A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.

Systems and methods are provided for testing a threshold energy required to cause a latchup on an electronic component. An exemplary method includes applying a series of laser pulses to a testing object with a pulsed laser unit. The testing object is connected to a testing circuit which can measure the energy of each of the series of laser pulses, and detect whether a pulse of the series of laser pulses resulted in a latchup on the testing object. Upon detecting the pulse, the method provides for logging the energy of the pulse using a recording unit and logging the latchup status of the test device. If a latchup is detected, the testing circuit automatically mitigates the latchup event.

A method for measuring performance of at least one DUT in a reverberation chamber over a frequency band, the method including, iteratively: generating a fading scenario by the reverberation chamber; identifying at least one measurement sub-band included in the frequency band, wherein the at least one measurement sub-band complies with a gain flatness criterion; measuring performance of the at least one DUT in the at least one identified measurement sub-band, thereby generating at least one performance measurement result; accumulating the at least one performance measurement result; and determining measurement coverage and terminating the performance measurement in case the measurement coverage meets a coverage criterion.

Described are various configurations for performing efficient optical and electrical testing of an opto-electrical device using a compact opto-electrical probe. The compact opto-electrical probe can include electrical contacts arranged for a given electrical contact layout of the opto-electrical device, and optical interface with a window in a probe core that transmits light from the opto-electrical device. An adjustable optical coupler of the probe can be mechanically positioned to receive light from the device's emitter to perform simultaneous optical and electrical analysis of the device.

Various approaches can be used to interrogate a surface such as a surface of a layered semiconductor structure on a semiconductor wafer. Certain approaches employ Second Harmonic Generation and in some cases may utilize pump and probe radiation. Other approaches involve determining current flow from a sample illuminated with radiation. Decay constants can be measured to provide information regarding the sample. Additionally, electric and/or magnetic field biases can be applied to the sample to provide additional information.

Various approaches can be used to interrogate a surface such as a surface of a layered semiconductor structure on a semiconductor wafer. Certain approaches employ Second Harmonic Generation and in some cases may utilize pump and probe radiation. Other approaches involve determining current flow from a sample illuminated with radiation. Decay constants can be measured to provide information regarding the sample. Additionally, electric and/or magnetic field biases can be applied to the sample to provide additional information.

Systems and methods are provided for testing a threshold energy required to cause a latchup on an electronic component. An exemplary method includes applying a series of laser pulses to a testing object with a pulsed laser unit. The testing object is connected to a testing circuit which can measure the energy of each of the series of laser pulses, and detect whether a pulse of the series of laser pulses resulted in a latchup on the testing object. Upon detecting the pulse, the method provides for logging the energy of the pulse using a recording unit and logging the latchup status of the test device. If a latchup is detected, the testing circuit automatically mitigates the latchup event.

The present disclosure relates to non-destructive methods for collecting data from three-dimensional objects. Method include directing one or more interrogating beams of light towards a surface of a three-dimensional object, where the three-dimensional object includes one or more underlying surfaces, and one or more materials having excitonic properties are disposed on the surface of the three-dimensional object; capturing, using an imaging device, optic response of the one or more materials having excitonic properties to the one or more interrogation beams; and computing, using the imaging device, a distance between the one or more underlying surfaces and the one or more materials having excitonic properties, where the optic response of the one or more materials having excitonic properties is a function of the distance between the one or more materials having excitonic properties and the one or more underlying surfaces.

The present disclosure relates to non-destructive methods for collecting data from three-dimensional objects. Method include directing one or more interrogating beams of light towards a surface of a three-dimensional object, where the three-dimensional object includes one or more underlying surfaces, and one or more materials having excitonic properties are disposed on the surface of the three-dimensional object; capturing, using an imaging device, optic response of the one or more materials having excitonic properties to the one or more interrogation beams; and computing, using the imaging device, a distance between the one or more underlying surfaces and the one or more materials having excitonic properties, where the optic response of the one or more materials having excitonic properties is a function of the distance between the one or more materials having excitonic properties and the one or more underlying surfaces.

An electronic component handler includes a tray having a pocket in which an IC device is placed, and a first device transport head that holds and transports the IC device to the pocket, wherein the first device transport head includes a light emitting portion that emits a light to the pocket, a light focusing portion that adjusts a spot diameter of the light emitted by the light emitting portion, and a light receiving portion that receives the light reflected by the pocket.