Disclosed is a test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Techniques are disclosed to determine the temperature-dependent insertion loss and propagation delay of traces in a printed circuit board design. For example, an example method includes determining a first temperature at a first portion of a trace of a PCB design based on a thermal map of the PCB design. The method further includes determining a second temperature at a second portion of the trace based on the thermal map. The method further includes calculating a temperature-dependent property of the PCB at the first portion based on the first temperature. The method further includes calculating the temperature-dependent property of the PCB at the second portion based on the second temperature. The method further includes calculating at least one of a signal loss and propagation delay on the trace based on the temperature-dependent property of the PCB at the first portion and the second portion.

A method of measuring electromagnetic interference (EMI) to noninvasively identify component degradation or failure in power electronics circuitry. The method involves characterizing the degradation or failure characteristics of the component and modeling those characteristics to enable a machine learning algorithm to identify EMI frequency distribution characteristics that correspond to the degradation or failure. The EMI frequency distribution is measured and the data provided to the machine learning algorithm whereupon the algorithm identifies degradation or failures indicated by the measured data.

Various devices, systems and methods are disclosed where a noise signal component of a sensor signal is used to obtain information about a sensor device. A device may include an evaluation circuit that is configured to receive a sensor signal having a noise signal component, and the evaluation circuit is further configured to evaluate the noise signal component to obtain information about a sensor device generating the sensor signal.

A system, computer program product, and computer-executable method for detecting defects in an interconnect, the system, computer program product, and computer-executable method comprising receiving a data measurement relating to the interconnect, analyzing the data measurement, and determining whether the interconnect includes a defect based on the analyzing of the data measurement isolated from the impedance of the interconnect.

A system, computer readable medium, and a method for monitoring power module degradation in a vehicle are provided. The method includes determining a structure function of a power module, determining a change in the structure function based on a comparison between the structure function and an initial or baseline structure function associated with the power module, outputting a degradation determination result based on the change in the structure function, and generating an alert when the degradation determination result exceeds a predetermined or adaptively determined degradation criterion value.

Disclosed is a test and measurement switch matrix. The test and measurement switch matrix includes a solid state switch to couple a test signal from a Device Under Test (DUT) to a test system. The solid state switch has a dual tee guard arrangement providing low leakage when off. The solid state switch also includes an optically coupled drive, which further improves isolation and reduces undesirable charge injection when changing switch states.

Disclosed is a detachable modularized test platform. The detachable modularized test platform includes a gantry, a control box and a jig box, where a test area is arranged on the jig box, an air cylinder is arranged on the gantry, a control assembly is mounted in the control box, and a test assembly is mounted in the jig box; during testing, a sample to be tested is placed on the test area, and the upper computer sends an instruction to control the air cylinder to extend a driving rod to move to the sample to be tested; and the upper computer sends the instruction to the control assembly in the control box, to complete testing of the sample, and output and upload test data to a server for saving. The present invention employs a modularized structure, which reduces a size, detection is convenient, and applicability is high.

According to one embodiment, an information processing system includes a memory, an inputter, and a processor. The memory stores correlation information including a specification item group, an element item group, and a risk item group. The specification item group includes specification items. The element item group includes element items. The risk item group includes risk items. One of the specification items to be modified is selected by a first operation input to the inputter. One of the element items is selected by a second operation input to the inputter. When the first operation is input, the processor refers to the correlation information and extracts at least one of the element items having a correlation with the one of the specification items. The processor extracts at least one of the risk items having a correlation with one element item of the at least one of the element items selected.

Various devices, systems and methods are disclosed where a noise signal component of a sensor signal is used to obtain information about a sensor device. A device may include an evaluation circuit that is configured to receive a sensor signal having a noise signal component, and the evaluation circuit is further configured to evaluate the noise signal component to obtain information about a sensor device generating the sensor signal.