An electronic assembly has a host wafer having a first circuit including wafer transistors and passive, non-transistor devices. Chiplets have a second circuit including at least one radio frequency (RF) transistor device. Electrical interconnects are between the chiplets and wafer. The electrical interconnects electrically connect the first circuit to the second circuits. Oscillators that have the wafer transistor, the RF transistor and the electrical interconnects produce a signal for built-in self-test circuits for testing an assembly design of the electronic assembly and speeds of the RF chiplet transistors.

An electronic assembly has a host wafer having a first circuit including wafer transistors and passive, non-transistor devices. Chiplets have a second circuit including at least one radio frequency (RF) transistor device. Electrical interconnects are between the chiplets and wafer. The electrical interconnects electrically connect the first circuit to the second circuits. Oscillators that have the wafer transistor, the RF transistor and the electrical interconnects produce a signal for built-in self-test circuits for testing an assembly design of the electronic assembly and speeds of the RF chiplet transistors.

Systems and methods for circuit fault diagnosis are provided. An original circuit design is evaluated to determine whether the original circuit design is to be modified based at least in part on one or more first faults. In response to the original circuit design being determined not to be modified based at least in part on the one or more first faults, a first test pattern set is automatically generated based at least in part on the original circuit design. The original circuit design is evaluated to determine whether the original circuit design is to be modified based at least in part on the first test pattern set. In response to the original circuit design being determined not to be modified based at least in part on the first test pattern set, fault testing is performed to determine whether the original circuit design fails.

Embodiments include methods, and processing system, and computer program products providing portion isolation design to a chip design to facilitate partial-good portion isolation test of the chip. Aspects include: retrieving a chip design file of a chip, the chip design file having pin related information from a chip design database, generating, via a pin group utility module, a pin group file according to the pin related information retrieved, combining, via a portion wrapper insertion utility module, the pin group file with one or more portion netlists to form one or more localized portion wrapper segments, stitching, via the portion wrapper insertion utility module, the one or more localized portion wrapper segments to form a portion boundary wrapper chain, and inserting, via the portion wrapper insertion utility module, the portion boundary wrapper chain into the chip design file to facilitate partial-good portion isolation test.

Systems and methods disclosed herein provide for automatically diagnosing mis-compares detected during simulation of Automatic Test Pattern Generation (ATPG) generated test patterns. Embodiments of the systems and methods provide for determining the origin of a mis-compare based on an analysis of the generated test patterns with a structural simulator and a behavioral simulator.

A semiconductor chip, including an Intellectual Property (IP) core; and a signal forcing circuit located within the IP core, or located at a boundary of the IP core coupling the IP core with another IP core, the signal forcing circuit configured to: transmit an input signal received by the IP core as an output signal; and in response to a trigger condition, forcing an override signal as the output signal.

This application discloses a computing system implementing a schematic capture tool to utilize physical test capabilities of a manufacturer of a printed circuit board assembly during generation of a logical design for the printed circuit board assembly. The schematic capture tool can utilize the physical test capabilities of the manufacturer to trim a list of parts representing electronic components available for use in the printed circuit board assembly, and generate the logical design for the printed circuit board assembly utilized the trimmed list of parts. The schematic capture tool can utilize the physical test capabilities of the manufacturer to determine which nets in the logical design to assign test points. The schematic capture tool can provide an indication of the assigned test points to a layout tool, which can include the test points in a layout design for the printed circuit board assembly based on the assignment.

A method and a system for verifying an integrated circuit stack having at least one silicon photonic device is introduced. A dummy layer and a dummy layer text are added to a terminal of at least one silicon photonic device of the integrated circuit. The method may perform a layout versus schematic check of the integrated circuit including the dummy layer and the dummy layer text.

According to one general aspect, an apparatus may include an interconnect bus, an interconnect-to-debug bus interface, and a debug bus. The interconnect bus may be configured to connect and manage combinatorial logical blocks during normal operation of a processor and operate synchronous to a core clock. The interconnect-to-debug bus interface may be configured to translate communications between the interconnect bus and the debug bus. The debug bus may include a plurality of debug wrapper circuits arranged in a daisy chain for unidirectional communication, and configured to operate synchronous to the core clock. Each of the plurality of debug wrapper circuits may be configured to: identify if the respective debug wrapper circuit is activated by the debug bus, receive a non-invasive input from a respective combinatorial logic block, and place the non-invasive input from the respective combinatorial logic block on the debug bus.

A computer-implemented method for automated generation of test layouts for verifying a DRC deck. The method comprises receiving a first layout (L1) comprising one or more polygon shapes (P1) defined by a plurality of polygon parameters (W1,H1). Design rules (R1,R2) are received comprising inequality constraints (C) on the polygon parameters (W1,H1). A second lay-out (L2) is calculated by applying a random change (W12) of value to at least one of the polygon parameters (W1) of the first layout (L1). A third layout (L3) is calculated by varying values of the polygon parameters (W1,H1) of the second layout (L2) until a respective slack (S1,S2) of the polygon parameters (W1,H1) with respect to one or more of the parameter boundaries (B1,B2) defined by the constraints is minimized The third layout (L3) may be stored as candidate test layout.