An integrated circuit (IC) having a heat-generating element, such as a power MOSFET, a current-carrying conductor coupled to the heat-generating element, a sense conductor adjacent the current-carrying conductor, and a failure-detection circuit coupled to the sense conductor. When thermal cycling of the IC causes the resistance of the sense conductor to become greater than a temperature-dependent threshold value, the failure-detection circuit generates a signal indicating that the integrated circuit will soon fail. The resistance of the sense conductor is determined by injecting a current into the sense conductor to generate a voltage. The temperature-dependent threshold value is a voltage generated by injecting a current into a reference conductor disposed away from the current-carrying and sense conductors. A voltage comparator compares the two voltages to generate the output. Alternatively, the failure-detection circuit includes a processor that calculates the temperature-dependent threshold value from a temperature measurement taken on the integrated circuit.

A semiconductor chip is provided with first and second electrode pads, a first current detector, and a third electrode pad. The first and second electrode pads are both to be wire-bonded to a first lead terminal. The first current detector is connected between the first and second electrode pads. The third electrode pad is wire-bonded to a second lead terminal. A first closed circuit is configured by the first lead terminal, the first electrode pad, the first current detector, and the second electrode pad. An induced current flows through the first closed circuit when a current generating an induced electromotive force is applied to the third electrode pad. The first current detector is configured to output different values depending on whether the induced current exceeds a threshold value or not.

A circuit board tester and method that precisely aligns the probe plate and circuit board is disclosed. With a circuit board and probe plate mounting within a housing having a top and bottom, hinged together, at closure there may be slight misalignments of the two. By making one of the two plates floating, or laterally slideable with respect to each other, it is possible to make final alignment at closure. One of the two plates can be provided with a pin and the other with a pin receiving alignment block. With the lateral slideability, the pin and block can insure proper probe alignment. Additional systems for correcting misaligned pins or blocks are also disclosed.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

An identification circuit for determining a chassis identification and a slot identification within the chassis using a single reading. The circuit includes a first electrical component associated with a first slot of a first chassis, where the first electrical component has a first value. A second electrical component is associated with a second slot of the first chassis, where the second electrical component has a second value that is different from the first value. A removable card has a third electrical component with a third value, where the removable card inserts into a selected one of the first slot and the second slot of the first chassis. A measuring circuit measures an interaction between the third electrical component and the associated one of the first electrical component and the second electrical component, where the interaction has a fourth value. The fourth value of the interaction identifies both the first chassis and the selected slot into which the removable card is inserted.

Provided are a flexible circuit mother board and a detection method. The flexible circuit mother board includes flexible circuit daughter boards, at least one detection terminal group and external pad groups corresponding to the flexible circuit daughter boards in one-to-one correspondence. Each flexible circuit daughter board has a bonding pad area adjacent to a corresponding one of the plurality of external pad groups. Each detection terminal group detects at least one flexible circuit daughter board, and each of the at least one detection terminal group comprises a plurality of detection terminals. Each flexible circuit daughter board includes a plurality of capacitors including a first electrode plate and a second electrode plate. Each of the first electrode plate and the second electrode plate is electrically connected to one detection terminal.

Systems, devices and methods for high-speed I/O margin testing can screen high volumes of pre-production and production parts and identify cases where the electrical characteristics have changed enough to impact operation. The margin tester disclosed is lower cost, easier to use and faster than traditional BERT and scopes and can operate on the full multi-lane I/O links in their standard operating states with full loading and cross-talk. The margin tester assesses the electrical receiver margin of an operation multi-lane high speed I/O link with a device under test simultaneously in either or both directions. In a technology-specific form, an embodiment of the margin tester can be implemented as an add-in card margin tester to test motherboard slots of a mother board under test, or as a as a motherboard with slots to test add-in cards.

An electrical connection device includes: a plurality of probes (10) in which distal end portions contact an inspection object (2) during measurement; and a space transformer (30) including a plurality of connection wirings (33), in each of which a first terminal electrically connected to any of proximal end portions of the plurality of probes (10) is arranged on a first main surface (301), and a second terminal is exposed to a second main surface (302), and having a short-circuit wiring pattern formed on the first main surface, the short-circuit wiring pattern electrically connecting, to the same connection wiring (33), proximal end portions of a plurality of same-potential probes (10) set at a same potential during measurement among the plurality of probes (10).

A display device includes a defect inspection circuit, and a display panel having a display area and a peripheral area positioned outside the display area. The display panel includes a sensing wire positioned in the peripheral area and connected to the defect inspection circuit. The defect inspection circuit includes a resistance detection circuit that detects a resistance of the sensing wire based on an output signal corresponding to the sensing wire, a memory that stores first resistance information related to the resistance of the sensing wire detected in a first inspection operation, and a comparator circuit including a first comparator that compares the first resistance information with second resistance information. The second resistance information is related to the resistance of the sensing wire detected in a second inspection operation that is performed at a different time than the first inspection operation.

Provided are a circuit board and production method therefor, a circuit device and production method therefor, and a printing material container assembly. The circuit board is mounted on a printing material container. The circuit board includes an original circuit board and an auxiliary part. The original circuit board includes multiple terminals configured to be in contact with the printing material container or a printing device. The auxiliary part is disposed on the original circuit board and is configured to perform at least one of the following: providing a conductive path or breaking off a conductive path between the terminals.