A method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. short to ground connection is added for every back-drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re-drilling the hole or via. Failed back-drills may be detected in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost-effective repair and guarantees back-drill failures do not pass into the field.

The present invention provides a method for detecting and adjusting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. This is accomplished, by after detecting poor back drills in a PCB, measuring the actual thickness of each PCB board. Next, the measured actual thickness of each PCB board is compared with .the theoretical thickness of each PCB board. The back drill depth for each area of the PCB board is then adjusted for its theoretical thickness and percent variation from the measured thickness to adjust the poor back drill.

Presented is a residual ionic contamination measurement device. The device comprises a component body defining at least one surface, and conductive traces along at least one surface of the component body defining at least one connection configured to connect the conductive traces by at least one of direct and indirect means to an electrical parameter measurement device, the conductive traces configured to remain in a passive state until connected to the electrical parameter measurement device, wherein when the conductive traces are connected to the electrical parameter measurement device, a signal is generated indicative of a level of residual ionic contamination.

A flexible circuit board inspecting apparatus for conducting an inspection on a flexible circuit board includes a transport path and an inspection part mechanism. The transport path is configured to successively transport the flexible circuit board having a plurality of unit circuit boards arranged thereon. The inspection part mechanism is configured to bring and distance a jig for inspecting the flexible circuit board transported on the transport path close to and from the flexible circuit board. The transport path includes a longitudinal transport portion for transporting the flexible circuit board in a downward vertical direction. The inspection part mechanism moves the jig in a direction perpendicular to the flexible circuit board transported on the longitudinal transport portion to bring and distance the jig close to and from the flexible circuit board.

A flexible circuit board and a cutting device are provided. The flexible circuit board includes a board body including a cutting region. A plurality rows of testing terminals are located in the cutting region, a first spacing being provided between two adjacent rows of testing terminals. The testing terminals can be respectively cut off from the board body along a cutting direction which is along the extending direction of the first spacing in the board body. A testing circuit is located on a surface of the board body. The testing circuit is arranged in a region outside the cutting region and the testing circuit is independently and electrically connected to each row of the testing terminals.

A high bandwidth signal probe device and a method of probing a high bandwidth signal are provided. The high bandwidth signal probe device includes a probe tip for probing a stub of a backdrilled via of a printed circuit board. The probe tip is adapted to fit in the backdrilled via. The probe tip has a length adapted to reach the stub of the backdrilled via. The probe tip is adapted to contact a plated portion of the stub of the backdrilled via. A resistive element is associated with the probe tip. The method includes inserting a probe tip of a signal probe device in the backdrilled via, placing the probe tip in contact with a plated portion of the stub of the backdrilled via, and receiving an electrical signal through a path which includes a resistive element of the probe tip of the signal probe device.

A printed wiring board includes: a laminated body that has a plurality of wiring layers laminated therein; a first through hole that electrically connects two or more wiring layers with each other; and a second through hole that has strength to expansion and contraction of the laminated body less than in the first through hole.

A printed wiring board includes: a laminated body that has a plurality of wiring layers laminated therein; a first through hole that electrically connects two or more wiring layers with each other; and a second through hole that has strength to expansion and contraction of the laminated body less than in the first through hole.

A printed circuit board (PCB) test system and method including temperature chamber including at least one slot to accommodate at least one PCB test coupon, input bus connected to inputs of the at least one slot, and output bus connected to outputs of the at least one slot, wherein temperature chamber is configured to apply a temperature to the at least one PCB test coupon; signal generator including output bus connected to the input bus of the at least one slot, frequency meter comprising an input bus connected to the output bus of the at least one slot and an output bus, and a comparator connected to the output bus of the signal generator and the output bus of the frequency meter for comparing corresponding outputs of the signal generator and the frequency meter.

A device for measuring a property of a substrate comprises an enclosure, two resonators, and two probes. The substrate has a top surface, and the enclosure defines a cavity for placing the substrate. The resonators extend into the cavity of the enclosure. The probes extend into the cavity, and each of the probes comprises a loop that extends about an axis that is substantially parallel to the top surface of the substrate so that the probes are operable to excite a transverse magnetic mode signal in the cavity.