hole by an external pushing force, and a detecting signal of the socket in-use is generated by the conductivity detecting module according to movement of the movable assembly.