An optical probe includes a first region and a second region connected to have a continuous optical waveguide in which a transmission mode is a single mode. The first region connected to a tip-end surface opposed to an optical device includes a region in which a mode field diameter that is maximum at the tip-end surface is gradually decreased toward a boundary between the first region and the second region. The tip-end surface is a curved surface and has a radius of curvature set so that an advancing direction of an optical signal entering through the tip-end surface approximates in parallel to a central-axis direction of the optical waveguide.

An inspection apparatus includes a stage on which a substrate is placed, a cooler, a probe card, a light irradiator and a controller. The cooler cools the substrate placed on the stage. The probe card has probes to be in contact with the substrate to supply electric power. The light irradiator irradiates light to an upper surface of the substrate, opposite to a bottom surface of the substrate placed on the stage. Further, the controller controls the light irradiator.

An inspection apparatus includes a stage on which a substrate is placed, a cooler, a probe card, a light irradiator and a controller. The cooler cools the substrate placed on the stage. The probe card has probes to be in contact with the substrate to supply electric power. The light irradiator irradiates light to an upper surface of the substrate, opposite to a bottom surface of the substrate placed on the stage. Further, the controller controls the light irradiator.

A reflectometer for allowing a test of a device. The reflectometer comprises a source of pulsed radiation, a first photoconductive element configured to output a pulse in response to irradiation from the pulsed source, a second photoconductive element configured to receive a pulse, a transmission line arrangement configured to direct the pulse from the first photoconductive element to the device under test and to direct the pulse reflected from the device under test to the second photoconductive element, and a termination resistance provided for the transmission line configured to match the impedance of the transmission line.

A defect detection system comprising of an incoherent light source and a collimating light source attachment to produce spatially coherent light waves (e.g., X-rays) that are capable of deeply penetrating a device under test (e.g., a semiconductor). Changes in the spatial coherency of the light waves incident upon the device under test may be utilized to generate one or more electronic maps that indicate one or more defects within the device under test, such as, cracks, gaps, and/or air pockets within the device under test.

A reflectometer for allowing a test of a device, the reflectometer comprising: a source of pulsed radiation; a first photoconductive element configured to output a pulse in response to irradiation from the pulsed source; a second photoconductive element configured to receive a pulse; and a transmission line arrangement configured to direct the pulse from the first photoconductive element to the device under test and to direct the pulse reflected from the device under test to the second photoconductive element. At least one of the first and second photoconductive elements is provided on a different substrate to that of the transmission line arrangement.

A reflectometer for allowing a test of a device, the reflectometer comprising: a source of pulsed radiation; a first photoconductive element configured to output a pulse in response to irradiation from the pulsed source; a second photoconductive element configured to receive a pulse; and a transmission line arrangement configured to direct the pulse from the first photoconductive element to the device under test and to direct the pulse reflected from the device under test to the second photoconductive element. At least one of the first and second photoconductive elements is provided on a different substrate to that of the transmission line arrangement.

A system including a modulator, a laser source, a mirror, a laser sensor, and a processor. The modulator is movable in a first direction. The laser source is configured to emit laser light in a direction parallel to the surface of the modulator. The mirror is configured to redirect the laser light. The laser sensor is configured to detect a first change in intensity when a particle on the surface of the modulator passes through the laser light emitted by the laser source. The laser sensor is further configured to detect a second change in intensity when the particle on the surface of the modulator passes through the laser light redirected by the at least one mirror. The processor is configured to determine an X-Y location of the particle based on the first change in intensity and the second change in intensity.

A system including a modulator, a laser source, a mirror, a laser sensor, and a processor. The modulator is movable in a first direction. The laser source is configured to emit laser light in a direction parallel to the surface of the modulator. The mirror is configured to redirect the laser light. The laser sensor is configured to detect a first change in intensity when a particle on the surface of the modulator passes through the laser light emitted by the laser source. The laser sensor is further configured to detect a second change in intensity when the particle on the surface of the modulator passes through the laser light redirected by the at least one mirror. The processor is configured to determine an X-Y location of the particle based on the first change in intensity and the second change in intensity.

A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.