An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.

A measurement system includes an optical probe array including the m-number of optical probe groups arranged, each including the n-number of optical probes, the m-number of optical signal selectors each corresponding one of the optical probe groups, and a control circuit configured to control the optical signal selectors. The respective optical signal selectors select and output one of optical signals output from the n-number of the optical probes of the corresponding optical probe groups. The measurement system causes the control circuit to control the optical signal selectors to repeat the selection of the optical signals until the optical signals output from all of the optical probes included in the respective optical probe groups are selected.

A test system for testing RF PCBs including an RF probe for interfacing an intermediate node of each RF PCB, an RF source providing an RF test signal, a reflectometer, and a test measurement system that makes a pass/fail determination of each RF PCB using a measured reflection coefficient. Each RF PCB includes an IC matching circuit and an antenna matching circuit coupled between an RFIC and an antenna, in which the intermediate RF node is between the matching circuits. The reflectometer outputs a measured reflection coefficient indicative of a comparison between a reflected RF signal and the RF test signal. The measured reflection coefficient may be corrected using error values based on a calibration procedure using a calibration kit with modified RF PCBs with known loads. The modified RF PCBs are measured with a network analyzer and the test system to calculate the error values used for production testing.

A test system for testing RF PCBs including an RF probe for interfacing an intermediate node of each RF PCB, an RF source providing an RF test signal, a reflectometer, and a test measurement system that makes a pass/fail determination of each RF PCB using a measured reflection coefficient. Each RF PCB includes an IC matching circuit and an antenna matching circuit coupled between an RFIC and an antenna, in which the intermediate RF node is between the matching circuits. The reflectometer outputs a measured reflection coefficient indicative of a comparison between a reflected RF signal and the RF test signal. The measured reflection coefficient may be corrected using error values based on a calibration procedure using a calibration kit with modified RF PCBs with known loads. The modified RF PCBs are measured with a network analyzer and the test system to calculate the error values used for production testing.

An example system includes a receptacle to house a device under test (DUT); an antenna for exchanging signals with the DUT, where at least some of the signals are for use in performing radiated testing of the DUT; and a cap configured to mate to the receptacle to form a housing to enclose the DUT. The housing is for isolating the DUT at least one of physically or electromagnetically.

A measurement system and method for over the air multiple antennas measurements are provided. The measurement system comprises, inside an anechoic chamber, a device under test, several measurement antennas, several mirrors and at least one shaped reflector. The measurement antennas are placed pointing at the shaped reflector. Each of the mirrors is placed along fields reflected by the shaped reflector. The mirrors reflect fields that form different angles of arrival at the device under test.

A measurement system and method for over the air multiple antennas measurements are provided. The measurement system comprises, inside an anechoic chamber, a device under test, several measurement antennas, several mirrors and at least one shaped reflector. The measurement antennas are placed pointing at the shaped reflector. Each of the mirrors is placed along fields reflected by the shaped reflector. The mirrors reflect fields that form different angles of arrival at the device under test.

An IC that includes a contiguous standard cell area with a 43 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.