A test system for a memory card includes a first circuit board. One side of the first circuit board is provided with a plurality of contact groups spaced apart from each other along a row direction. Another side of the first circuit board is provided with slots disposed along the row direction. The test system further includes a second circuit board. The second circuit board is provided with a test circuit, and is inserted into the slot along a direction perpendicular to the first circuit board. The second circuit board provides a test signal to the contact groups.

An apparatus for detecting a wiring short in a substrate includes a voltage source configured to apply a rising or falling measurement voltage to a first wiring of a substrate, a plurality of electrodes including first and second electrode elements capacitively coupled to the first and second wirings of the substrate, respectively, a sensing circuit configured to generate an output voltage based on a voltage or a current between the first and second electrode elements, and a processor configured to determine whether a short circuit connection having a resistance value greater than a reference resistance value is present between the first and second wirings based on a change rate of the output voltage after application of the measurement voltage. Methods for detecting wiring shorts in the substrate are further provided.

An example apparatus includes a block configured to connect mechanically to a circuit board. The circuit board includes a first conductive path running to a first electrical contact on the circuit board and a second conductive path running to a second electrical contact on the circuit board. The first electrical contact and the second electrical contact are arranged in an area of the circuit board. The block includes a component having a surface that is configured to cover at least part of the area. A conductive layer is attached to at least part of the surface. The conductive layer is for creating a short circuit between the first electrical contact and the second electrical contact following connection of the block to the circuit board.

A method for testing mass-produced PCBs and other electronic components more efficiently, the method includes setting testing parameters based on historical test data and a target decision index, obtaining a first specified number of the target objects to have the full test, and calculating a first yield based on the current test result. The method determine whether the first yield is less than the first yield threshold yield, and obtaining a second specified number of the target objects from the remaining target objects to have the full test, and calculate a second yield when the first yield is larger than or equal to the first yield threshold value. The method further determine whether the second yield is less than the second yield threshold value according to a second comparing command and select some of the remaining target objects to have a sampling test.

An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards.

A printed circuit board (PCB) includes a plurality of layers disposed at different depths of the PCB, circuit components disposed at different layers of the PCB, and a plurality of temperature measurement sensors located at one or more layers of the PCB, where each temperature measurement sensor is associated with a corresponding circuit component. A measured temperature is obtained at an embedded temperature measurement sensor located at an embedded layer within the PCB, and the measured temperature is correlated with an electrical property of an embedded circuit component located at the same embedded layer within the PCB as the embedded temperature measurement sensor. A plurality of moisture measurement sensors can also be located at one or more layers of the PCB to facilitate a measured moisture with an electrical property of an embedded circuit component.

A method for testing a printed circuit board is provided. The method includes accessing a list of conductive lands of a printed circuit board to be tested and forming a list of pairs of adjacent conductive lands, based on adjacency assessment in the list of conductive lands. The method includes performing high-potential testing on the printed circuit board, on each of the pairs of adjacent conductive lands.

A wire detection device and a wire detection method are provided. The wire detection device includes: a chamber body including a first side and a second side arranged opposite to each other; an electrode arranged at the second side of the chamber body; particles arranged within the chamber body; and a signal applying circuit configured to apply an electric signal to at least one wire to be tested arranged at the first side.

A test fixture holding without risk of any surface marking or damage to a product being tested includes a base with a circuit board, a needle seat, and a side push structure. The needle seat includes probes and first receiving cavity for holding the product. An opening in a sidewall of the first receiving cavity exposes one end of the side push structure. One end of the probe connects with the circuit board, other end of the probe is in the needle seat. With product in the first receiving cavity, the side push structure pushes the product against the sidewalls and the product is depressed to abut against the needle seat and the needles which are moved into the first receiving cavity to make contact with to the product. A testing machine having the test fixture is also provided.

A method for testing a printed circuit board is provided. The method includes accessing a list of conductive lands of a printed circuit board to be tested and forming a list of pairs of adjacent conductive lands, based on adjacency assessment in the list of conductive lands. The method includes performing high-potential testing on the printed circuit board, on each of the pairs of adjacent conductive lands.