Patent classifications
G01R27/205
Electrical apparatus and method for determining earth state of electrical apparatus
A method capable of effectively detecting an earth state and an electrical apparatus using the same are provided. The electrical apparatus includes a first detection unit for detecting whether there is power between a power supply line L and an earth line G and outputting a first detection signal, a second detection unit for detecting whether there is power between a neutral line N and the earth line G and outputting a second detection signal, and an earth state determining unit for determining an earth state according to the first detection signal and the second detection signal and determining whether a power supply is connected in a normal phase or a reversed phase.
Monitoring circuitry
In an example, monitoring circuitry includes a first and a second coupling to electrically connect the monitoring circuitry to a monitored circuit having a resistance. The resistance of the monitored circuit may be indicative of a status, and the monitored circuit may be connected in series between the first and second coupling. The first coupling comprises a plurality of galvanically separated connection elements which are to form an electrical connection with a common connection element of the monitored circuit. The monitoring circuitry further comprises a monitoring apparatus to determine the resistance of the monitored circuit via the first coupling and the second coupling. The monitoring apparatus is to acquire a plurality of electrical values and to use the plurality of electrical values to determine a value of the resistance of the monitored circuit.
Jig for connector current evaluation
The evaluation jig comprises a pair of female terminals connectable to a pair of male terminals of a charging connector and an adjustment member capable of adjusting contact resistance of the female terminal and the male terminal. The female terminal is reducible in diameter. The adjustment member includes an annular band attached to an outer peripheral surface of the female terminal and formed in an annulus surrounding the female terminal, a metal band attached to an outer peripheral surface of the annular band and capable of applying external force to the female terminal to reduce the female terminal in diameter, and an adjustment unit capable of adjusting the external force applied by the metal band to the female terminal. The annular band is made of an electrically and thermally insulating material.
S/D CONTACT RESISTANCE MEASUREMENT ON FINFETS
A contact resistance test device includes a set of full fins providing channels between a source region and a drain region and a set of partial fins connected to the source region. A gate structure is formed over the set of full fins and set of partial fins. A source contact is connected to the source region. A probe contact is isolated from the source contact and is connected to the source region wherein a voltage measured on the probe contact measures contact resistance when a drain-to-source current is flowing in the set of full fins.
DETECTING DEVICE AND DETECTING METHOD FOR DETECTING A USAGE STATE OF A SOCKET
A detecting device for detecting a usage state of a socket includes a carrier, a movable assembly and a conductivity detecting module. The carrier has a first plug hole and a second plug hole. The movable assembly is movably disposed in the carrier. The conductivity detecting module is disposed on the carrier. The movable assembly is moved for exposing the first plug hole and the second plug hole by an external pushing force, and a detecting signal of the socket in-use is generated by the conductivity detecting module according to movement of the movable assembly.
Thermal cycler for PCR
An instrument for performing highly accurate PCR employing an assembly, a heated cover, and an internal computer, is provided. The assembly is made up of a sample block, a number of Peltier thermal electric devices, and a heat sink, clamped together. A control algorithm manipulates the current supplied to thermoelectric coolers such that the dynamic thermal performance of a block can be controlled so that pre-defined thermal profiles of sample temperature can be executed. The sample temperature is calculated instead of measured using a design specific model and equations. The control software includes calibration diagnostics which permit variation in the performance of thermoelectric coolers from instrument to instrument to be compensated for such that all instruments perform identically. The block/heat sink assembly can be changed to another of the same or different design. The assembly carries the necessary information required to characterize its own performance in an on-board memory device, allowing the assembly to be interchangeable among instruments while retaining its precision operating characteristics.
Methods and systems for testing bonding of a sensor assembly
A lidar sensor assembly includes a detector array having a plurality of photodetectors. An integrated circuit is bonded to the detector array via a plurality of connection bumps. A reference trace is defined by conductive material on at least one of the integrated circuit and the detector array. A test trace is defined by conductive material on the detector array, at least two of the connection bumps, and conductive material on the integrated circuit. A resistance measuring device is configured to independently measure a reference resistance along the reference trace and a test resistance along the test trace. The assembly also includes a processor in communication with the resistance measuring device. The processor is configured to receive the reference resistance and the test resistance, subtract the reference resistance from the test resistance to produce a bond resistance, and compare the bond resistance to a predetermined resistance value.
DISPLAY DRIVING DEVICE
Disclosed is a display driving device including a bonding resistance measurement circuit. The display driving device may include: first and second pads bonded to a pad of a display panel through a wire and configured to provide bonding resistance; and a bonding resistance measurement circuit configured to measure the bonding resistance by comparing an input voltage applied to the bonding resistance through the first pad to one or more preset reference voltages.
METHODS AND STRUCTURE TO PROBE THE METAL-METAL INTERFACE FOR SUPERCONDUCTING CIRCUITS
A method of measuring contact resistance at an interface for superconducting circuits is provided. The method includes using a chain structure of superconductors to measure a contact resistance at a contact between contacting superconductor. The method further includes eliminating ohmic resistance from wire lengths in the chain structure by operating below the lowest superconducting transition temperature of all the superconductors in the chain structure. The measurement is dominated by contact resistances of the contacts between contacting superconductors in the chain.
Method and device for obtaining internal side, external side insulation resistances of relay, and battery management system
Provided is a method and device for obtaining internal side and external side insulation resistances of a relay. The method includes: controlling an insulation resistance obtaining circuit to output an AC signal; when both a main relay and a pre-charge relay are switched off, obtaining a first phase shift of the AC signal between two sampling points according to first collected electrical signals; obtaining an internal side insulation resistance of the main relay according to the first collected electrical signals and the first phase shift; controlling the pre-charge relay to be switched on; when the main relay is switched off and the pre-charge relay is switched on, obtaining a second phase shift of the AC signal between the two sampling points according to second collected electrical signals; and obtaining an external side insulation resistance of the main relay according to the second collected electrical signals and the second phase shift.