A system for determining a mounting state of a plurality of pins protruding from a mounting surface of an insulating housing of an electrical connector comprises an image capturing device and an identifying device. The image capturing device is adapted to capture an image of a detected pin of the plurality of pins of the electrical connector. The image capturing device captures the image in a capturing direction which is at an acute angle with respect to an extending direction of an ideal pin protruding perpendicularly from the mounting surface. The identifying device is adapted to identify whether or not the detected pin in the image is within a predetermined region of the image. The identifying device determines the mounting state of the detected pin as unqualified when the detected pin in the captured image extends beyond the predetermined region.

A system for determining a mounting state of a plurality of pins protruding from a mounting surface of an insulating housing of an electrical connector comprises an image capturing device and an identifying device. The image capturing device is adapted to capture an image of a detected pin of the plurality of pins of the electrical connector. The image capturing device captures the image in a capturing direction which is at an acute angle with respect to an extending direction of an ideal pin protruding perpendicularly from the mounting surface. The identifying device is adapted to identify whether or not the detected pin in the image is within a predetermined region of the image. The identifying device determines the mounting state of the detected pin as unqualified when the detected pin in the captured image extends beyond the predetermined region.

A method for detecting damage of a solder joint of a printed circuit board of an electronic product by using a device for detecting damage of an electronic product according to the present invention includes: generating a digital signal and applying the digital signal to the solder joint of the printed circuit board; measuring a signal transmitted through the solder joint of the printed circuit board; and determining whether the solder joint of the printed circuit board is damaged using the measured signal. Accordingly, the device for detecting damage of an electronic product according to the present invention can nondestructively examine damage of the electronic product by using the digital signal.

A method for detecting damage of a solder joint of a printed circuit board of an electronic product by using a device for detecting damage of an electronic product according to the present invention includes: generating a digital signal and applying the digital signal to the solder joint of the printed circuit board; measuring a signal transmitted through the solder joint of the printed circuit board; and determining whether the solder joint of the printed circuit board is damaged using the measured signal. Accordingly, the device for detecting damage of an electronic product according to the present invention can nondestructively examine damage of the electronic product by using the digital signal.

Disclosed are a flexible printed circuit and a detecting device, a detecting method and a display device thereof. The flexible printed circuit comprises a body and an interface structure that is connected with the body, wherein the interface structure is provided with a plurality of mark lines dividing the interface structure into a plurality of interfaces with the same structure. When a front end interface of the flexible printed circuit of the disclosure is damaged, the front end interface can be removed along the mark line, and then an exposed rear end interface can be used successively, thus preventing a situation where the flexible printed circuit cannot be used because the only interface is damaged, thereby extending the life span of the flexible printed circuit, reducing productivity loss due to frequent replacements of the flexible printed circuit and reducing production cost.

A display panel, a display device and an inspection method are provided. The display panel comprises a plurality of scanning lines, a plurality of data lines including a plurality of first-type data lines and a plurality of second-type data lines, and a plurality of sub-pixels arranged in an array. The second-type data lines are closer to a center of the display panel than the first-type data lines along a first direction. The first-type data line is connected to at least one second-type data line, and the connected first-type data line and the at least one second-type data line are connected to the sub-pixels having a same color in a same sub-pixel row, respectively. The first-type data line receives a voltage signal from an external circuit, and the at least one second-type data line receives the voltage signal from the connected first-type data line.

A test system and method for identifying open and shorted connections on a printed circuit board (PCB). An integrated circuit (IC) unit on the PCB is configured to generate a test signal on an output pin connected to a test pin on a second device, connector, or socket on the PCB. For a connection, the test signal is capacitively coupled to a detector plate proximal the second device. Based on the signal coupled to the detector, time domain analysis is performed on the coupled signal to determine if the test pin has a good connection to the PCB or if the pin is open or shorted. Analysis may include cross-correlating the coupled signal with a learned signal obtained from a known good PCB. The test pin may pass the test if the cross-correlation is within a specified threshold window. If the test fails, additional tests may be performed to troubleshoot the cause of the testing failure.