A clamp-type probe device comprises a first pressed member, a second pressed member and a probe head. The first pressed member comprises a first clamping portion and a first mounted portion connected to each other, and has a first and a second assembly holes. The second pressed member comprises a second clamping portion and a second mounted portion connected to each other. The second and the first mounted portions are connected to each other. The second and the first clamping portions are separated from each other. The probe head comprises a plurality of contacting members. Each contacting member comprises two bending portions. Two ends of each contacting member are respectively disposed through the first and the second assembly holes. The two bending portions are respectively pressed against an inner side surface of the first assembly hole and an inner side surface of the second assembly hole.

A clamp-type probe device comprises a first pressed member, a second pressed member and a probe head. The first pressed member comprises a first clamping portion and a first mounted portion connected to each other, and has a first and a second assembly holes. The second pressed member comprises a second clamping portion and a second mounted portion connected to each other. The second and the first mounted portions are connected to each other. The second and the first clamping portions are separated from each other. The probe head comprises a plurality of contacting members. Each contacting member comprises two bending portions. Two ends of each contacting member are respectively disposed through the first and the second assembly holes. The two bending portions are respectively pressed against an inner side surface of the first assembly hole and an inner side surface of the second assembly hole.

An electrical connecting device includes a probe head, and probes for measurement and probes for confirmation held by the probe head. The probe head holds the probes for measurement and the probes for confirmation in a state in which the respective tip ends are exposed therefrom. An exposed length from the probe head to the tip end is shorter for the probes for confirmation than for the probes for measurement.

A semiconductor device for testing a semiconductor wafer includes a circuit board, a probe disposed below the circuit board and facing the semiconductor wafer, an integrated substrate disposed between the circuit board and the probe, and signal-transmitting module disposed on the circuit board and next to the integrated substrate. The probe is electrically coupled to the circuit board through the integrated substrate, and the signal-transmitting module transmits a test signal to the probe through the integrated substrate and the circuit board to perform a test to the semiconductor wafer. Another semiconductor device including the integrated substrate and a manufacturing method thereof are provided.

Some aspects of this disclosure are directed to an automated method to check electrostatic discharge (ESD) effect on a victim device. For example, some aspects of this disclosure relate to a method, including determining a probe point, in a circuit design, for determining effective resistance between the probe point and ground, where the probe point is on an ESD path of in the circuit design. The method includes determining voltage between the probe point and the ground. The method further includes comparing, by a processing device, a resistance value of the ESD path determined based a predefined electric current value at a source point and the measured voltage with a target resistance value range. The method further includes reporting a violation upon determining that the determined resistance value of the ESD path is outside the target resistance value range.

A contact probe having a first end portion and a second end portion, a probe body extended along a longitudinal development direction between the first end portion and the second end portion is disclosed. The probe body has a pair of arms separated by a slot and extending according to the longitudinal development direction and a conductive insert extended along the longitudinal development direction, in a bending plane of the contact probe. The conductive insert is made of a first material and the contact probe is made of a second material and the first material has a lower electrical resistivity than an electrical resistivity of the second material. The conductive insert is a power transmission element of the contact probe and the arms are structural support elements of the contact probe during a deformation of the probe body.

The present disclosure provides a semiconductor testing apparatus with a connected unit, which is applied to a wafer probing testing or a final testing. The semiconductor testing apparatus comprises a semiconductor testing printed circuit board, a functional module and the connected unit. First contact points are disposed on a first surface of the semiconductor testing printed circuit board, and electrically connected to the functional module. Second contact points are disposed on a second surface of the semiconductor testing printed circuit board, and electrically connected to a functional controller. The first contact points and the second contact points have independent and non-interfering working time domains. Therefore, the present disclosure can utilize the area of the semiconductor testing printed circuit board, and can independently perform functional testing of a wafer or packaged integrated circuit devices using multiple time domains, in a multi-time domain, synchronous or asynchronous manner.

The present disclosure provides a probe cable assembly comprising a probe interface configured to couple to a measurement interface and to receive a differential signal, a measurement output interface configured to output the differential signal, and a cable arrangement electrically arranged between the probe interface and the measurement output interface and configured to conduct the differential signal between the probe interface and the measurement output interface, the cable arrangement comprising a cable, a plurality of magnetic elements arranged around at least a section of the length of the cable, wherein each magnetic element is separated by a gap from adjacent magnetic elements, and a plastically deformable guiding element configured to fix the cable arrangement with a predetermined relative position between the probe interface and the measurement output interface.

Disclosed is a test socket. The test socket includes a first block comprising a first base member of a conductive material and a first insulating member of an insulating material, a second block comprising a second base member of a conductive material and a second insulating member of an insulating material, a gap member of an insulating material, interposed between the first block and the second block, a first probe supported being in contact with the first base member and being not in contact with the second base member, a second probe supported being not in contact with the first base member and being in contact with the second base member, and electronic parts provided in the gap member and placed on a conductive path by which the first base member and the second base member are electrically connected.

An example probe for a test system includes a conductor to carry direct current (DC) signals between a DC testing resource and a signal trace on the test system, where the signal trace is for carrying the DC signals and alternating current (AC) signals to and from a device under test; and an inductor connected in series with the conductor. A mechanism is included in the probe for enabling the conductor to move toward the signal trace or a pin electrically connected to the signal trace to create an electrical connection between the conductor and the signal trace to enable the testing resource to transmit the DC signals to the signal trace, and to move away from the signal trace or the pin so that no electrical connection is created between the conductor and the signal trace when the DC signals are not to be transmitted to the signal trace.