Methods and apparatus for a current sensor having an elongate current conductor having an input and an output and a longitudinal axis. First, second, third and fourth magnetic field sensing elements are coupled in a bridge configuration and positioned in a plane parallel to a surface of the current conductor such that the second and fourth magnetic field sensing elements comprise inner elements and the first and third magnetic field sensing elements comprise outer elements. Embodiments of the sensor reduce the effects of stray fields on the sensor.

A sensor circuit may comprise or otherwise be connected to a transformer. The transformer may comprise a primary winding and a secondary winding. The primary winding may be configurable and/or connectable to sense a current flow in the primary winding. A configurable circuit with an output may be connected to the input of a comparator circuit. The output of the comparator circuit and one or both of the input of the configurable circuit or the output of the configurable circuit may connect across the secondary winding.

A current-measuring transducer device has a current transducer for measuring an electric current along a conduction path. The current transducer has a magnetic field-sensitive element for converting the magnetic field resulting from the current flow along the conduction path into at least one physical variable and a measuring device for measuring the physical variable. The current transducer device has a coil arrangement with at least one coil for simulating the magnetic field resulting from the current flow along the conduction path. There is also described a method for calibrating a corresponding current transducer and a computer program product for performing the calibration method.

A current measurement apparatus includes: a current sensing element generating a signal according to a current to be measured; a current measurement means measuring an amount of the current to be measured from the signal outputted from the current sensing element; a communication unit receiving system information from at least one upper-level controller; a correction amount calculation unit calculating information on an amount of a corrected current based on the amount of the current to be measured and the system information; and a measurement operation unit outputting the information on the amount of the corrected current to the at least one upper-level controller.

A current sensor circuit package includes a primary conductor having an input portion into which a current flows, an output portion from which the current flows, and an exposed portion, wherein the input and output portions have a reduced area edge. A secondary lead has an elongated portion that is offset with respect to the exposed portion of the secondary lead. A semiconductor die is disposed adjacent to the primary conductor on an insulator portion and at least one magnetic field sensing element is supported by the semiconductor die. A package body enclosing the semiconductor die and a portion of the primary conductor includes a first cutout in a first side edge configured to expose the reduced area edge of the input portion of the primary conductor and a second cutout on a second side edge configured to expose the reduced area edge of the output portion of the primary conductor, wherein the first side edge of the package body is substantially parallel with respect to the second side edge of the package body.

A current sensor is described comprising an integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad and a housing comprising material embedding the integrated circuit arranged for allowing electric connection to the at least two contact pads of the active side of the integrated circuit. The housing comprises at least one conductive via disposed outside the integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the integrated circuit.

A power semiconductor module includes: an electrically insulative frame having opposite mounting sides and a border wall that defines a periphery of the frame; a substrate seated in the frame; power semiconductor dies attached to the substrate; signal pins attached to the substrate and electrically connected to the power semiconductor dies; a busbar attached to the substrate and extending through the border wall; a receptable in the border wall configured to receive a current sensor module and that exposes part of the busbar, the exposed part of the busbar having an opening; and a rotation bar jutting out from a sidewall of the receptable and onto the exposed part of the busbar without obstructing the opening in the busbar, wherein the rotation bar forms an axis of rotation within the receptable. A power electronic assembly that incorporates the power semiconductor module and corresponding method of production are also described.

Various embodiments of the present disclosure provide a power device including at least one first conductive element adapted to generate a magnetic field when traversed by a current, and characterised in that it further comprises a Hall sensor electrically insulated from the first conductive element. The sensor and the first conductive element are mutually arranged so as to detect said magnetic field indicative of the current that traverses the first conductive element.

A current transformer having a body having an upper half and a lower half hingedly connected to the upper half, a pair of ferrite cores located within one of the upper half and the lower half of the body, the pair of ferrite cores defining a gap formed between each ferrite core of the pair of ferrite cores, and a sensor located within the gap formed between each ferrite core of the pair of ferrite cores.

A magnetic sensor system includes two magnetic sensors that detect components in two directions of an external magnetic field, an additional magnetic field generation section, and a signal processing circuit. The additional magnetic field generation section is capable of generating two additional magnetic fields for use in measuring the sensitivities of the two magnetic sensors. The signal processing circuit includes a sensitivity measurement processing section and a detection signal correction processing section. The sensitivity measurement processing section measures the sensitivities based on data concerning changes in the detection signals of the two magnetic sensors when the additional magnetic field generation section is controlled to generate two additional magnetic fields. The detection signal correction processing section performs processing for reducing change components attributable to the two additional magnetic fields on the detection signals of the two magnetic sensors.