Two ferromagnetic elements are disclosed that delimit a region for an electrical conductor, in which a current intensity should be measured. Each ferromagnetic element has an end surface. The end surfaces of the two ferromagnetic elements face each other and delimit an air gap. A magnetic field sensor is arranged in the air gap or near the air gap. The region delimited by the ferromagnetic elements is open on a side opposite the air gap and can thus receive the electrical conductor. The current intensity is measured by means of a magnetic field measurement. The ferromagnetic elements can be, in particular, L-shaped.

A current sensor system, includes: a plurality of conductors that are integrated into a substrate, each of the plurality of conductors having a respective first through-hole formed therein and a plurality of current sensors, each of the plurality of current sensors being disposed on the substrate. Each of the plurality of current sensors is disposed above or below the respective first through-hole of a different one of the plurality of conductors, and the substrate includes a plurality of conductive traces, each coupled to at least one of the plurality of current sensors.

A non-intrusive electrical current detector system and method is disclosed. In one example, the system includes a magnetic field sensing device and a controller. The system provides a user with a way to monitor the running status of an electrical device, without the need to make electrical connections or separating conductors in a multi-conductor cable.

An electronic component fixation structure disclosed in the present application includes a holding member which, being made of an insulating material, is formed of a storing portion which stores a main body portion of an electronic component, a protection portion which surrounds a plurality of connection terminals of the electronic component, and a pair of protrusion portions which protrude upward from the respective central portions of a pair of side walls of the protection portion; and a wiring substrate on which to connect between electronic components, wherein the pair of protrusion portions of the holding member are engaged with the wiring substrate, and the plurality of connection terminals of the electronic component are solder connected to the wiring substrate.

Magnetic sensors each disposed to face each of current paths for each of windings with 2n phases (n is a multiple of three) in an AC rotating machine are included, and when each of a DC component and an AC component in a d-axis sum current and a q-axis sum current obtained by performing a dq-transformation into a two-axis coordinate system on 2n detection currents on the assumption that all current amplitudes of the windings are the same is represented collectively with each of terms expressed by sine functions with different phases to one another, each of the current paths at each of 2n current path arrangement positions is arranged to have a positional relationship where error components are reduced by cancellation among coefficients included at least in one of the terms or by cancellation among values of the terms.

A semiconductor package includes a leadframe forming a plurality of leads with a die attach site, a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of solder joints, a set of solder joint capsules covering each of the set of solder joints against the leadframe, a clip mounted to the leadframe over the semiconductor die with a clip solder joint. The solder joint capsules restrict flow of the solder joints of the semiconductor die contacts in the flip chip configuration such that the solder remains in place if remelted during later clip solder reflow.

A magnetic probe-based current measurement device and measurement method is disclosed. The device comprises a conductor for a current under test, a magnetic probe, a magnetic bias structure, and a programmable chip. A conductor has a first axis, a second axis, and a third axis. The conductor is provided with through holes. The direction of the through holes are parallel to the third axis. Vertical projections of the through holes on a first cross section are symmetric about the first axis. At least one of the through holes has a center position located on the first axis. And/or every pair of the through holes have center positions that are symmetric about the first axis. The magnetic probe is provided within the through holes, and is electrically connected to the programmable chip. A sensitive center position of the magnetic probe is located on the first cross section. A vertical projection of the magnetic probe on the first cross section is symmetric about the first axis. The magnetic bias structure is provided within the through holes. A magnetization direction of the magnetic bias structure is perpendicular to a sensitive direction of the magnetic probe. The device is small size and has the advantages of high measurement accuracy, and high adaptability

A battery sensor for detecting a current flowing through an electrical conductor, wherein the battery sensor has at least two mutually independent measuring devices for detecting the current flowing through the electrical conductor. The measuring devices are structurally and/or electrically completely isolated from one another.

A semiconductor module includes a semiconductor die, an encapsulation encapsulating the die, and first and second power contacts electrically coupled to the die. The power contacts each include an external part exposed from the encapsulation and an overlapping part. The power contacts are configured to carry respective first and second currents. A current flow of the first current in the external part of the first power contact points into or out of the semiconductor module. A current flow of the second current in the external part of the second power contact points in the opposite direction of the first current flow. The overlapping parts overlap such that the current flows point in the same direction in the overlapping parts. The overlapping parts include overlapping slots configured to accept a current sensor element for measuring a combined current in the overlapping parts.

A current sensor includes: plate-shaped bus bars; a magnetic detection portion; and a shell holding the bus bars. The bus bars are arranged in a first direction. At least some of the bus bars have: a first conductor portion extending in the first direction; a second conductor portion connected to one end of the first conductor portion and extending in a second direction crossing the first direction; and a third conductor portion connected to the other end of the first conductor portion and extending in a third direction. The bus bars at least include first and second bus bars adjacent in the first direction, where the width of the first conductor portion is greater than the thickness thereof, and when viewed from the third direction, the first conductor portions of the first and second bus bars are spaced apart from each other by a certain distance in the second direction.