During frequency detection, a constant current source outputs an output current to charge a variable capacitor for multi-period. In a calibration mode, according to a comparison result between a cross voltage of the variable capacitor and a reference voltage, a capacitance value of the variable capacitor is adjusted. In a monitor mode, according to a reference frequency and the cross voltage of the variable capacitor, a frequency under test of a circuit under test is detected.

The invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as to a test probe equipped with such a test needle and to a flying probe tester for testing printed circuit boards equipped with such a test needle or such a test probe. The test needle has a capacitive measuring body, which is connected via a cable to a capacitive measuring device. The cable is shielded so that only the capacitive measuring body can form a capacitive coupling with other electrically conductive bodies. This makes it possible to determine this capacitive coupling with a high local resolution.

The invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as to a test probe equipped with such a test needle and to a flying probe tester for testing printed circuit boards equipped with such a test needle or such a test probe. The test needle has a capacitive measuring body, which is connected via a cable to a capacitive measuring device. The cable is shielded so that only the capacitive measuring body can form a capacitive coupling with other electrically conductive bodies. This makes it possible to determine this capacitive coupling with a high local resolution.

Arrangements and techniques for testing mobile devices within a test module. The test modules are portable and may be stacked to provide a modular testing system. A pulley system may be used to move an actuator arm horizontally in the X and Y directions. The actuator arm may be moved vertically in the Z direction such that a tip may engage a touchscreen of a mobile device being tested or a user interface element of the mobile device.

Arrangements and techniques for testing mobile devices within a test module. The test modules are portable and may be stacked to provide a modular testing system. A pulley system may be used to move an actuator arm horizontally in the X and Y directions. The actuator arm may be moved vertically in the Z direction such that a tip may engage a touchscreen of a mobile device being tested or a user interface element of the mobile device.

A system and method for die crack detection in a CMOS bonded array includes a capacitor that is formed in an edge seal, where one of the capacitor plates is in the edge seal portion of a first wafer, and the other capacitor plate is in the edge seal portion of a second wafer. A crack in the die can be detected by applying an alternating current waveform to a testing contact on the integrated circuit and monitoring for a shift in the alternating current waveform, as a crack would cause modulation in the capacitance.

A system and method for die crack detection in a CMOS bonded array includes a capacitor that is formed in an edge seal, where one of the capacitor plates is in the edge seal portion of a first wafer, and the other capacitor plate is in the edge seal portion of a second wafer. A crack in the die can be detected by applying an alternating current waveform to a testing contact on the integrated circuit and monitoring for a shift in the alternating current waveform, as a crack would cause modulation in the capacitance.

A system and method for die crack detection in a CMOS bonded array includes a capacitor that is formed in an edge seal, where one of the capacitor plates is in the edge seal portion of a first wafer, and the other capacitor plate is in the edge seal portion of a second wafer. A crack in the die can be detected by applying an alternating current waveform to a testing contact on the integrated circuit and monitoring for a shift in the alternating current waveform, as a crack would cause modulation in the capacitance.

A system and method for die crack detection in a CMOS bonded array includes a capacitor that is formed in an edge seal, where one of the capacitor plates is in the edge seal portion of a first wafer, and the other capacitor plate is in the edge seal portion of a second wafer. A crack in the die can be detected by applying an alternating current waveform to a testing contact on the integrated circuit and monitoring for a shift in the alternating current waveform, as a crack would cause modulation in the capacitance.

A device and method to test microelectronic parts to determine whether the parts are compromised by active illumination in a testing fixture by analysis of emission metrics.