Proposed is a conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, wherein the conductive particle has a predetermined depth d and has a length l that is greater than a width w, the conductive particle having a body part in a pillar shape, a first convex part having an upper surface, formed in a top of the body part, and a second convex part having a lower surface, formed in a bottom of the body part.

The present invention relates to a chip-fixing device for a socket, which comprises a fixing base body and a movable stop. The socket is assembled in a socket-accommodating recess of the fixing base body. The movable stop is assembled in the fixing base body and controlled in such a manner that a stopper is moved between a first position and a second position, wherein the first position refers to a position where the stopper is located right above the socket, and the second position refers to a position where the stopper is not located right above the socket. Accordingly, the socket-accommodating recess can be used to install sockets of different sizes, and the movable stop can drive the stopper to restrict a chip from falling off the socket or drive the stopper to release the chip, depending on presence or absence of an external force.

An inspection system configured to inspect a device within a substrate is provided. The inspection system includes an inspection module, an alignment module, a supporting device and a fixing device. The inspection module has multiple testers and multiple inspection chambers. The multiple testers are allowed to be accommodated in the multiple inspection chambers, respectively. The alignment module has an aligner. The aligner is placed in an alignment space. The aligner is configured to adjust a position of the substrate to be inspected with respect to one tester of the multiple testers, which is accommodated in the alignment space. The supporting device is configured to support the tester accommodated in the alignment space from below. The fixing device is configured to fix the tester accommodated in the alignment space in cooperation with the supporting device.

A testing device with power protection includes a power interface and a testing platform. The testing platform includes a casing, a fixed frame and a sliding frame. The power interface is disposed at one surface of the casing. The fixed frame covers the power interface. One side of the fixed frame formed with an entrance that exposes the power interface outwards from the fixed frame. The sliding frame includes a rack body slidably that is located on the casing, and a shielding door that is rotatably connected to the rack body for covering the entrance of the fixed frame. When the rack body is slid towards the power interface so as to rotate the shielding door away from the entrance by the fixed frame, the power interface is exposed outwards from the fixed frame through the entrance.

An electrical contactor capable of coping with an electrical test under a high temperature environment and realizing reliable positioning is provided. An electrical contactor includes: a planar body portion formed of a conductive member; an upper arm having a cantilever beam structure, including an upper base extending integrally and continuously upward from the body portion, an upper supporting portion extending in a horizontal direction from the upper base along the body portion, and a first distal end extending vertically upward from the upper supporting portion to make electrical contact with a first contact target; a lower arm having a cantilever beam structure, including a lower base extending integrally and continuously downward from the body portion, a lower supporting portion extending in a horizontal direction from the lower base along the body portion, and a second distal end extending vertically downward from the lower supporting portion to make electrical contact with a second contact target; a first positioning portion extending upward from one end of the body portion; and a second positioning portion extending upward from near the other end of the body portion.

A first light source is directed at an outer surface of a workpiece in an inspection module. The light from the first light source that is reflected from the outer surface of the workpiece is directed to the camera via a first pathway. The light from the first light source transmitted through the workpiece is directed to the camera via a second pathway. A second light source is directed at the outer surface of the workpiece 180° from that of the first light source. The light from the second light source that is reflected from the outer surface of the workpiece is directed to the camera via the second pathway. The light from the second light source transmitted through the workpiece is directed to the camera via the first pathway.

A method for extracting characteristics of broadband passive element includes: acquiring an open condition measurement S-parameter, a first short condition measurement S-parameter, and a second short condition measurement S-parameter that are S-parameter values measured for each of three connection conditions of the broadband passive element at a first port which is one direction of the broadband passive element; deriving optimal resistance, optimal inductance, and optimal capacitance by performing an RLC optimization process of the three connection conditions of the broadband passive element; and extracting the S-parameter of the broadband passive element based on the obtained open condition measurement S-parameter, first short condition measurement S-parameter, and second short condition measurement S-parameter, and the derived optimum resistance, optimum inductance, and optimum capacitance.

The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.

A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.

A test apparatus comprising a tester interface board (TIB) affixed in a slot of a tester rack, wherein the TIB comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT). The test apparatus further comprises a carrier comprising an array of DUTs, wherein the carrier is operable to slide into the slot of the tester rack, and wherein each DUT in the array of DUTs aligns with a respective socket on the TIB. Further, the test apparatus comprises a plurality of socket covers, wherein each socket cover of the plurality of socket covers is operable to actuate a top portion of each DUT of the array of DUTs in the carrier.