A current sensing device includes a housing with a head adapted for releasably holding a wire of an electrical circuit without breaking the electrical circuit. The head has one or more current sensors configured to sense direct current in the wire without breaking the electrical circuit. The housing includes an alarm to indicate if the current sensing device senses a current in the electrical wire above a predefined threshold current. The head has a clip base and clip member that form an internal channel to closely receive the electrical wire and to releasably hold the electrical wire for testing. In some embodiments, the head has an internal channel that intersects the outer surface of the head and forms a longitudinal opening to allow insertion of the wire into the internal channel. The current sensing device has a processor programed to calibrate the current sensing device to compensate for electrical noise.

A method includes placing a semiconductor device package in a test handler, the semiconductor device package having leads of a first portion of a package substrate extending from a mold compound and leads of a second portion isolated from the first portion extending from the mold compound; contacting the first portion with a first and a second conductive slug; contacting the second portion with a third and a fourth conductive slug; contacting a first surface of the mold compound with a first plunger having a conductive plate and an insulating tip; contacting an opposite second surface of the mold compound with a second plunger having a conductive plate and an insulating tip; and placing a high voltage on the first conductive slug while placing approximately half the high voltage on the conductive plate of the first plunger, and placing a ground voltage on the third conductive slug.

A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.

A current detection device includes a plurality of current detection units arranged in the current detection device. Each of the current detection units includes a bus bar that enables a current to be measured to flow therethrough, a magnetic sensor disposed at a position facing the bus bar, and a pair of shields disposed so as to sandwich the bus bar and the magnetic sensor in a facing direction in which the bus bar and the magnetic sensor face each other. The bus bars of the plurality of current detection units extend so as to be aligned to one another and, as viewed in the facing direction, the positions of the shield and the magnetic sensor of each of the current detection units in an extension direction of the bus bars differ from the positions of the shield and the magnetic sensor of the adjacent current detection unit.

A current sensor system for measuring an AC electrical current, includes: a busbar having a beam shaped portion having a length and a width; a sensor device comprising two sensor elements spaced apart from each other in the width direction of the beam shaped portion. The sensor device is configured for measuring a magnetic field difference or a magnetic field gradient, and for determining the AC current based on said difference or gradient.

Electrical current transducer including an insulating body, a magnetic core comprising a central passage and a magnetic circuit gap, a magnetic field detector positioned in the magnetic circuit gap, and a sheet metal leadframe conductor arrangement comprising a primary conductor for carrying the current to be measured and secondary conductors for connecting the magnetic field detector to an external circuit, the primary conductor comprising a central portion extending through the central passage of the magnetic core, lateral extension arms extending from opposite ends of the central portion, and connection ends for connection to an external conductor, the secondary conductors comprising a plurality of conductors, each conductor comprising a sensing cell connection pad substantially aligned with the central portion of the primary conductor and a connection end for connection to the external circuit, the insulating body comprising an inner overmold portion surrounding a central portion of the primary conductor and forming a core guide positioning and insulating the magnetic core with respect to the leadframe conductor arrangement. The insulating body further comprises an outer overmold portion molded over the inner overmold portion, the magnetic core, magnetic field sensor, and a central portion of the leadframe conductor arrangement.

The present invention relates to a current-sensor structure comprising a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction and optionally parallel to a conductor surface. The current-sensor structure can comprise a substrate on which the conductor is disposed. The current sensor can be located on a side of the conductor opposite or orthogonal to a surface of the substrate. The current sensor can be aligned with, near to or adjacent to an edge of the conductor. The current-sensor structure can comprise a shield, such as a U-shaped laminated shield that at least partially surrounds the conductor and the current sensor.

To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.

A current-sensor structure comprises a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces and an edge. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction. The current sensor is aligned with the edge of the conductor or the conductor has a width W and the current sensor is within a distance of W/2.5, W/3, W/4, W/5 or W/6 of the conductor edge. The current-sensor structure can comprise a substrate on which the conductor is disposed.

A current detection device of an embodiment includes a conductor, a first magnetic field detector, a second magnetic field detector, and a conductive film. The conductor includes a first region, a second region, and a third region connecting an edge of the first region and an edge of the second region. The first magnetic field detector is disposed between the first and second regions. The second magnetic field detector is disposed opposite to the first magnetic field detector with respect to the third region. The conductive film is bonded to a conductor layer including a slit having a width larger than each of widths of magneto-sensitive parts of the first and second magnetic field detectors and covers the slit, the conductor layer being provided between the conductor and each of the first and second magnetic field detectors.