An electronic assembly includes a board and a system mounted to the board. The system includes an impedance matching circuit coupled to a contactless component. A detection circuit operates to carrying out a process for detecting on the board of potential faults in the system mounted to the board. The detection circuit includes a circuit incorporated into the contactless component itself and configured to carrying out a first part of the process for detecting. A processing circuit of the detection circuit performs a second part of the process for detecting based on results of the first part.

A test array structure includes a substrate, first and second cells, first and second bit-line rings and four word-lines. Each of the first and second cells has a first drain region, a first gate region, a source region, a second gate region and a second drain region connected together in sequence. The first drain region and the first gate region of the first cell are located within the first bit-line ring. The second drain region and the second gate region of the first cell are located between the first and second bit-line rings. The first drain region and the first gate region of the second cell is located within the second bit-line ring. The second drain region of the first cell and the first drain region of the second cell are located between the two immediately-adjacent word-lines.

A semiconductor device includes first and second power supply terminals to which a first power supply voltage is supplied, a third power supply terminal to which a second power supply voltage is supplied, a power supply wiring coupled to the first and second power supply terminals, an abnormality detection circuit which diagnoses the first power supply terminal, a first current generation circuit which flows a current from the power supply wiring to the third power supply terminal in a diagnosis, and a second current generation circuit which couples to the power supply wiring at a vicinity of the first power supply terminal and flows a current from the power supply wiring to the third power supply terminal in the diagnosis. And, the abnormality detection circuit compares a voltage of the first current generation circuit with a voltage of the second current generation circuit in the diagnosis.

A stiffener of a probe card includes: a body plate arranged between a test head and a printed circuit board (PCB) of the probe card, wherein the test head is configured to apply a test signal to an object, and the PCB is configured to receive the test signal; a plurality of ribs radially extending from the body plate; an inner rim configured to surround the body plate to connect middle portions of the ribs with each other; and a plurality of contact members arranged on upper surfaces of at least two ribs among the ribs, and configured to make contact with the test head.

Embodiments are generally directed to a buried electrical debug access port. An embodiment of an apparatus includes a substrate or printed circuit board; one or more electronic components coupled with the substrate or printed circuit board; one or more electrical access ports coupled with the substrate or printed circuit board, each electrical access port including electrically conductive material; and an encapsulant material, the encapsulant material encapsulating the one or more access ports, wherein the one or more access ports are electrically connected to one or more circuits of the apparatus to provide debugging access to the apparatus.

Included are an insulating plate 41 including a plurality of insulating synthetic resin layers, wiring circuits 44a, 44b, and 44c provided in the insulating plate 41, a thin-film resistor 46 formed to be buried in the insulating plate 41 and electrically connected to the wiring circuits 44a, 44b, and 44c, a heat dissipating portion 47 provided over one surface of the insulating plate to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers and having higher heat conductivity than that of the insulating plate 41, a pedestal portion 48 formed to be buried in the insulating plate 41 and provided to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers on an opposite side of the heat dissipating portion 47 and having higher heat conductivity than that of the insulating plate 41, and a heat dissipation and pedestal connecting portion 49 connecting the heat dissipating portion 47 to the pedestal portion 48 and having higher heat conductivity than that of the insulating plate 41.

A method for testing a printed circuit board includes providing a printed circuit board having a first main section, a second main section, a bent connecting section and at least one monitoring conductor track. The connecting section is disposed between the first main section and the second main section. The monitoring conductor track runs from the first main section, in a curved manner through the connecting section, to the second main section. At least one electrical measurement value which is representative of the integrity of the at least one monitoring conductor track is detected. A printed circuit board, a control unit and methods for producing the printed circuit board and for operating the control unit are also provided.

A method of assessing a cleanliness of an assembly in a panel during a manufacturing process is provided, wherein an electrical signal of at least one of a predetermined voltage, current or frequency is applied across a first subset and a second subset of nonconnected electrical contacts in a test coupon associated with the assembly, such that the first subset and the second subset have different pitches. In one configuration, the test coupon is tested at higher voltages, currents or frequencies to a point of failure or above a predetermined threshold.

Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a flexible sideband support system comprises a load board, testing electronics coupled to the load board, a controller coupled to the testing electronics. The load board is configured to couple with a plurality of devices under test (DUTs), wherein the load board includes in-band testing ports and sideband testing ports. The testing electronics is configured to test the plurality of DUTs, wherein a portion of testing electronics are organized in sideband resource groups. The controller is configured to direct testing of the DUTs, wherein the controller is coupled to the testing electronics and the controller directs selective allocation of the testing electronics in the sideband resource groups to various testing operations of the DUTs. In one exemplary implementation, the controller directs a portion of sideband testing of a plurality of DUTs concurrently.

Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a flexible sideband support system comprises a load board, testing electronics coupled to the load board, a controller coupled to the testing electronics. The load board is configured to couple with a plurality of devices under test (DUTs), wherein the load board includes in-band testing ports and sideband testing ports. The testing electronics is configured to test the plurality of DUTs, wherein a portion of testing electronics are organized in sideband resource groups. The controller is configured to direct testing of the DUTs, wherein the controller is coupled to the testing electronics and the controller directs selective allocation of the testing electronics in the sideband resource groups to various testing operations of the DUTs. In one exemplary implementation, the controller directs a portion of sideband testing of a plurality of DUTs concurrently.