The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.

A test apparatus and an automatic test equipment having the same are disclosed. The test apparatus includes a test head having a test area, a socket board combined to the test area of the test, the socket board including a socket body and an active device attached on a first surface of the socket body, the active device configured to operate a semiconductor package, and a heat exchanger arranged on an upper portion of the test head, the heat exchanger being in contact with the socket board.

A test system is provided. The system includes a first test apparatus and a second test apparatus. A device power supply of the first test apparatus (ATE) is electrically connected with a device under test (DUT) through a driving branch (F) and a detecting branch (S), the driving branch (F) being configured to provide an original driving current to the DUT b the device power supply during testing, and the detecting branch (S) being configured to detect an effective driving current reaching the DUT. The second test apparatus includes a first voltage drop branch, the first voltage drop branch is connected to the detecting branch (S), and a voltage drop detected by the driving branch (F) is used to determine an effectiveness of an electrical connection formed between the driving branch and the device under test, and an electrical connection formed between the detecting branch (S) and the DUT.

A method includes placing a semiconductor device package in a test handler, the semiconductor device package having leads of a first portion of a package substrate extending from a mold compound and leads of a second portion isolated from the first portion extending from the mold compound; contacting the first portion with a first and a second conductive slug; contacting the second portion with a third and a fourth conductive slug; contacting a first surface of the mold compound with a first plunger having a conductive plate and an insulating tip; contacting an opposite second surface of the mold compound with a second plunger having a conductive plate and an insulating tip; and placing a high voltage on the first conductive slug while placing approximately half the high voltage on the conductive plate of the first plunger, and placing a ground voltage on the third conductive slug.

Examples described herein provide a wearout card and a method for using the wearout card. The wearout card generally includes a first set of connectors configured to connect the testing apparatus to a testing controller, and a second set of connectors configured to connect the testing apparatus to a device under test (DUT). The wearout card can also include a memory configured to store identifying information of the testing apparatus and a use counter indicating a number of times different DUTs have been connected to the second set of connectors.

A probe tip for an isolated probe having a triaxial cable has a conductive probe tip interface at one end of the cable, a signal conductor, the signal conductor traversing a length of the cable and electrically connected to the conductive probe tip interface, a reference conductor surrounding the signal conductor along the length of the cable, a shield conductor surrounding the reference conductor at least along the length of the cable, the shield conductor and the reference conductor electrically connected at ends of the probe tip, a first insulator between the signal conductor and the reference conductor along the length of the cable, a second insulator between the reference conductor and the shield conductor along the length of the cable, and high magnetic permeability material inside the shield conductor. A method of manufacturing a tip for an isolated probe having a triaxial cable includes accessing a shield conductor of the triaxial cable, inserting a high magnetic permeability material between the shield conductor and a reference conductor in the triaxial cable, electrically connecting the shield conductor to the reference conductor. A triaxial cable has a signal conductor, the signal conductor traversing a length of the cable, a reference conductor surrounding the signal conductor along the length of the cable, a shield conductor surrounding the reference conductor along the length of the cable, the shield conductor and the reference conductor electrically connected at ends of the cable, a first insulator between the signal conductor and the reference conductor along the length of the cable, a second insulator between the reference conductor and the shield conductor along the length of the cable, and high magnetic permeability material inside the shield conductor.

An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.

A non-transitory computer-readable storage medium storing a n EMI calculation program that causes at least one computer to execute a process, the process includes inputting circuit information of a first circuit to a machine learning model; acquiring an EMI value at a certain frequency of the first circuit; selecting, based on an impedance characteristic of the first circuit and the EMI value at the certain frequency, first EMI information from a plurality of pieces of EMI information in each of which an impedance characteristic of each of a plurality of circuits is associated with EMI values at a plurality of frequencies of each of the plurality of circuits; and acquiring an EMI value at another frequency different from the certain frequency of the first circuit based on the EMI value at the certain frequency and the first EMI information.

A wafer inspection system and a wafer inspection equipment thereof are provided. The wafer inspection system includes a susceptor device, probe card, and bridge module. The susceptor device includes a susceptor unit for placing a wafer under test. The probe card includes a probing portion and conducting portion. The conducting portion is disposed at the periphery of the probing portion and has a contact surface. The bridge module includes transmission units extended upward, positioned adjacent to a wafer placement area, and coupled to the susceptor unit. When the probing portion comes into contact with a testing point of the wafer, the contact surface of the conducting portion gets coupled to the transmission units to transmit a test signal to the probe card via the transmission units and conducting portion and thus form a test loop. Thus, the test loop path can be shortened and the accuracy of signal transmission and inspection can be enhanced.

A relay pogo contact first charged device model test head apparatus for relay-based contact first field induced charged device model testing has a ground plane of conductive material, a coaxial connector whose outer conductor electrically connects to the ground plane, a current-sensing element with one terminal electrically connects to the ground plane and the other terminal electrically connects to the center conductor of the coaxial connector, a switch where the first terminal electrically connects to a center conductor of the coaxial connector, and a probe with one end electrically connected to a second terminal of the switch and the other end exposed to contact external objects.