A method estimates a level of damage or a lifetime expectation of a power semiconductor module having at least one die that is mechanically and electrically attached to a ceramic substrate. The ceramic substrate has piezoelectric properties and the method includes: controlling the at least one power die, the control of the at least one power die generating changes in the electrical potential across the ceramic substrate; obtaining information representative of a mechanical deformation of the ceramic substrate; determining if a notification indicating the level of damage or the lifetime expectation has to be performed according to the obtained information and reference information; and notifying the level of damage or the lifetime expectation if the determining step determines that the notification has to be performed.

An electric short-circuit device has a first electric contact piece, a second electric contact piece, and a component made of an electrical semiconductor crystalline material which blocks the flow of an electric current between the first contact piece and the second contact piece in at least one direction. An actuator is configured to apply a mechanical force to the component in response to an electric trigger signal and thereby at least partly destroy the crystalline structure of the component.

Disclosed is a test and measurement switch matrix. The test and measurement switch matrix includes a solid state switch to couple a test signal from a Device Under Test (DUT) to a test system. The solid state switch has a dual tee guard arrangement providing low leakage when off. The solid state switch also includes an optically coupled drive, which further improves isolation and reduces undesirable charge injection when changing switch states.

Various devices, systems and methods are disclosed where a noise signal component of a sensor signal is used to obtain information about a sensor device. A device may include an evaluation circuit that is configured to receive a sensor signal having a noise signal component, and the evaluation circuit is further configured to evaluate the noise signal component to obtain information about a sensor device generating the sensor signal.

A self-check system and a method thereof are disclosed. In the self-check system, a memory stores a safety check program, a main application program and a predetermined checksum data. The safety check program include a circuit check program, a watchdog circuit reset program and a checksum check program. When a chip system is powered on, a processing unit executes the main application program, and then executes an interrupt call to generate an interrupt, so as to execute the safety check program and the circuit check program to check a to-be-checked circuit. The processing unit also executes the watchdog circuit reset program to reset a counting value of a watchdog circuit. The processing unit also executes the checksum check program to calculate a checksum data of the first safety check program, and reset the chip system when the calculated checksum data is not equal to the predetermined checksum data.

A system, computer readable medium, and a method for monitoring power module degradation in a vehicle are provided. The method includes determining a structure function of a power module, determining a change in the structure function based on a comparison between the structure function and an initial or baseline structure function associated with the power module, outputting a degradation determination result based on the change in the structure function, and generating an alert when the degradation determination result exceeds a predetermined or adaptively determined degradation criterion value.

Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

Disclosed is a detachable modularized test platform. The detachable modularized test platform includes a gantry, a control box and a jig box, where a test area is arranged on the jig box, an air cylinder is arranged on the gantry, a control assembly is mounted in the control box, and a test assembly is mounted in the jig box; during testing, a sample to be tested is placed on the test area, and the upper computer sends an instruction to control the air cylinder to extend a driving rod to move to the sample to be tested; and the upper computer sends the instruction to the control assembly in the control box, to complete testing of the sample, and output and upload test data to a server for saving. The present invention employs a modularized structure, which reduces a size, detection is convenient, and applicability is high.

The present invention provides an electrostatic charge detecting packaging device comprising a carrier, multiple dies, and multiple electrostatic-charge-sensitive components; the carrier has a surface; the dies are mounted on the surface of the carrier; and the electrostatic-charge-sensitive components are mounted on the surface of the carrier; since an electrostatic voltage tolerance of each of the electrostatic-charge-sensitive components is lower than an electrostatic voltage tolerance of each of the dies, accumulated electrostatic charges are more likely to discharge towards the electrostatic-charge-sensitive components than towards the dies, and as such, by electrically testing whether the electrostatic-charge-sensitive components are functioning normally when packaging the dies, the present invention allows personnel to debug for knowing which packaging steps exactly cause more serious problems that lead to damaging electrostatic discharges in the dies.

The present invention concerns a method for estimating a level of damage or a lifetime expectation of a power semiconductor module comprising at least one die that is mechanically and electrically attached to a ceramic substrate. The ceramic substrate has piezoelectric properties and the method comprises the steps of: controlling the at least one power die, the control of the at least one power die generating changes in the electrical potential across the ceramic substrate, obtaining information representative of a mechanical deformation of the ceramic substrate, determining if a notification indicating the level of damage or the lifetime expectation has to be performed according to the obtained information and reference information, notifying the level of damage or the lifetime expectation if the determining step determines that the notification has to be performed.