The present disclosure provides for a kit-less pick and place handler which conducts thermal testing of at least one device. An exemplary handler includes a thermal soak plate, a first prime mover, a second prime mover, a test site actuator, and a test contactor. The thermal soak plate can receive devices and maintain an accurate position of the devices using a friction between the thermal soak plate and the device. The test contactor can electrically contact the device. The first prime mover can place the device on the thermal soak plate. The second prime mover can carry the device to the test contactor, hold the device during thermal testing, and move the device from the test contactor. The test site actuator can exert force on the second prime mover during thermal testing.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

An apparatus for testing a package-on-package type semiconductor package includes an upper test socket on which an upper package is mounted, the upper test socket being mounted on a pusher and connected to the lower package; a lower test socket mounted on a tester and connected to the lower package; and an adsorption pad coupled to the pusher and configured to adsorb and pressurize the lower package using a vacuum pressure, wherein the adsorption pad comprises a body part having a vacuum pressure passage formed therein; and an adsorption part having an adsorption hole corresponding to the vacuum pressure passage, and the body part is attached on a central portion of an upper surface of the adsorption part and an outer oil overflow-preventing part configured to trap silicon oil eluted from the body part is formed at an outer periphery the adsorption part.

An automated test system for testing singulated electronic components comprises a handler, comprising a plurality of handler pickers and/or spinner pickers, the handler pickers and/or spinner pickers being adapted to each pickup one electronic component, at least one processing station for processing one of the electronic components, a first carrier, a second carrier, and a test unit, for testing singulated electronic components located on a carrier. When the second plurality of electronic components on the second carrier are tested in the test unit while the second plurality of electronic components rest on the second carrier, simultaneously the first carrier is loaded with the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers and/or unloaded from the first plurality of electronic components by the plurality of handler pickers and/or spinner pickers.

A stage includes a base on which an object to be transported or tested is placed, four movable bodies configured to support the base in a manner so that the base can be raised and lowered, four driving motors, provided in correspondence with the four movable bodies, and configured to independently raise and lower the four movable bodies, respectively, four guides configured to guide the four movable bodies, respectively, and a support frame, having wall surfaces parallel to a raising and lowering direction of the base and continuous along a direction perpendicular to the raising and lowering direction of the base, and the four guides fixed to the wall surfaces.

There is provided an inspection apparatus, including: a housing having an upper surface on which an interface part for electrical connection with a probe card is provided; a first frame configured to be movable to a connection position where the first frame covers an upper portion of the interface part and to a retraction position where the first frame is retracted from the upper portion of the interface part; and a second frame configured to support a test head, arranged inside the first frame, and held by the first frame so as to be switchable between a fixed state in which the second frame is fixed to the first frame and a movable state in which the second frame is movable at least in a direction parallel to the interface part at the connection position.

An electronic component testing apparatus that tests a DUT (device under test) disposed in a carrier includes: a test head including a socket; and an electronic component handling apparatus that presses the DUT in the carrier against the socket. The socket includes: contactors disposed to correspond to terminals of the DUT that are exposed to the socket via a first opening of the carrier; and a first wall projecting toward the carrier along a pressing direction of the DUT. The electronic component handling apparatus aligns the terminals with the contactors by pressing the DUT against the socket such that a first pressing mechanism of the carrier presses the DUT against the first wall.

A wafer inspection system is provided. The wafer inspection system includes: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

A micro device under test (DUT) carrier includes a carrier main body, a pusher and a spring. The carrier main body includes a plurality of bearing stages. Each bearing stage is utilized to bear a micro DUT. The pusher, operated to move from a locking position to an opening position, includes a pusher main body and a plurality of locking elements. Each locking element corresponds to each bearing stage, and is located next to each bearing stage. The spring is utilized to send the pusher back to the locking position, so that each locking element restricts movement of each micro DUT.