Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.

A system for inspection of electrical circuits, which electrical circuits include a multiplicity of conductors which are mutually spaced from each other, the system including a voltage driver operative to apply different electrical voltages to a plurality of conductors from among the multiplicity of conductors, which plurality of conductors are in spatial propinquity to each other, a sensor operative to sense at least one characteristic of a test region defined thereby with respect to the electrical circuits, the sensor lacking sufficient spatial resolution to distinguish between the locations of individual ones of the plurality of conductors and a defect indicator responsive to at least one output of the sensor for ascertaining whether a defect exists in the plurality of conductors.

Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.

A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

An inspection apparatus according to one embodiment of the present disclosure is configured to inspect an inspection object seated on a jig, the jig capable of being introduced into and withdrawn from the inspection apparatus. The inspection apparatus includes: a mover configured to move the jig; and a clamping driver configured to contact and press the jig, the clamping driver including a pressing portion configured to be movable in a clamping direction and an unclamping direction opposite to the clamping direction.

A method for detecting damage of a solder joint of a printed circuit board of an electronic product by using a device for detecting damage of an electronic product according to the present invention includes: generating a digital signal and applying the digital signal to the solder joint of the printed circuit board; measuring a signal transmitted through the solder joint of the printed circuit board; and determining whether the solder joint of the printed circuit board is damaged using the measured signal. Accordingly, the device for detecting damage of an electronic product according to the present invention can nondestructively examine damage of the electronic product by using the digital signal.

A method for detecting damage of a solder joint of a printed circuit board of an electronic product by using a device for detecting damage of an electronic product according to the present invention includes: generating a digital signal and applying the digital signal to the solder joint of the printed circuit board; measuring a signal transmitted through the solder joint of the printed circuit board; and determining whether the solder joint of the printed circuit board is damaged using the measured signal. Accordingly, the device for detecting damage of an electronic product according to the present invention can nondestructively examine damage of the electronic product by using the digital signal.

An interconnect circuit testing apparatus including: an electric signal generating circuit for generating an electric signal; a first electrode arranged at a first region of a substrate, wherein the substrate includes an interconnect circuit, an upper surface and a lower surface; a second electrode arranged at a second region of the substrate; and a sensor for detecting an electric field emitted from the first region or the second region when the electric signal is applied to the substrate through the first electrode and the second electrode.

A directional pulse injection system and method are described for injecting a pulse into a microelectronic system for electrostatic test. One example has a transformer coupled to a pulse source through a transmission line and to a conductive trace of a test board to apply the electrical pulse to the trace as a test pulse. The test board is connected to a microelectronic device under test. This example also has a cancellation pulse transmission line coupled to the pulse source and a cancellation pulse contact coupled to the pulse source through the cancellation pulse transmission line and to the trace on a side of the trace opposite the transformer to receive a cancellation signal from the pulse source and to couple the cancellation signal to the trace to cancel a portion of the test pulse.