An inspection apparatus for inspecting a backside irradiation type imaging device formed on an inspection object includes: a stage on which the inspection object is mounted such that the stage faces a rear surface of the backside irradiation type imaging device, wherein the stage includes: a transmitter including a flat plate formed of a light transmitting material, and configured to mount the inspection object on the transmitter; and a light emitter disposed at a location facing the inspection object with the transmitter interposed between the light emitter and the inspection object, and configured to emit light toward the transmitter, and wherein the transmitter transmits the light from the light emitter while diffusing the light.

An inspection apparatus for inspecting a backside irradiation type imaging device formed on an inspection object includes: a stage on which the inspection object is mounted such that the stage faces a rear surface of the backside irradiation type imaging device, wherein the stage includes: a transmitter including a flat plate formed of a light transmitting material, and configured to mount the inspection object on the transmitter; and a light emitter disposed at a location facing the inspection object with the transmitter interposed between the light emitter and the inspection object, and configured to emit light toward the transmitter, and wherein the transmitter transmits the light from the light emitter while diffusing the light.

A layer arrangement for a phased array antenna comprises phase shifting units arranged between stacked dielectric layers with a tunable dielectric material sandwiched in-between. Each phase shifting unit comprises a transmission line with phase shifting capabilities that is electrically connected with bias lines to a biasing circuit. A dielectric layer is made from an optically transparent material. An overlapping section of the bias lines of each of the phase shifting units is made from an optically transparent and electroconductive material. The tunable dielectric material affects the transmission or reflection of light that illuminates the tunable dielectric material depending on the respective tuning state. Testing this layer arrangement comprises illuminating the layer arrangement by light while a predetermined electric bias potential is applied to at least some of the phase shifting units, and during which the light emission from the layer arrangement is detected and compared with an expected light emission.

A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

An apparatus for providing a test signal from a device under test (DUT) to a measurement instrument is disclosed. The apparatus includes a probe head configured to receive an electrical signal from the DUT. The probe head includes an electro-optic modulator. The apparatus also includes a control box, which includes an optical source. The optical source is configured to provide an input optical signal to the electro-optic modulator, which is configured to provide an output optical signal based on the electrical signal from the DUT. The control box also includes an optical bias control circuit. Only a bias control signal is provided to the electro-optic modulator.

A sensing apparatus that senses structure of electrode of electrical battery. The electrode is arranged to have layers spatially adjacent thereto that provide a waveguide region that includes a surface of the electrode that changes in structure. The sensing apparatus includes a source of Terahertz electromagnetic radiation, and a coupling arrangement that couples Terahertz electromagnetic radiation from the source into the waveguide region. The Terahertz electromagnetic radiation interacts with features present at the surface. The sensing apparatus includes detector that receives Terahertz electromagnetic radiation that is reflected and/or transmitted through the waveguide region, and processes the Terahertz electromagnetic radiation to determine temporal changes therein that are indicative of dendritic growths occurring at the surface of the electrode or any manufacturing or structural faults.

A sensing apparatus that senses structure of electrode of electrical battery. The electrode is arranged to have layers spatially adjacent thereto that provide a waveguide region that includes a surface of the electrode that changes in structure. The sensing apparatus includes a source of Terahertz electromagnetic radiation, and a coupling arrangement that couples Terahertz electromagnetic radiation from the source into the waveguide region. The Terahertz electromagnetic radiation interacts with features present at the surface. The sensing apparatus includes detector that receives Terahertz electromagnetic radiation that is reflected and/or transmitted through the waveguide region, and processes the Terahertz electromagnetic radiation to determine temporal changes therein that are indicative of dendritic growths occurring at the surface of the electrode or any manufacturing or structural faults.

Provided is an immunity evaluation system that enables design feedback in consideration of a subject wiring and an improvement amount for improving an electromagnetic noise resistance of a circuit board. An immunity evaluation device includes: a storage unit configured to store characteristic data including probe-circuit board wiring coupling characteristics which are determined by a combination of a near-field probe and circuit board characteristics, and a test result; and an IC reaching signal level estimation unit configured to estimate a signal level reaching a terminal of an evaluation target IC. The immunity evaluation device receives board design information, information of the near-field probe, and test waveform instruction information of a signal applied to the near-field probe. The IC reaching signal level estimation unit reads the coupling characteristics from the storage unit based on the board design information of a test subject circuit board and the information of the near-field probe, and outputs a value of the IC reaching signal level reaching a terminal of the evaluation target IC from the board design information of the test subject circuit board, the information of the near-field probe, and the coupling characteristics.

An inspection apparatus including an illumination light source, a sensing probe and a processing device is provided. The illumination light source emits an illumination beam to simultaneously irradiate the plurality of light-emitting diode. The sensing probe is configured to measure a charge distribution, an electric field distribution, or a voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. The processing device determines a plurality of electro-optical characteristics of the plurality of light-emitting diodes through the charge distribution, the electric field distribution, or the voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. Moreover, a method of for inspecting light-emitting diodes is also provided.

An integrated metrology system for evaluating semiconductor wafers, the metrology system comprises a main body that has a rear side and a front side; the front side defines a front border of the main body; one or more detachable supporting units that are detachably coupled to the main body and support the main body while extending outside the front border; and at least one auxiliary supporting unit that is configured to support the main body at an absence of the one or more detachable supporting units