A circuit and method for detecting a failure of a switching power device is disclosed. The circuit and method utilize a Kelvin connection of a four-terminal configuration of the switching power device to sense a resistance of at least one wire-bond. The resistance corresponds to a defect or defects in the at least one wire-bond and so it can be used to detect a failure before damage occurs. A threshold used for detecting the failure can be adjusted to accommodate variations in the switching power device and/or the application in which it is being used. Additionally, the failure detection is carried out at a period after the switching power device is turned ON to prevent switching transients from affecting the detection.

The present invention concerns a method and device for monitoring the gate signal of a power semiconductor (SI), the gate signal of the power semiconductor (SI) being provided by a gate driver (12), generates an expected signal (VGexp) that corresponds to the signal outputted by the gate driver (12) when no deterioration of the gate driver (12) and/or of the power semiconductor (SI) and/or of a load linked to the power semiconductor (SI) exists, compares the expected signal (VGexp) and the signal (VGmeas) outputted by the gate driver (12), determines if a deterioration of the gate driver (12) and/or of the power semiconductor (SI) and/or of a load linked to the power semiconductor (SI) exists using the result of the comparing of the expected signal (VGexp) and the signal (VGmeas) outputted by the gate driver (12).

According to one embodiment, a degradation detection device includes a driving circuit that supplies a driving signal that controls on/off of an output transistor to the output transistor and an output circuit that compares a value of integral of an output current that is output by the output transistor in an off-state thereof over a predetermined period of time with a predetermined threshold when the output transistor is turned from an on-state thereof to an off-state thereof and outputs a signal that indicates a degradation state of the output transistor depending on a result of such comparison.

A method and a system for online monitoring of a health status of an insulated-gate bipolar transistor (IGBT) module are provided, which belong to the field of IGBT status monitoring. In order to overcome the inability to real-time monitor health statuses of existing IGBT modules, the method of the disclosure includes the following steps. A current sensor is used to measure a collector current of each IGBT module. A collected current value is substituted into a simulation model to obtain a current imbalance rate. A failure module is located according to the current imbalance rate and temperature to achieve the objective of monitoring an IGBT health status.

A circuit and method for detecting a failure of a switching power device is disclosed. The circuit and method utilize a Kelvin connection of a four-terminal configuration of the switching power device to sense a resistance of at least one wire-bond. The resistance corresponds to a defect or defects in the at least one wire-bond and so it can be used to detect a failure before damage occurs. A threshold used for detecting the failure can be adjusted to accommodate variations in the switching power device and/or the application in which it is being used. Additionally, the failure detection is carried out at a period after the switching power device is turned ON to prevent switching transients from affecting the detection.

A method for determining an output voltage of a transistor, the transistor comprising an input electrode, a first output electrode and a second output electrode, the potential of the first output electrode being higher than the potential of the second output electrode the output voltage being the difference in potential between the first output electrode and the second output electrode. The method includes a step for measuring the evolution over time of a control voltage of the transistor, the control voltage being the difference in potential between the input electrode and the second output electrode, and determining the output voltage from the measured control voltage.

In an embodiment, a method for testing a functional integrity of a transistor component, the method includes causing a first change of a charge state of an internal capacitance between control terminals of the transistor component; determining a capacitance value of the internal capacitance based on the first change of the charge state; causing a second change of the charge state of the internal capacitance; and evaluating a resistance value of an internal resistance between the control terminals based on the determined capacitance value and the second change of the charge state.

Aspects of the present application are directed to an automated test equipment (ATE) and methods for operating the same for testing high-power electronic components. The inventor has recognized and appreciated an ATE that provides both high-power alternating-current (AC) and direct-current (DC) testing in a single test system can lead to high throughput testing for high-power components with reduced system hardware complexity and cost. Aspects of the present application provide a synchronized inductor switch module and both a high-precision digitizer and a high-speed digitizer for capturing DC and AC characteristics of a high-power transistor.

Performance measuring circuitry, for determining relative operational performance attributes of different types of a class of semiconductor component disposed on a semiconductor die, includes a first oscillator circuit including a plurality of first circuit element modules having a first circuit topology. The first oscillator circuit provides a first performance indication indicative of a collective performance attribute of all types of components in the class. A second oscillator circuit separate from the first oscillator circuit includes a plurality of second circuit element modules having a second circuit topology, and provides a second performance indication responsive to different contributions from different types of components in the class. A comparison circuit receives outputs of the first and second oscillator circuits and determines the relative performance characteristic of the different types of components. Dice may be binned according to performance, for use in assembly of operational circuits with different performance characteristics.

A circuit for detecting faults affecting a power transistor comprises a conditioning circuit, a first fault status circuit, and a fault signaling circuit. The power transistor is turned on and off by assertion and de-assertion, respectively, of an input signal. The conditioning circuit produces a conditioned gate voltage signal from a gate voltage of the power transistor. The first fault status circuit asserts a first fault indication when the conditioned gate voltage signal is greater than a first fault reference voltage during a first interval after the assertion of the input signal. The fault signaling circuit asserts a fault signal in response to the first fault indication being asserted, and de-asserting the fault signal in response to the input signal being de-asserted.