A sensor device comprises a dielectric substrate, a busbar mechanically connected to the dielectric substrate, a cavity formed in the dielectric substrate, and a sensor chip arranged in the cavity, wherein the sensor chip is designed to detect a magnetic field induced by an electric current flowing through the busbar, wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar.

A magnetic field detection apparatus includes a magnetoresistive effect element and a helical coil. The magnetoresistive effect element includes a magnetoresistive effect film extending in a first axis direction. The helical coil includes a parallel connection including first and second parts extending in a second axis direction inclined with respect to the first axis direction. The first and second parts are adjacent to each other in a third axis direction and coupled to each other in parallel. The helical coil is wound around the magnetoresistive effect element while extending along the third axis direction. The magnetoresistive effect film overlaps the first and second parts in a fourth axis direction orthogonal to the second and third axis directions. The helical coil is configured to be supplied with a current and thereby configured to generate an induction magnetic field to be applied to the magnetoresistive effect film in the third axis direction.

A die pad, a signal processing IC, an adhesive layer, and at least one magnetoelectric conversion element included in a magnetic sensor are encapsulated by a molding resin. At least a part of the first end surface of the signal processing IC is positioned on a side closer to the at least one magnetoelectric conversion element than a first end surface of the die pad on a side of the at least one magnetoelectric conversion element in a plan view. An isolation portion into which the molding resin enters is provided between the first surface of the die pad on a side of the first end surface, and the first surface of the signal processing IC on a side of the first end surface, and a thickness of the isolation portion is smaller than a thickness of the die pad.

System and methods for high accuracy, non-intrusive current sensing are provided. A system may include two magnetic field sensors configured for differential sensing. The system may further include frontend circuitry configured to remove direct current (DC) offset of the magnetic field sensors, upconvert the outputs of the magnetic field sensors, and filter out at least one frequency component from the up-converted signals. The system may receive output signals from the front-end circuitry corresponding to each sensor. The system may further calculate a differential signal based on the output signals. The system may apply optimal detection based on the differential signal and a reference signal to calculate a measurement of current flow. The system may determine a phase angle measurement between the differential signal and the reference signal to calculate a direction of the current flow in the conductor and output various measurement information related to the detected current.

A current sensor has: a magnetism detection unit that can detect a component, in a first direction, of a magnetic field generated when a current flows in a current path; a shield member that can block an external magnetic field; a circuit board on which the magnetism detection unit is mounted; and a fixing member, composed of a magnetic material, that fixes the shield member to the circuit board. The first direction is parallel to the front surface of the circuit board. The shield member has two opposing plates placed so that their plate surfaces face each other in the first direction. The magnetism detection unit is placed by being interposed between the two opposing plates in the first direction. The fixing member extends toward both sides of the magnetism detection unit in the first direction when viewed along the normal of the front surface of the circuit board.

A current sensor according to the present invention includes a bus bar through which a measuring current flows; a nut with which the bus bar and an external terminal are brought into contact with and fastened to each other; a magnetic sensor capable of detecting a magnetic field generated when a current flows through the bus bar; a case member having a housing area in which the magnetic sensor is allowed to be housed, the case member sealing the bus bar and the nut inside; and a cover member provided over the housing area. The case member has an open part in which a portion of the nut is exposed. The open part is covered by an insulative protective member. Therefore, shavings generated when a bolt for fastening an external terminal is screwed into the nut are prevented from dropping to the outside of the current sensor.

A current measuring device for detecting a current in an electric line includes: a housing; a fastening device arranged on the housing for fastening the housing to a supporting rail; and at least one magnetic field sensor. The housing has a first housing part and a second housing part which together form an accommodating device for accommodating an electric line between the first and second housing parts. The first and second housing parts are separable from one another in order to place an electric line onto the current measuring device and placeable onto one another in order to accommodate the electric line in the accommodating device between the first and second housing parts. The at least one magnetic field sensor detects a magnetic field on the electric line accommodated in the accommodating device.

A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.

A magnetic sensor includes a magnetic-field detector including magneto-resistance elements, and a shield. Since the feedback coil is disposed so as to overlap with the magnetic-field detector, and the shield is disposed so as to overlap with the feedback coil, the cancellation field of the feedback coil makes it difficult to cause magnetization saturation. The shield is annular in shape as viewed from a direction normal to the shield. This allows maintaining the magnetic-field shielding action of the shield to enhance the effect of shielding the magnetic field in a direction perpendicular to the sensitivity.

A current detection device includes a plurality of current detection units arranged in the current detection device. Each of the current detection units includes a bus bar that enables a current to be measured to flow therethrough, a magnetic sensor disposed at a position facing the bus bar, and a pair of shields disposed so as to sandwich the bus bar and the magnetic sensor in a facing direction in which the bus bar and the magnetic sensor face each other. The bus bars of the plurality of current detection units extend so as to be aligned to one another and, as viewed in the facing direction, the positions of the shield and the magnetic sensor of each of the current detection units in an extension direction of the bus bars differ from the positions of the shield and the magnetic sensor of the adjacent current detection unit.