A sensor probe. The probe includes a central loop and a plurality of peripheral loops disposed peripherally relative to the central loop. To maximize far-field suppression, current flows in a first direction through the central loop and in a second direction through each one of the plurality of peripheral loops, the first direction opposite to the second direction, and current through the central loop equals current through the plurality of peripheral loops.

A sensor probe. The probe includes a central loop and a plurality of peripheral loops disposed peripherally relative to the central loop. To maximize far-field suppression, current flows in a first direction through the central loop and in a second direction through each one of the plurality of peripheral loops, the first direction opposite to the second direction, and current through the central loop equals current through the plurality of peripheral loops.

A testing probe apparatus for testing die. The testing probe may include a probe interface and a carrier for supporting at least one die comprising 3D interconnect (3DI) structures. The probe interface may be positionable on a first side of the at least one die and include a voltage source and at least one first inductor operably coupled to the voltage source. A voltage sensor and at least one second inductor coupled to the voltage sensor may be disposed on a second opposing side of the at least one die. The voltage source of the probe interface may be configured to inductively cause a voltage within the 3DI structures of the at least one die via the at least one first inductor. The voltage sensor may be configured to sense a voltage within the at least one 3DI structure via the at least one second inductor. Related systems and methods are also disclosed.

A sensor probe. The probe includes a central loop and a plurality of peripheral loops disposed peripherally relative to the central loop. To maximize far-field suppression, current flows in a first direction through the central loop and in a second direction through each one of the plurality of peripheral loops, the first direction opposite to the second direction, and current through the central loop equals current through the plurality of peripheral loops.

A sensor probe. The probe includes a central loop and a plurality of peripheral loops disposed peripherally relative to the central loop. To maximize far-field suppression, current flows in a first direction through the central loop and in a second direction through each one of the plurality of peripheral loops, the first direction opposite to the second direction, and current through the central loop equals current through the plurality of peripheral loops.

A current sensor includes a bus bar in which a current to be detected flows, a circuit board mounted with a magnetic detection element thereon to detect a strength of a magnetic field generated by a current flowing in the bus bar, and a housing including first and second housings provided in such a manner as to sandwich the bus bar and the circuit board therebetween in a plate thickness direction of the bus bar. The first and second housings include slide guide portions respectively which are relatively slidable in a sloping direction with respect to the plate thickness direction of the bus bar while abutting each other in the plate thickness direction of the bus bar.

A current sensor includes a bus bar in which a current to be detected flows, a circuit board mounted with a magnetic detection element thereon to detect a strength of a magnetic field generated by a current flowing in the bus bar, and a housing including first and second housings provided in such a manner as to sandwich the bus bar and the circuit board therebetween in a plate thickness direction of the bus bar. The first and second housings include slide guide portions respectively which are relatively slidable in a sloping direction with respect to the plate thickness direction of the bus bar while abutting each other in the plate thickness direction of the bus bar.

A pad forms a connection terminal suitable for coupling circuit elements integrated in a chip to circuits outside the chip itself. At least one inductor is provided for use in the reception/transmission of electromagnetic waves or for supplying the chip with power or both. The connection pad and inductor are combined in a structure which reduces overall occupied area. A magnetic containment structure surrounds the structure to contain a magnetic field of the inductor.

A testing probe apparatus for testing die. The testing probe may include a probe interface and a carrier for supporting at least one die comprising 3D interconnect (3DI) structures. The probe interface may be positionable on a first side of the at least one die and include a voltage source and at least one first inductor operably coupled to the voltage source. A voltage sensor and at least one second inductor coupled to the voltage sensor may be disposed on a second opposing side of the at least one die. The voltage source of the probe interface may be configured to inductively cause a voltage within the 3DI structures of the at least one die via the at least one first inductor. The voltage sensor may be configured to sense a voltage within the at least one 3DI structure via the at least one second inductor. Related systems and methods are also disclosed.

A method wherein faults are detected by measuring electromagnetic emission from a device under test which is placed into different operating states. Electromagnetic emission signals are measured from the device for each operating state by obtaining a time-domain result. The measured signals are processed by digitizing and converting the signal from time-domain into frequency domain. The result is compared with a result of a non-fault device. A fault is detected if there is a sufficient difference between the compared results. The system includes one or more inductive sensors and one or more amplifiers. A digital processing unit in the system includes an analog-to-digital converter for digitizing measured signals, an analyzer for transforming the digital signals into frequency components, a comparator for comparing the frequency components to those of a non-fault device, and a memory for storing the measurement results.