An electronic component handling apparatus handles a DUT and includes: an acquiring device that acquires current three-dimensional shape data of a DUT container having a plurality of accommodating portions each capable of accommodating the DUT; and a computer device that: calculates a first correction amount from the current three-dimensional shape data and corrects the current three-dimensional shape data based on the first correction amount; extracts, from the corrected three-dimensional shape data, at least one of a height and a slope of each of predetermined regions of the DUT container; and determines an accommodation state of the DUT based on an extraction result. The first correction amount represents at least one of a movement amount and a rotation amount in a planar direction of the current three-dimensional shape data with respect to an initial state of the DUT container set in advance.

A test apparatus for devices having fine pitches, includes a loading picker provided on one side of a loading part so as to sequentially adsorb devices to be tested, thereby putting the adsorbed devices on the upper surface of a vacuum chuck, a device alignment part, which is provided at an upper portion of a loading zone for aligning the devices, tester for testing a performance of the devices for a set time as the vacuum chuck positioned in the test position moves and comes into electrical contact with bumps of respective devices, and an unloading picker, which is provided at one side of an unloading zone so as to adsorb tested devices from the vacuum chuck, sorts the tested devices into good products and bad products, and unloads the tested devices as sorted on a tray of an unloading part.

A storage unit is used for storing a plurality of interface units. A disposition system then automatically manages interface units. A carrier is provided for accommodating an interface unit. The interface unit is configured for testing semiconductor elements in corresponding test devices. The storage unit is designed for storing a plurality of interface units, the storage unit having a plurality of compartments, each for accommodating one carrier, and each such carrier being designed to accommodate one interface unit. The storage unit comprises at least one alignment element for positionally accurate coupling of a handling device.

An inspection apparatus includes a load port area in which a carrier accommodation chamber for accommodating a carrier that receives an inspection object is disposed; an inspection area in which a plurality of probe cards are respectively disposed under a plurality of inspection devices, and in which the probe card is pressed against an electronic device of the inspection object on a chuck top to inspect the electronic device; a transfer area in which a transfer mechanism transfers the inspection object onto the chuck top; and a plurality of probe card accommodation devices disposed in at least one of the load port area or the inspection area, each probe card accommodation device being capable of accommodating the probe card, and a number of the probe card accommodation devices being equal to or greater than a number of the probe cards.

The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

In the measurement device, electrical characteristics of a component can be measured adequately even if the component size is small. In the measurement device, at least a part of the component holding section is an antistatic section made of an antistatic material. Since the surface resistance of the antistatic section is large, it is possible to measure the electrical characteristics of a component in a state where the component is held by the antistatic section. Therefore, even if the size of the component is small, scattering of the component is prevented and the electrical characteristics can be adequately measured.

An automated test equipment (ATE) includes a test interface board assembly. The test interface board includes a socket configured to provide electrical couplings from the test interface board to a device under test (DUT). The socket is further configured to accept an active thermal interposer (ATI) device while the DUT is disposed in the socket. The socket includes a plurality of spring-loaded roller retention devices configured to retain one or more devices in the socket. The ATE further includes a Z-axis interface plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the DUT into the socket and an ATI placement plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the ATI device into the socket.

A method for detecting a memory chip includes the following steps coupling a detecting circuit to a first area and a second area of the memory chip, the second area is not overlapped with the first area; inputting a first detecting signal from the detecting circuit to the first area of the memory chip; burning out a cell of the detecting circuit; and inputting a second detecting signal from the detecting circuit to the second area of the memory chip.

A test carrier that accommodates a device under test (DUT) and has a through-hole facing the DUT, including: a movable valve that: opens by suction through the through hole such that the DUT is sucked through the through hole.

A chip test carrier for carrying chips includes a circuit board, a positioning seat, a chip frame, and a pressing cover unit. The positioning seat includes upper and lower plates cooperating to clamp the circuit board therebetween. The upper plate includes a chip-mounting portion and an engaging slot. The chip frame is disposed on the chip-mounting portion, and is formed with frame slots for accommodating the chips, respectively. The cover unit includes a cover body connected pivotably to the positioning seat, an engaging member pivotably connected to the cover body and detachably engages the engaging slot, and pressing blocks connected to the cover body and pressing respectively against the chips.